Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 7740936 | Adhesion assisting agent fitted metal foil, and printed wiring board using thereof Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer i... | 06/22/2010 |
| 7629045 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm.... | 12/08/2009 |
| 7488531 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm.... | 02/10/2009 |
| 7410551 | Method of hot marking, and a multilayer structure for implementing such a method The invention relates to a hot marking method enabling decoration to be made on an article, the method comprising the steps consisting in: supplying a multilayer structure comprising a layer of varnish that hardens under the effect... | 08/12/2008 |
| 7404994 | Lidstock material having improved burst strength A lidstock material suitable for sealing plastic containers that are retorted at elevated temperatures to sterilize their contents. The lidstock material comprises a substrate joined to a film comprising a mixture of a butene-1 polymer; high density polyethylene; po... | 07/29/2008 |
| 7399526 | Printing blanket and method for reducing corrosion and abrasion of printing blankets and blanket cylinders A printing blanket and method of reducing corrosion and abrasion of printing blankets and printing blanket cylinders is provided. The printing blanket includes a metal base ply having first and second surfaces, a surface layer on the first surface of the base ply, a... | 07/15/2008 |
| 7358189 | Copper clad laminate To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thi... | 04/15/2008 |
| 7352191 | Sensor assembly and method of forming the same A sensor assembly includes a sensing element electrically connected to a conductor of a flexible multiconductor cable using a conductive patch, which is electrically connected to the conductor. A method of forming a sensor assembly includes electrically connecting a... | 04/01/2008 |
| 7348057 | Acrylic adhesive sheet An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing... | 03/25/2008 |
| 7329446 | Drill stack formation The present invention provides a structure. The structure includes a stack of sheets. Successive sheets in each pair of successive sheets of the stack are coupled to each other by a removable adhesive. The removable adhesive is also disposed on top and bottom surfac... | 02/12/2008 |
| 7326460 | Device, method of manufacturing the same, electro-optic device, and electronic equipment A first conductive film is formed on a wiring pattern area on a plate by dropping liquid drops. A second conductive film which is electrically separated from the first conductive film is formed by discharging liquid drops outside of the wiring pattern area on the pl... | 02/05/2008 |
| 7323075 | Method of contouring fabric using half-hard brass A device for shaping and contouring a fabric or the like in sewing and handicraft projects. In one configuration, the device includes a strip of solid and ductile metal that is configured to be directly adhered to a fabric surface. At lease one layer of acrylic pres... | 01/29/2008 |
| 7323239 | Protective films Multilayer protective films that adhere well to many different surfaces and can be removed without leaving residues are provided. The films consist of a polyolefin backing layer(s) and an adhering layer consisting of an ethylene unsaturated ester copolymer layer con... | 01/29/2008 |
| 7323772 | Ball grid array structures and tape-based method of manufacturing same Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape assembly equipment are disclosed. Circuitry-bearing segments having an el... | 01/29/2008 |
| 7294393 | Sheet material and wiring board In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength l... | 11/13/2007 |
| 7291380 | Laser enhanced plating for forming wiring patterns A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region. ... | 11/06/2007 |
| 7277141 | Optical bodies containing cholesteric liquid crystal material and methods of manufacture An optical body includes a substrate and a cholesteric liquid crystal layer disposed on the substrate. The cholesteric liquid crystal layer has a non-uniform pitch along a thickness direction of the layer and comprises a crosslinked polymer material that substantial... | 10/02/2007 |
| 7267870 | Pressure-sensitive adhesive sheet for steel plates A pressure-sensitive adhesive sheet for steel plates, which comprises a backing and a resin layer, wherein the backing comprises a resin-coated glass cloth obtainable by coating a glass cloth with a resin emulsion (A) followed by coating with a resin emulsion (B) wh... | 09/11/2007 |
| 7261935 | Co-extrudable multi-layer polymer The present invention provides a multi-layer polymer composition having a polar outer layer and a non-polar second outer layer. The polar outer layer is preferably PVC and the non-polar outer layer, polypropylene. The adhesive tie layer is a unique blend of a copoly... | 08/28/2007 |
| 7252881 | Multilayer structure and multilayer wiring board using the same A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical prop... | 08/07/2007 |
| 7252891 | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 08/07/2007 |
