Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7242477 | Apparatus and methods for detecting overlay errors using scatterometry Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. A sample having a plurality of periodic targets that each have a first structure in a first layer and a second structure in a second layer is provided. The... | 07/10/2007 |
| 7240429 | Manufacturing method for a printed circuit board A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic subs... | 07/10/2007 |
| 7242092 | Substrate assembly with direct electrical connection as a semiconductor package A substrate assembly with direct electrical connection as a semiconductor package is disclosed, which includes a carrier structure formed with at least a cavity; at least a semiconductor chip received in the cavity of the carrier structure having a plurality of elec... | 07/10/2007 |
| 7239019 | Selectively converted inter-layer dielectric An inter-layer dielectric structure and method of making such structure are disclosed. A composite dielectric layer, initially comprising a porous matrix and a porogen, is formed. Subsequent to other processing treatments, the porogen is decomposed and removed from ... | 07/03/2007 |
| 7237332 | Method of manufacturing wiring board The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at ... | 07/03/2007 |
| 7235477 | Multi-layer interconnection circuit module and manufacturing method thereof The present invention is directed to a multi-layer interconnection circuit module in which plural unit wiring layers are interlayer-connected to each other through a large number of via holes so that they are laminated and formed, wherein respective unit wiring laye... | 06/26/2007 |
| 7236324 | Apparatus, method and system for fabricating servo patterns on high density patterned media An apparatus, system, and method are disclosed for utilizing a “shadow mask” approach to fabricate servo patterns on high density patterned media. The apparatus may include a deposition mask having a plurality of apertures generated by a conventional lithographi... | 06/26/2007 |
| 7235148 | Selectively roughening conductors for high frequency printed wiring boards A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfac... | 06/26/2007 |
| 7235350 | Alumina insulation for coating implantable components and other microminiature devices A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less t... | 06/26/2007 |
| 7231711 | Packaging structure of a driving circuit for a liquid crystal display device and packaging method of driving circuit for a liquid crystal display device A packaging structure of a driving circuit for a liquid crystal display device comprises a base film, a plurality of first metal lines being formed on the base film and being disposed with a certain distance between neighboring first metal lines, an insulating film ... | 06/19/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232720 | Method for fabricating a semiconductor device having an insulation film with reduced water content A semiconductor device having a self-aligned contact hole is formed by providing a side wall oxide film on a gate electrode, covering the gate electrode and the side wall oxide film by an oxide film and further covering the oxide film by a nitride film, wherein the ... | 06/19/2007 |
| 7232728 | High quality oxide on an epitaxial layer This invention improves the quality of gate oxide dielectric layers using a two-pronged approach, thus permitting the use of much thinner silicon dioxide gate dielectric layers required for lower-voltage, ultra-dense integrated circuits. In order to eliminate defect... | 06/19/2007 |
| 7233067 | Manufacturing a bump electrode with roughened face The invention includes a semiconductor device, and a method for making the same, wherein bumps of a semiconductor chip and inner leads of a film tape carrier can be securely bonded to each other by thermal welding using a heating unit. A semiconductor wafer is etche... | 06/19/2007 |
| 7229940 | Dense cordierite based sintered body and method of manufacturing the same A dense cordierite based sintered body is provided, containing at least 93% by mass of cordierite among crystal components present in the sintered body. The average particle diameter of the particles constituting the sintered body is 2 μm or less. ... | 06/12/2007 |
| 7230338 | Semiconductor device that improves electrical connection reliability A semiconductor device including: a semiconductor section in which an element is formed; an insulating layer formed on the semiconductor section; an electrode pad formed on the insulating layer; a contact section formed of a conductive material provided in a contact... | 06/12/2007 |
| 7230213 | Modular heated cover The modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection in an outdoor environment, an electrical heating element between the first and the second outer layers, the e... | 06/12/2007 |
| 7229939 | Multilayer ceramic substrate and method for manufacture thereof A multilayer ceramic substrate which is obtained by firing multilayers of ceramic green sheets each having a dielectric layer, made of a glass-ceramic material comprising a mixture of alumina and a glass containing at least Si and Ca, and an electrode layer made of ... | 06/12/2007 |
| 7230153 | Multilayer conductive appliance having wound healing and analgesic properties A dressing for promoting healing and pain relief of the body of a living organism having a pathologic condition has at least one layer of conductive material having a resistance no greater than 1000 Ω/cm2. When placed proximate a portion of the body of t... | 06/12/2007 |
