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| Number | Title | Issue Date |
| 7279216 | Identifiable flexible printed circuit board and method of fabricating the same The invention discloses an identifiable flexible printed circuit board (PCB) and a method of fabricating the same. The identifiable flexible PCB includes a flexible substrate, a conductive layer, and a printing ink layer. First, the conductive layer is formed over a... | 10/09/2007 |
| 7279412 | Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without appl... | 10/09/2007 |
| 7279760 | Nanotube relay device The present invention relates to a nanotube device (100, 600), comprising a nanotube with a longitudinal and a lateral extension, a structure for supporting at least a first part of the nanotube, and first means for exerting a force upon the nanotube in a fir... | 10/09/2007 |
| 7280212 | Apparatus and methods for detecting overlay errors using scatterometry Disclosed is a method of determining an overlay error between two layers of a multiple layer sample. For each of a plurality of periodic targets that each have a first structure formed from a first layer and a second structure formed from a second layer of the sampl... | 10/09/2007 |
| 7278207 | Method of making an electronic package An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of diele... | 10/09/2007 |
| 7279217 | Multilayer ceramic device, method for manufacturing the same, and ceramic device There is provided a multilayer ceramic device enabling achievement of secure electric connection via electroconductive members in through holes and reduction in the thickness of internal electrodes during manufacturing. In multilayer piezoelectric device 1, a... | 10/09/2007 |
| 7280394 | Field effect devices having a drain controlled via a nanotube switching element Field effect devices having a drain controlled via a nanotube switching element. Under one embodiment, a field effect device includes a source region and a drain region of a first semiconductor type and a channel region disposed therebetween of a second semiconducto... | 10/09/2007 |
| 7279832 | Phosphor materials and illumination devices made therefrom This invention provides a phosphor material capable of absorbing primary light and converting that light into white light having a high color rendering index and illumination devices made from the phosphor material. The white light may have a color rendering index o... | 10/09/2007 |
| 7276987 | High frequency line-to-waveguide converter and high frequency package A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the ... | 10/02/2007 |
| 7276279 | Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by steps of drawing wiring precursor patterns containing a paste of comp... | 10/02/2007 |
| 7276292 | Insulating substrate boards for semiconductor and power modules An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the V... | 10/02/2007 |
| 7276435 | Die level metal density gradient for improved flip chip package reliability An integrated circuit has metal bumps on the top surface that create a potentially destructive stress on the underlying layers when the metal bumps are formed. Ensuring a minimum metal concentration in the underlying metal interconnect layers has been implemented to... | 10/02/2007 |
| 7274100 | Battery protection circuit with integrated passive components An integrated circuit which includes a circuit board having passive elements embedded in its body. ... | 09/25/2007 |
| 7273636 | Patterning of solid state features by direct write nanolithographic printing The present invention includes a method of fabricating organic/inorganic composite nanostructures on a substrate comprising depositing a solution having a block copolymer and an inorganic precursor on the substrate using dip pen nanolithography. The process can comp... | 09/25/2007 |
| 7273564 | Method and apparatus for fabricating flat panel display A method of fabricating a flat panel display device including: coating an etch-resist on a thin film; forming a soft mold having a groove and a protrusion for patterning the thin film; treating an end surface of the protrusion; applying the soft mold to the etch-res... | 09/25/2007 |
| 7273517 | Non-planar microfabricated gas chromatography column A non-planar microfabricated gas chromatography column comprises a planar substrate having a plurality of through holes, a top lid and a bottom lid bonded to opposite surfaces of the planar substrate, and inlet and outlet ports for injection of a sample gas and elut... | 09/25/2007 |
| 7273660 | Mixed composition interface layer and method of forming An interface forming method includes forming a first layer containing a first chemical element and chemisorbing on the first layer an interface layer containing at least one monolayer of the first chemical element intermixed with a second chemical element different ... | 09/25/2007 |
| 7269899 | Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery A method for forming a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes. ... | 09/18/2007 |
| 7271099 | Forming a conductive pattern on a substrate A method of forming a conductive pattern on a substrate. The method comprising providing a substrate carrying a conductive layer; forming a first portion of the conductive pattern by exposing the conductive layer to a laser and controlling the laser to remove conduc... | 09/18/2007 |
