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| Number | Title | Issue Date |
| 8178156 | Surface treatment process for circuit board A surface treatment process for a circuit board is provided. The circuit board includes a substrate, a first circuit layer disposed on an upper surface of the substrate, and a second circuit layer disposed on a lower surface of the substrate. The first circuit layer... | 05/15/2012 |
| 7790219 | Printed component circuit with fluidic template A method forms a plurality of pillars, the pillars arranged such that positions of the pillars control flow of a liquid, the plurality of pillars forming a fluidic template, the method dispenses the liquid into the fluidic template such that the liquid assumes a sha... | 09/07/2010 |
| 7368380 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device is disclosed in which a metallic deposit is stably formed on the anode side with small variation in film thickness, and plating is prevented on the cathode side without carrying out any additional processing on the ca... | 05/06/2008 |
| 7356921 | Method for forming a conductive layer pattern A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets o... | 04/15/2008 |
| 7311937 | Method for forming a line pattern, line pattern, and electro-optic device The invention provides a method for forming a uniform conductive-film interconnecting pattern via simplified processes. In particular, the invention provides: a method for forming an interconnecting pattern having at least one corner and which does not cause irregul... | 12/25/2007 |
| 7279195 | Method of forming metal fine particle pattern and method of forming electroconductive pattern A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by... | 10/09/2007 |
| 7276267 | Method for the manufacture of an injection molded conductor carrying means A method making possible the production of an injection molded conductor carrying means composed of a first supporting substrate and a second supporting substrate. The first supporting substrate comprises a basically metallizeable plastic material and the second sup... | 10/02/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7198821 | Method of manufacturing a device, device, and electronic apparatus In this method of manufacturing a device, when discharging the liquid drops upon the substrate, a bit map made up from a plurality of pixels against which liquid drops are discharged is established upon the substrate. When establishing the pixels, when the interval ... | 04/03/2007 |
| 7172789 | Methods and apparatus for fluidic self assembly Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a r... | 02/06/2007 |
| 7167768 | Board work system having provision for establishing operating environment suitable for operator, and process of establishing the suitable operating environment A board work system operable by a plurality of operators assigned in turn to operate. The system includes (a) at least one device changeable to each one of a plurality of different modes; (b) a control device which controls the changeable device, and receives operat... | 01/23/2007 |
| 7147795 | Method for surface treatment A method for surface treatment includes: a first step in which a surface treatment apparatus 1 and a substrate 10 in a state where a front surface 102 of the substrate 10 faces the surface treatment apparatus 1 are conveyed to the ... | 12/12/2006 |
| 7125586 | Kinetic spray application of coatings onto covered materials Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass to bo... | 10/24/2006 |
| 7121647 | Method of applying an encapsulant material to an ink jet printhead A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includ... | 10/17/2006 |
| 7115507 | Patterning method A substrate is patterned by forming an indent region 8 in the surface 10 of a substrate 4 and depositing a liquid material onto the surface 10 at selected locations adjacent to the indent region 8. The liquid material spreads over ... | 10/03/2006 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The pr... | 08/22/2006 |
| 7062849 | Method for producing circuitry using molten metal droplets A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of molten metal on a substrate so as to form the first circuit based on the c... | 06/20/2006 |
| 7063762 | Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 06/20/2006 |
| 6932451 | System and method for forming a pattern on plain or holographic metallized film and hot stamp foil The system and method of the present invention forms an item specific pattern on a plain or holographic metallized film or hot stamp foil, including an embossed substrate with or without holograms. A piezoelectric ink jet printhead includes a plurality of ink jet ch... | 08/23/2005 |
| 6921550 | Etch resist using printer technology The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate ... | 07/26/2005 |
| 6623803 | Copper interconnect stamping A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to th... | 09/23/2003 |
| 6616967 | Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturat... | 09/09/2003 |
| 6117784 | Process for integrated circuit wiring Metal wiring is provided in an integrated circuit by sputter coating onto a semiconductor substrate a copper seed layer; depositing and patterning a photoresist; electroplating or electrolessly plating a metal within the openings of the photoresist; strip... | 09/12/2000 |
| 6086946 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and sub... | 07/11/2000 |
| 6022596 | Method for photoselective seeding and metallization of three-dimensional materials A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this... | 02/08/2000 |
| 6010769 | Multilayer wiring board and method for forming the same A multilayered wiring board using conductive pillars for the interconnection of wiring layers. Since through holes are bored in the via lands of the wiring layers of the multilayered wiring board, the stress applied between the conductive pillars and wiri... | 01/04/2000 |
| 5882736 | palladium layers deposition process A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, p... | 03/16/1999 |
| 5858149 | Process for bonding semiconductor chip An improved process for bonding a semiconductor chip to a substrate is disclosed. In the process, a gold bump is formed on an aluminum bond pad of the chip thus forming a flip chip. A screen with an opening is placed on the substrate prior to dotting insu... | 01/12/1999 |
| 5846598 | Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, co... | 12/08/1998 |
| 5843517 | Composition and method for selective plating This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printe... | 12/01/1998 |
| 5843520 | Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers A clamp for fixturing a substrate when forming and thermally processing upon the substrate a thermally flowable layer. The clamp comprises a backing member having a top member connected through a first mechanical means to the backing member. The backing m... | 12/01/1998 |
| 5820697 | Fluorescent water soluble solder flux A mixture of a dye including one or more water soluble fluorescent dyes and a water soluble solder flux provides simple optical inspection under ultraviolet illumination with simple apparatus. The optical inspection is thus made highly sensitive to the pr... | 10/13/1998 |
| 5807606 | Applying adhesive to substrates Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that genera... | 09/15/1998 |
| 5800856 | Mask stencil wear indicator A mask stencil (112) is made with at least one indicator line (204, 205) of material pre-removed from a wear surface (212) of the mask stencil, the depth of the line is approximately the amount of stencil mask material that can be worn from the wear surfa... | 09/01/1998 |
| 5766674 | Method of producing a printed wiring board In a method of producing a printed wiring board, solder layers are formed on pads beforehand. After the solder layers have been covered with a solder resist, the solder layers are caused to flow so as to render only the portion of the solder resist overly... | 06/16/1998 |
| 5750291 | Image-forming process A process for the formation of a patterned resist of a photocurable material on a circuit board, the uncured portion of which is water soluble. The process includes the steps of forming a layer of an aqueous emulsion of a photocurable material upon the ci... | 05/12/1998 |
| 5738904 | Method and apparatus for variable speed material deposition This invention provides for methods and apparatus for increasing the speed of material deposition by a blade element traversing across an apertured mask. The invention involves varying the velocity of the blade element as it sweeps across different sectio... | 04/14/1998 |
| 5709905 | Apparatus and method for automatic monitoring and control of stencil printing A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (... | 01/20/1998 |
| 5693559 | Method for printing solder paste A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be sep... | 12/02/1997 |
| 5693364 | Method for the manufacture of printed circuit boards The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety... | 12/02/1997 |