| 7230187 | Printed wire board and associated mobile terminal A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive ... | 06/12/2007 |
| 7228623 | Process for fabricating a multi layer circuit assembly Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via... | 06/12/2007 |
| 7230188 | Printed wiring board and its manufacturing method The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be c... | 06/12/2007 |
| 7229293 | Connecting structure of circuit board and method for manufacturing the same First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit b... | 06/12/2007 |
| 7226653 | Printed circuit board and method for producing a printed circuit board A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Im... | 06/05/2007 |
| 7226868 | Method of etching high aspect ratio features A plasma processing system for and method of utilizing an improved etch chemistry for effectively etching high aspect ratio silicon features. The process chemistry employs precursor gases suitable for producing a fluorine/chlorine etch chemistry as well as precursor... | 06/05/2007 |
| 7227179 | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof Crosslinkable liquid crystalline polymer compositions for use as dielectric materials in circuit materials, circuits, and multi-layer circuits are disclosed. The crosslinkable liquid crystalline polymer compositions comprise crosslinkable liquid crystalline polymers... | 06/05/2007 |
| RE39676 | Flexible thin layer open electrochemical cell A flexible thin layer open liquid state electrochemical cell which can be used as a primary or rechargeable power supply for various miniaturized and portable electrically powered devices of compact design. The cell includes a wet electrolyte, yet maintains a fexibl... | 06/05/2007 |
| 7223677 | Process for fabricating a semiconductor device having an insulating layer formed over a semiconductor substrate The present invention provides a method for manufacturing a semiconductor device comprising an insulating layer that includes a seed layer formed on a silicon substrate. The seed layer is formed by exposing a hydrogen-terminated surface of the silicon substrate in a... | 05/29/2007 |
| 7224256 | Stable high temperature heater with serpentine heating strands on insulative substrate A sensor system has an AlN substrate, a W layer on the substrate, a signal source adapted to apply an electrical actuating signal to the W layer, and a sensor adapted to sense the response of the W layer. The W layer can comprise a thin film, with various types of o... | 05/29/2007 |
| 7224057 | Thermal enhance package with universal heat spreader A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat sprea... | 05/29/2007 |
| 7224046 | Multilayer wiring board incorporating carbon fibers and glass fibers A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin compo... | 05/29/2007 |
| 7222981 | EL display device and electronic device A cover member is adhered onto a substrate on which an EL element is formed with a filler as an adhesive. Further, a sealing member is provided so as to cover a side surface (an exposing surface) of the filler, and a frame member is adhered using the sealing member.... | 05/29/2007 |
| 7220686 | Process for contact opening definition for active element electrical connections A method is provided for contact opening definition for active element electrical connections. According to the method, a layer of BPSG is formed on a surface of an integrated circuit, and a transparent layer of nitride UV is formed above the layer of BPSG. Preferab... | 05/22/2007 |
| 7220490 | Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-ret... | 05/22/2007 |
| 7220550 | Molecular wire injection sensors Disclosed is a sensor for sensing the presence of an analyte component without relying on redox mediators. This sensor includes (a) a plurality of conductive polymer strands each having at least a first end and a second end and each aligned in a substantially common... | 05/22/2007 |
| 7218055 | Discharge lamp lighting apparatus The discharge lamp lighting apparatus includes a power section operating to generate a high voltage to be applied to a discharge lamp to trigger electrical discharge within the discharge lamp and to generate an AC voltage to be supplied to the discharge lamp to keep... | 05/15/2007 |
| 7217398 | Deposition reactor with precursor recycle A reactor vessel is provided with a solvent in a supercritical PVT state for use in depositing films on a deposition substrate. A metal organic precursor is dissolved in the supercritical solvent, as is a reaction agent. A chemical reaction deposits a film, such as ... | 05/15/2007 |
| 7217743 | Curable white ink A curable ink for jet-ink recording comprising a white pigment and a polymerizable compound, wherein the polymerizable compound is a compound selected from the group consisting of: (a) oxetane compounds; (b) pyrrole or substituted pyrroles; (c) aniline or substitute... | 05/15/2007 |
| 7218527 | Apparatuses and methods for forming smart labels Apparatuses and methods for forming displays are claimed. This invention relates to a display which may be conformal and which can receive information in order to alter or configure the display. In one embodiment, a flexible layer may be made to receive an array of ... | 05/15/2007 |
