Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 8182904 | Laminated ceramic package Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The fi... | 05/22/2012 |
| 8178192 | Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate The present invention provides a ceramic green sheet with a thin flat plate shape obtained by molding and solidifying a ceramic slurry, which contains a ceramic powder, dispersion medium, and gelling agent, into a thin flat plate. The ceramic green sheet partially i... | 05/15/2012 |
| 7998559 | Super-phobic surface structures Superlyophobic Surface Structure, including a substrate having a surface; a plurality of nanoscale raised features on the substrate surface, each nanoscale raised feature having a length measured in a direction approximately perpendicular to the substrate surface, e... | 08/16/2011 |
| 7998560 | Multilayer ceramic substrate, method for producing same, and electronic component A multilayer ceramic substrate includes an inner layer portion and surface portions that sandwich the inner layer portion in the stacking direction and have an increased transverse strength because of the surface layer portion having a thermal expansion coefficient ... | 08/16/2011 |
| 7998561 | Ceramic laminate and method of manufacturing ceramic sintered body There are provided a ceramic laminate and a method of manufacturing a ceramic sintered body. A ceramic laminate according to an aspect of the invention may include: at least one ceramic sheet having first ceramic particles and glass particles; and at least one const... | 08/16/2011 |
| 7976936 | Endoprostheses Endoprostheses are disclosed. ... | 07/12/2011 |
| 7901761 | Hermetic vias utilizing metal-metal oxides The invention is a hermetic via in a ceramic substrate that is comprised of noble metal powder in a glass-free paste that contains an admixture of a particulate phase of niobium pentoxide. The electrically conductive platinum provides excellent electrical conductivi... | 03/08/2011 |
| 7887905 | Constraining green sheet and manufacturing method of multi-layer ceramic substrate using the same There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining... | 02/15/2011 |
| 7883765 | Multilayer ceramic substrate, method for producing same, and electronic component A multilayer ceramic substrate having high transverse strength, minimized warpage, and no delamination, has a laminated structure including an inner layer portion and surface layer portions, in which the thermal expansion coefficient of the surface layer portions is... | 02/08/2011 |
| 7879438 | Substrate warpage-reducing structure The subject matter disclosed herein relates to methods to reduce warpage of a substrate. ... | 02/01/2011 |
| 7799409 | Ceramic green sheet structure and method for manufacturing laminated ceramic electronic component A ceramic green sheet structure has a ceramic green sheet including at least a ceramic material and a resin and a conductive layer formed on the ceramic green sheet. An electrode non-formed area has a porosity equal to or greater than 17%, and preferably, equal to o... | 09/21/2010 |
| 7790270 | Wiring board and semiconductor device The present invention provides a wiring board which may be warped only by a reduced amount when the wiring board is thin and has wiring patterns of different shapes on the opposite surfaces thereof and which enables a thin, small, and reliable semiconductor device t... | 09/07/2010 |
| 7790271 | Dielectric ceramic composition, ceramic substrate, and method for producing the same A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, abo... | 09/07/2010 |
| 7776425 | Nanoparticle coated nanostructured surfaces for detection, catalysis and device applications A non-vacuum-based, non-collodial chemistry-based method of synthesizing metal nanoparticles and nanoparticle-nanostructured material composites obtained by that method. An embodiment of the method of this invention for fabricating a nanoparticle-nanostructured mate... | 08/17/2010 |
| 7776426 | Ceramic circuit substrate and manufacturing method thereof A ceramic circuit substrate and a manufacturing method thereof are provided, which has excellent thermal shock tolerance by forming a gap between a circuit pattern section and a ceramic substrate, and has a capability of preventing etchant residue from remaining the... | 08/17/2010 |
| 7749592 | Multilayer ceramic substrate A multilayer ceramic substrate includes a plurality of stacked glass ceramic layers and internal conductors. The glass ceramic layers contain at least one diffusion element selected from the group consisting of Ti, Zr and Mn. The internal conductors contain Ag as a ... | 07/06/2010 |
| 7744984 | Method of treating substrates for bonding A method of treating a glass substrate for bonding. The method includes providing a glass substrate having a fritted portion of a ceramic frit material and a non-fritted portion. At least a portion of the fritted portion includes a bondable surface. The method furth... | 06/29/2010 |
| 7691469 | Ceramic multilayer substrate and method for manufacturing the same A ceramic multilayer substrate exhibiting reduced pealing and breakage of an internal conductor disposed between a ceramic layer serving as a base member and a ceramic layer for restricting shrinkage includes a first ceramic layer 11, a second ceramic layer | 04/06/2010 |
| 7687137 | Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers mad... | 03/30/2010 |
| 7670672 | Multilayer ceramic substrate and method for producing same In a multilayer ceramic substrate having a cavity, base-material layers are arranged on a base side with respect to an interface between the base and a wall defining a cavity, and a constraining interlayer is arranged on the wall side. A conductive film is arranged ... | 03/02/2010 |
