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| Number | Title | Issue Date |
| 7192997 | Encapsulant composition and electronic package utilizing same A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexi... | 03/20/2007 |
| 7192802 | ALD ZnO seed layer for deposition of ZnO nanostructures on a silicon substrate Zinc-oxide nanostructures are grown without using a metal catalyst by forming a seed layer of polycrystalline zinc oxide on a surface of a substrate. The seed layer can be formed by an atomic layer deposition technique. Growth of at least one zinc-oxide nanostructur... | 03/20/2007 |
| 7192870 | Semiconductor device and fabrication process therefor A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the... | 03/20/2007 |
| 7193020 | Film and laminate of the same A film comprising a resin alloy of a liquid-crystalline polyester, a polyimide and an optional inorganic filler is provided. The film is excellent in heat resistance and dimensional stability. ... | 03/20/2007 |
| 7191517 | Shielding base member manufacturing method A radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer pattern is formed from the metal foil. The first adhesive layer, the resin layer, and the meta... | 03/20/2007 |
| 7193158 | Wiring board device At the tip of a marginal land of a wiring board corresponding to a marginal electrode of a QFP is provided a partly projecting area that projects in a direction away from another land. The partly projecting area and the marginal land can be formed simultaneously and... | 03/20/2007 |
| 7192654 | Multilayered construction for resistor and capacitor formation The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first el... | 03/20/2007 |
| 7190016 | Capacitor structure Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed. ... | 03/13/2007 |
| 7190080 | Semiconductor chip assembly with embedded metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line... | 03/13/2007 |
| 7189593 | Elimination of RDL using tape base flip chip on flex for die stacking A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are ... | 03/13/2007 |
| 7190073 | Circuit film with bump, film package using the same, and related fabrication methods A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a l... | 03/13/2007 |
| 7189449 | Metal/ceramic bonding substrate and method for producing same In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided al... | 03/13/2007 |
| 7188412 | Method for manufacturing printed wiring board Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in... | 03/13/2007 |
| 7189336 | Etchant, method for roughening copper surface and method for producing printed wiring board An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manu... | 03/13/2007 |
| 7189669 | Dielectric ceramic material and multilayer ceramic substrate A dielectric ceramic material which is obtained by firing a raw material comprising an alumina powder and a glass powder containing at least SiO2 and MgO, the dielectric ceramic material being characterized in that a ratio (MgAl2O4 (... | 03/13/2007 |
| 7191076 | Expandable intelligent electronic device An intelligent electronic device (IED) includes a base module having a power monitoring circuit operative to monitor a parameter of a portion of a power distribution system and generate an analog signal representative thereof. The base module also includes a process... | 03/13/2007 |
| 7189642 | Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components In one aspect, the invention encompasses a method of fabricating an interconnect for a semiconductor component. A semiconductor substrate is provided, and an opening is formed which extends entirely through the substrate. A first material is deposited along sidewall... | 03/13/2007 |
| 7185426 | Method of manufacturing a semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 03/06/2007 |
| 7187124 | Transparent electron source emitter device and method A photonic assisted emitter including an at least partially transparent electron source layer, a thin metal layer; and a tunneling layer disposed between said at least partially transparent electron source layer and said thin metal layer. ... | 03/06/2007 |
| 7186923 | Printed wiring boards and methods for making them A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conduct... | 03/06/2007 |
| 7186307 | Method for manufacturing a ceramic multilayer circuit board By increasing the quantity of resin binder of at least one of conductive paste and ceramic green sheet, adhesion between conductive film and the ceramic green sheet is improved when an intaglio filled with the conductive paste is hot pressed on the ceramic green she... | 03/06/2007 |
| 7186454 | Dielectric films and materials therefor A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hy... | 03/06/2007 |
| 7186919 | Printed circuit board including embedded capacitors and method of manufacturing the same Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via ho... | 03/06/2007 |
| 7186446 | Plasma enhanced ALD of tantalum nitride and bilayer A method to deposit TaN by plasma enhanced layer with various nitrogen content. Using a mixture of hydrogen and nitrogen plasma, the nitrogen content in the film can be controlled from 0 to N/Ta=1.7. By turning off the nitrogen flow during deposition of TaN, a TaN/T... | 03/06/2007 |
| 7181839 | Method for producing a circuit board After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature... | 02/27/2007 |
| 7182996 | Deposting nanowires on a substrate Processes for depositing nanowires on a substrate and nanowire-based devices that can be formed using these processes are described. In one embodiment, a process includes forming an organic layer on an electrically conductive layer formed on the substrate. The organ... | 02/27/2007 |
| 7183649 | Methods and procedures for engineering of composite conductive films by atomic layer deposition A composite film comprised of three layers is formed by ALD on a substrate with a substrate interface surface. A first layer is coupled to the substrate interface surface. The first layer provides adhesion to the substrate interface surface and initiation of layer b... | 02/27/2007 |
| 7183524 | Modular heated cover The modular heated cover is disclosed with a first pliable outer layer and a second pliable outer layer, wherein the outer layers provide durable protection in an outdoor environment, an electrical heating element between the first and the second outer layers, the e... | 02/27/2007 |
| 7183589 | Semiconductor device with a resin-sealed optical semiconductor element To provide a semiconductor device 10, which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10A has a configuration such that in semiconductor device 10A, wherein an optical semiconductor elem... | 02/27/2007 |
| 7180483 | Current-driven light-emitting display apparatus and method of producing the same An organic EL display device driven by thin-film transistors is disclosed, wherein for suppressing the deterioration with time of thin-film transistors, at least one of the thin-film transistors, or a second thin-film transistor is formed of a p-channel type thin-fi... | 02/20/2007 |
| 7180006 | Tape substrate and method for fabricating the same A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern... | 02/20/2007 |
| RE39490 | Security device having multiple security features and method of making same A security device having multiple security features is used with an item, such as a secure document, ticket, label or tag, to authenticate the item and/or encode data pertaining to the item. One example of the security device includes a carrier substrate, a metallic... | 02/20/2007 |
| 7180170 | Lead-free integrated circuit package structure An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive mate... | 02/20/2007 |
| 7178234 | Method of manufacturing multi-layer printed circuit board Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the... | 02/20/2007 |
| 7179519 | Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof Polyimide/metal laminates having a polyimide film and a metal layer laminated thereon, wherein the polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesi... | 02/20/2007 |
| 7180007 | Electronic circuit device and its manufacturing method It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1, surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circu... | 02/20/2007 |
| 7179520 | Circuit substrate, electro-optic device and electronic equipment A circuit substrate is described where the circuit substrate has a first wiring group extending in a first direction and a second wiring group extending in a second direction substantially orthogonal to the first direction. The first wiring group of the circuit subs... | 02/20/2007 |
| 7179673 | Method of fabricating liquid crystal display device A method of fabricating a liquid crystal display device is disclosed in the present invention. The method includes forming a thin film transistor in a pixel region and a pad on an edge region of a first substrate, depositing an organic passivation layer over the fir... | 02/20/2007 |
| 7179528 | Adhesive composition and adhesive optical component using the composition An adhesive sheet including an adhesive composition disposed on at least one face of a film of acetyl cellulose, the adhesive sheet being produced by coating a solution of the adhesive composition on the face of the film and drying the solution to form a laminate, t... | 02/20/2007 |
| 7176505 | Electromechanical three-trace junction devices Three trace electromechanical circuits and methods of using same. A circuit includes first and second electrically conductive elements with a nanotube ribbon (or other electromechanical elements) disposed therebetween. An insulative layer is disposed on one of the f... | 02/13/2007 |
