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Patent No. 6681419

Forehead support apparatus 

A forehead support apparatus for resting a standing users forehead against a wall above a bathroom commode or urinal or beneath a showerhead.

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Class 427/563 - Silicon containing coating material


Subclass of Class 427 - Coating processes
Definition: Processes wherein coating material applied to the substrate
No. of patents: 137
Last issue date: 02/05/2008


1        
NumberTitleIssue Date
7326646Nitrogen-free ARC layer and a method of manufacturing the same
The present invention provides a nitrogen-free ARC layer, which is formed on the basis of silane and carbon dioxide by PECVD in a nitrogen-free deposition atmosphere. The optical characteristics may be tuned in a wide range, wherein, in particular, a back reflection...
02/05/2008
7311851Apparatus and method for reactive atom plasma processing for material deposition
Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are move...
12/25/2007
7294404Graded photocatalytic coatings
The invention provides graded photocatalytic coatings. In one aspect, the invention provides a substrate carrying a photocatalytic coating that includes a first graded film region and a second graded film region. The first graded film region has a substantially cont...
11/13/2007
7288311Barrier film
A barrier film is provided having extremely high barrier properties and a good transparency as part of a laminated material having use as a packaging container which may possess an image display medium, the high barrier properties and good transparency which are ach...
10/30/2007
7288292Ultra low k (ULK) SiCOH film and method
The present invention provides a multiphase, ultra low k film which exhibits improved elastic modulus and hardness as well as various methods for forming the same. The multiphase, ultra low k dielectric film includes atoms of Si, C, O and H, has a dielectric constan...
10/30/2007
7279112Method of manufacture of smart microfluidic medical device with universal coating
A method of applying a universal coating for a medical device comprising a medical device component, the medical device component having an outer surface and an inner surface, the universal coating applied to at least the outer surface or the inner surface of the me...
10/09/2007
7273638High density plasma oxidation
A method of oxidizing a substrate having area of about 30,000 mm2 or more. The surface is preferably comprised of silicon-containing materials, such as silicon, silicon germanium, silicon carbide, silicon nitride, and metal suicides. A mixture of oxygen-b...
09/25/2007
7244474Chemical vapor deposition plasma process using an ion shower grid
A chemical vapor deposition process is carried out in a reactor chamber with an ion shower grid that divides the chamber into an upper ion generation region and a lower process region, the ion shower grid having plural orifices oriented in a non-parallel direction r...
07/17/2007
7241690Method for conditioning a microelectronics device deposition chamber
The present invention provides, in one aspect, a method of conditioning a deposition chamber 100. An undercoat is placed on the walls of a deposition chamber 100 and a pre-deposition coat is deposited over the undercoat with a plasma gas mixture conducted at a high ...
07/10/2007
7229666Chemical vapor deposition method
Methods of chemical vapor deposition include providing a deposition chamber defined at least in part by at least one of a chamber sidewall and a chamber base wall. At least one process chemical inlet to the deposition chamber is included. A substrate is positioned w...
06/12/2007
7217659Process for producing materials for electronic device
A process for producing an electronic device material of a high quality MOS-type semiconductor having an insulating layer and a semiconducting layer. The process includes a step of CVD-treating a substrate to be processed having single-crystal silicon as a main comp...
05/15/2007
7198699Sputter coating apparatus including ion beam source(s), and corresponding method
A coating apparatus deposits a first coating (single or multi-layered) onto a first side of a substrate (e.g., glass substrate) passing through the apparatus, and a second coating (single or multi-layered) onto the other or second side of the substrate. In certain e...
04/03/2007
7175713Apparatus for cyclical deposition of thin films
An apparatus for cyclical depositing of thin films on semiconductor substrates, comprising a process chamber having a gas distribution system with separate paths for process gases and an exhaust system synchronized with operation of valves dosing the process gases i...
02/13/2007
7125758Controlling the properties and uniformity of a silicon nitride film by controlling the film forming precursors
We have developed a method of PECVD depositing a-SiNx:H films which are useful in a TFT device as gate dielectric and passivation layers, when a series of TFT devices are arrayed over a substrate having a surface area larger than about 1 m2, wh...
10/24/2006
7112453Retentate chromatography and protein chip arrays with applications in biology and medicine
This invention provides methods of retentate chromatography for resolving analytes in a sample. The methods involve adsorbing the analytes to a substrate under a plurality of different selectivity conditions, and detecting the analytes retained on the substrate by d...
09/26/2006
7105460Nitrogen-free dielectric anti-reflective coating and hardmask
Methods are provided for depositing a dielectric material. The dielectric material may be used for an anti-reflective coating or as a hardmask. In one aspect, a method is provided for processing a substrate including introducing a processing gas comprising a silane-...
09/12/2006
7079370Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing...
07/18/2006
7041350Polyester composition and articles with reduced acetaldehyde content and method using hydrogenation catalyst
A polyester composition with reduced acetaldehyde concentration comprising polyester, at least one hydrogenation catalyst, and at least one source of reactive hydrogen. A method for making the polyester composition is also disclosed along with polyester articles mad...
05/09/2006
6964731Soil-resistant coating for glass surfaces
A glass article which has a water-sheeting coating and a method of applying coatings to opposed sides of a substrate are described. In one embodiment, a glass sheet is provided bearing a sputtered water-sheeting coating comprising silica on an exterior surface and b...
11/15/2005
6950589Optical switching element and method for manufacturing the same
A lower clad, cores, and an upper clad are formed by a chemical vapor deposition method (CVD method). At least one of the additional amount of oxygen, the additional amount of nitrogen, and the additional amount of silicon of a silicon oxynitride film is adjusted so...