| 7524552 | Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the c... | 04/28/2009 |
| 7473460 | Ceramic substrate, electronic apparatus, and method for producing ceramic substrate A ceramic substrate includes a glass layer partially overlaying a conductor, and the glass layer has satisfactory adhesion to the main body of the ceramic substrate and having satisfactory plating resistance. The glass layer is arranged to extend from a portion of t... | 01/06/2009 |
| 7439202 | Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component A glass ceramic composition is used for a multilayer ceramic substrate 2 including glass ceramic layers 3 laminated, the multilayer ceramic substrate 2 being used for a multilayer ceramic module 1. The glass ceramic composition includes a... | 10/21/2008 |
| 7427435 | Coating composition for adhering metallized layers to polymeric films A metallized film and a process for making the film are disclosed. In general, the metallized film includes a polymeric film layer that is coated with a polyester coating composition. A metal layer is then formed on top of the polyester coating. The polyester coatin... | 09/23/2008 |
| 7423220 | Conductive paste for multilayer electronic components and multilayer electronic component using same A conductive paste for multilayer electronic components which is to be directly printed on a ceramic green sheet, the conductive paste contains a conductive powder, a resin and an organic solvent, wherein the organic solvent contains at least one solvent selected fr... | 09/09/2008 |
| 7417001 | Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component A glass ceramic composition for glass ceramic layers laminated in multilayer ceramic substrate included in multilayer ceramic module is provided. The glass ceramic composition contains a first ceramic powder mainly composed of forsterite, a second ceramic powder mai... | 08/26/2008 |
| 7396785 | Composition for ceramic substrate, ceramic substrate, process for producing ceramic substrate and glass composition A ceramic substrate composition is provided which can be co-fired with a low-melting metal and exhibits excellent dielectric characteristics at high frequencies, particularly tens of gigahertz. The ceramic substrate composition mainly contains a glass represented by... | 07/08/2008 |
| 7387828 | Unidirectional sheet made of a composite The invention concerns a web comprising an intimate mixture of mixed slivers of long reinforcing staple fibres (14) obtained by stretch-breaking and long thermoplastic matrix fibres (15), those different fibres being parallel in the mixture. ... | 06/17/2008 |
| 7384693 | Diamond-like carbon films with low dielectric constant and high mechanical strength The present invention discloses a method including: providing a substrate; and sequentially stacking layers of two or more diamond-like carbon (DLC) films over the substrate to form a composite dielectric film, the composite dielectric film having a k value of about... | 06/10/2008 |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper sur... | 06/10/2008 |
| 7375286 | Printed circuit board and manufacturing method thereof A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the ... | 05/20/2008 |
| 7372176 | Bulkhead flatwire integration units The electronic system generally includes an electronic panel having circuitry plated on a surface thereof as well as electronic components attached thereto. The circuitry connects the electronic components for operation of the electronic device in the engine compart... | 05/13/2008 |
| RE40301 | Zircon/zirconia mix for refractory coatings and inks Refractory coatings comprising unstabilized zirconia, silica, and, optionally, zircon and/or mullite are disclosed herein. The unstabilized zirconia, silica, and optional zircon and/or mullite are applied as a slurry onto ceramic substrates such as silicon carbide a... | 05/06/2008 |
| 7368408 | Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilic... | 05/06/2008 |
| 7365430 | Semiconductor device and method of manufacturing the same Disclosed herein is a semiconductor device and method of manufacturing the same. A step between a memory cell formed in a cell region and a transistor formed in a peripheral circuit region is minimized, and the height of a gate in the memory cell is minimized. Accor... | 04/29/2008 |
| 7366629 | High frequency module board device The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose m... | 04/29/2008 |
| 7354288 | Substrate support with clamping electrical connector A substrate support comprises a ceramic disc with an electrode that is chargeable through an electrode terminal. An electrical connector connects an external power source to the electrode terminal. The electrical connector has a pair of opposing pincer arms, a groov... | 04/08/2008 |
| 7351674 | Insulating ceramic composition, insulating ceramic sintered body, and mulitlayer ceramic electronic component An insulating ceramic composition forming insulating ceramic layers (3) stacked in a multilayer ceramic substrate (2) used in a monolithic ceramic electronic component, such as a multilayer ceramic module (1). The insulating ceramic composition ... | 04/01/2008 |
| 7347983 | Mg2MM'o 6+x, (M=Y, rare earth metal and M'=SN, OR Zr) dielectric ceramics Complex ceramic oxides of the general formula Mg2MM′O6+x where M=Rare metal ion or Yttrium or Lanthanum and M′=Sn, Sb, Zr, Hf, Ta, and Nb; and where −0.5 | 03/25/2008 |
| 7348069 | Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate A first ceramic substrate includes a substrate (2) and a glaze layer (3), wherein the glaze layer has a surface having an Ra of 0.02 μm or less and a Ry of 0.25 μm or less. A second ceramic substrate is formed by subjecting a glass layer (24) ... | 03/25/2008 |