| 7271497 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 09/18/2007 |
| 7271114 | Perovskite ceramic powder and electronic component using same and manufacturing methods thereof A ceramic powder having a perovskite structure is manufactured by synthesizing a ceramic powder by a dry synthesis process and then heat-treating the synthesized ceramic powder in a solution. The dry synthesis method includes a solid phase synthesis method, an oxala... | 09/18/2007 |
| 7267926 | Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured... | 09/11/2007 |
| 7267861 | Solder joints for copper metallization having reduced interfacial voids A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, w... | 09/11/2007 |
| 7266999 | Thick film technology based ultra high pressure sensor utilizing integral port and diaphragm construction A method and apparatus for configuring a pressure sensor. A homogeneous piece of metal can be provided. A pressure port and a machined diaphragm are integrated onto the homogeneous piece of metal, wherein the machined diaphragm is connected to the pressure port. The... | 09/11/2007 |
| 7268408 | Wiring board, method for manufacturing wiring board and electronic component using wiring board A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided wi... | 09/11/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7268041 | Method of forming source contact of flash memory device The present invention relates to a method of forming a source contact of a flash memory device. According to the present invention, the method includes the steps of forming a first interlayer insulating film on a semiconductor substrate in which first junction regio... | 09/11/2007 |
| 7268372 | Vertical GaN light emitting diode and method for manufacturing the same Disclosed are a vertical GaN light emitting diode and a method for manufacturing the same. The vertical GaN light emitting diode comprises a first conductive GaN clad layer with an upper surface provided with a first contact formed thereon, an active layer formed on... | 09/11/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7268172 | Radiation curable compositions The present invention is directed to a composition curable by radiation having a wavelength of 300 nm or more, a method of producing a coated substrate using such composition and the coated product so-produced. More particularly, the composition of the present inven... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7265965 | Capacitor element and carbon paste The present invention provides a capacitor wherein increase in the ESR value after a high temperature loading test is mitigated. A capacitor element, comprising an electric conductor having formed on the surface thereof a dielectric layer as one electrode, an... | 09/04/2007 |
| 7265803 | Reconfigurable logic through deposition of organic pathways A circuit sheet comprising a substrate and wells dispersed on the substrate operable to hold conductive polymers that form circuit devices. ... | 09/04/2007 |
| 7265735 | Self scanning flat display A self-scanning flat display having a light active matrix in the form of a set of periodic lines which include light-reflecting, light-transparent, or light-emitting elements. These elements are controlled by current or a charge generated by a scan raster device. Th... | 09/04/2007 |
| 7265298 | Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device A stretchable electronic apparatus and method of producing the apparatus. The apparatus has a central longitudinal axis and the apparatus is stretchable in a longitudinal direction generally aligned with the central longitudinal axis. The apparatus comprises a stret... | 09/04/2007 |
| 7262134 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces Methods for forming interconnects in microfeature workpieces, and microfeature workpieces having such interconnects are disclosed herein. In one embodiment, a method of forming an interconnect in a microfeature workpiece includes forming a hole extending through a t... | 08/28/2007 |
| 7261793 | System and method for low temperature plasma-enhanced bonding A method for bonding a plurality of substrates includes performing a gas plasma treatment on the plurality of substrates, and performing a water plasma treatment on the plurality of substrates. Additionally, a system for performing low temperature plasma enhanced bo... | 08/28/2007 |
| 7261932 | Composite structural laminate plate construction A composite structural laminate plate construction comprises two outer metal layers, a form between them and an elastomer layer bonded to the outer metal layers and filling the space between them other than that occupied by the form. The form may be foam and may be ... | 08/28/2007 |
| 7262076 | Method for production of semiconductor package A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific structure, is free from surface relief shapes and internal voids, and enab... | 08/28/2007 |
| 7261841 | Thick film conductor case compositions for LTCC tape A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO | 08/28/2007 |