| 7238401 | Glazing element and laminate for use in the same A multi-layer optically clear laminate suited for attachment to window glass to provide a glazing element which has reduced spall and lacerative consequences on fracture impact of the window glass is provided by the invention. The laminate is comprised of at least t... | 07/03/2007 |
| 7233501 | Interleaved memory heat sink A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat s... | 06/19/2007 |
| 7223814 | Hot melt adhesives with improved performance window An adhesive composition is provided comprising at least one copolymer comprising repeating units from ethylene and at least one α-olefin, at least one tackifier resin, and at least one grafted polyolefin; wherein said adhesive composition has an onset of fiber tear... | 05/29/2007 |
| 7199369 | Low threshold level radiation detector A radiation detector of the present invention has at least one radiation measuring component and a radiation detector surface. A layer of protective covering substantially covers the radiation detector surface and protects the at least one radiation measuring compon... | 04/03/2007 |
| 7186478 | Electrochemical device An electrochemical device includes an electrochemical device having an electrochemical cell located within the sealed first enclosure. The first enclosure has at least a portion that is flexible. A cavity is formed within the first enclosure so that the cavity is in... | 03/06/2007 |
| 7182807 | Silane coatings for metal A method of treating a metal surface by application of a solution containing at least one vinyl silane and at least one bis-silyl aminosilane. A solution composition having at least one vinyl silane and at least one bis-silyl aminosilane is also provided, along with... | 02/27/2007 |
| 7183494 | Bonding structure with buffer layer and method of forming the same A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the ... | 02/27/2007 |
| 7183007 | Dicing adhesive sheet and dicing method A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 μm and the adhesive layer has an sticking temperature such that the adhesion measured when 180Â... | 02/27/2007 |
| 7172818 | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having de... | 02/06/2007 |
| 7166912 | Isolated thermal interface An isolated thermal interface is presented. The inventive interface includes a flexible graphite sheet having two major surfaces, at least one of the major surfaces coated with a protective coating sufficient to inhibit flaking of the particles of graphite. ... | 01/23/2007 |
| 7166678 | Rubber composition and vibration damper using the rubber composition A torsional vibration damper or other vibration damping device with a rubber vibration absorbing element. The rubber element is a peroxide-cured composition comprising 100 parts of ethylene-alpha-olefin elastomer, and 20 to 100 parts of substantially isobutylene or ... | 01/23/2007 |
| 7163598 | Optical waveguide and method for producing same An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board... | 01/16/2007 |
| 7161232 | Apparatus and method for miniature semiconductor packages A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent th... | 01/09/2007 |
| 7147367 | Thermal interface material with low melting alloy A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The mat... | 12/12/2006 |
| 7141768 | Fastening device A device for fastening surfaces together in an effective, efficient, and preferably reversible bond is disclosed. This device is particularly useful in the construction industry for fastening roll goods, such as wall coverings, or mill work, such as moldings, to sur... | 11/28/2006 |
| 7138172 | Metallizable white opaque films, metallized films made therefrom and labels made from the metallized films A multilayer, metallizable, white opaque film suitable for use in forming metallized plastic labels for bottles and other containers includes at least a internal core layer and opposed outer skin layers. One of the outer skin layers is a non-voided layer having a su... | 11/21/2006 |
| 7137444 | Heat-transfer interface device between a source of heat and a heat-receiving object What is proposed is a heat-transfer interface device for use in a range of up 320° C. working temperatures for transfer of heat from a source of heat to a heat-receiving object under severe conditions. The device comprises an elastomeric material filled with an ele... | 11/21/2006 |
| 7135088 | Method of producing packaging material in the form of a continuous laminate web The invention relates to a method of producing packaging material in the form of a continuous laminate web (17) and being of the type which includes a core layer (2) of paper or cardboard whose one face displays a layer (7) which is disposed out... | 11/14/2006 |
| 7132755 | Adhesive film for manufacturing semiconductor device An adhesive film for manufacturing a semiconductor device comprising a thermosetting adhesive layer and a heat-resistant backing layer, wherein the adhesive film is applied to a method for manufacturing a semiconductor device, comprising the steps of (a) embedding a... | 11/07/2006 |