09/27/2005
6943127CVD plasma assisted lower dielectric constant SICOH film
A low dielectric constant film having silicon-carbon bonds and dielectric constant of about 3.0 or less, preferably about 2.5 or less, is provided. The low dielectric constant film is deposited by reacting a cyclic organosilicon compound and an aliphatic organosilic...
09/13/2005
6939446Soil-resistant coating for glass surfaces
A glass article which has a water-sheeting coating and a method of applying coatings to opposed sides of a substrate are described. In one embodiment, a water-sheeting coating 20 comprising silica is sputtered directly onto an exterior surface of the glass. T...
09/06/2005
6936309Hardness improvement of silicon carboxy films
A method for depositing a low dielectric constant film having an improved hardness and elastic modulus is provided. In one aspect, the method comprises depositing a low dielectric constant film having silicon, carbon, and hydrogen, and then treating the deposited fi...
08/30/2005
6936310Plasma processing method
In a plasma processing method making use of a plasma processing gas of a reactant gas and an inert gas, it is aimed at enhancing an efficiency of use of high-frequency power and a reactant gas to increase a processing rate. The plasma processing method comprises sup...
08/30/2005
6926926Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
A SiC-based layer is deposited on a substrate having an electrical resistivity between about 1 and 100 Ω cm. The substrate is disposed in a process chamber. A gaseous mixture having a silicon-containing gas and a hydrocarbon-containing gas is flowed to the process ...
08/09/2005
6924235Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method
An improved method for introducing gases into an alternating plasma etching/deposition chamber is provided by the present invention. To minimize the introduction of pressure pulses into the alternating etching/deposition chamber when the deposition and etchant gas s...
08/02/2005
6903025Method of purging semiconductor manufacturing apparatus and method of manufacturing semiconductor device
A method of purging a semiconductor manufacturing apparatus comprises a step of etching a CVD-deposited film deposited in a chamber constituting a semiconductor manufacturing apparatus which has performed a process of forming a CVD film using a CVD process over a se...
06/07/2005
6830786Silicon oxide film, method of forming the silicon oxide film, and apparatus for depositing the silicon oxide film
A silicon oxide film has a ratio of A1 to A2 which is not higher than 0.21, where A1 is a first peak integrated intensity of a first peak belonging to Si—OH and appearing in the vicinity of a wave-number of 970 cm−1, and A2
12/14/2004
6800336Method and device for plasma coating surfaces
A method for coating surfaces, for which a precursor material is caused to react with the help of plasma and the reaction product is deposited on a surface, the reaction as well as the deposition taking place at atmospheric pressure, such that a plasma jet is genera...
10/05/2004
6797339Method for forming thin film with a gas cluster ion beam
A method of forming a thin film on the surface of a substrate such as silicon, in which a gas cluster (which is a massive atomic or molecular group of a reactive substance taking the gaseous form at room temperature under atmospheric pressure) is formed and then ion...
09/28/2004
6797336Multi-component substances and processes for preparation thereof
The present invention is a method and apparatus for the synthesis of multi-component substances, comprising entities of at least two elements, molecules, grains, crystals, structural units, or phases of matter, in which the scale of the distribution of the elements,...
09/28/2004
6737121Multilayer article and method of making by arc plasma deposition
According to an exemplary embodiment of the invention, a method of forming a plurality of layers on an article comprises steps of generating a plasma by forming an arc between a cathode and an anode; injecting a first material comprising an organic compound into the...
05/18/2004
6709715Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds
A method and apparatus for depositing a low dielectric constant film by plasma assisted copolymerization of p-xylylene and a comonomer having carbon-carbon double bonds at a constant RF power level from about 0W to about 100W or a pulsed RF power level from about 20...
03/23/2004
6703081Installation and method for vacuum treatment or powder production
Vacuum treatment installation with a vacuum treatment chamber containing a plasma discharge configuration as well as a gas supply configuration. The plasma discharge configuration has at least two plasma beam discharge configurations with substantially pa...
03/09/2004
6673722Microwave enhanced CVD system under magnetic field
An improved chemical vapor deposition or etching is shown in which cyclotron resonance and photo or plasma CVD cooperate to deposit a layer with high performance at a high deposition speed. The high deposition speed is attributed to the cyclotron resonanc...
01/06/2004
6653245Method for liquid phase deposition
A method for liquid phase deposition, including the steps of providing at least two raw materials from at least two supply devices of a saturation reaction system into a mixture trough and stirring until saturation occurs, filtering out unnecessary solid-...
11/25/2003
6616986Sequential chemical vapor deposition
The present invention provides for sequential chemical vapor deposition by employing a reactor operated at low pressure, a pump to remove excess reactants, and a line to introduce gas into the reactor through a valve. A first reactant forms a monolayer on...
09/09/2003
6616985Apparatus and method for injecting and modifying gas concentration of a meta-stable or atomic species in a downstream plasma reactor
An apparatus and method for injecting gas within a plasma reactor and tailoring the distribution of an active species generated by the remote plasma source over the substrate or wafer. The distribution may be uniform, wafer-edge concentrated, or wafer-cen...
09/09/2003
6610368Leather and a method of dressing same
Tanned leather is dry dressed by plasma deposition at atmospheric pressure of a matrix material such as ITO, a silicone, or polyurethane, upon the protein fibers of the surface of the leather and the collagen fiber skeleton below the surface protein fiber...
08/26/2003
6607790Method of forming a thin film for a semiconductor device
The present invention relates to a plasma-enhanced chemical vapor deposition (PECVD) method of depositing a thin layer of a material, such as silicon dioxide, on the surface of a body, such as a semiconductor substrate. The method includes forming in a de...
08/19/2003
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