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Class 427/539 - Oxygen containing atmosphere


Subclass of Class 427 - Coating processes
Definition: Processes wherein plasma treatment of the base is conducted
No. of patents: 280
Last issue date: 08/12/2008


1              
NumberTitleIssue Date
7410675Transparent, biaxially orientated polyolefinic film with improved bonding properties
The invention relates to the use of a polyolefinic film, with at least one layer, which is made from polyolefinic polymers, whereby said polyolefinic film comprises a bonding layer as outer layer. Said bonding layer contains at least 50 wt. % based on the weight of ...
08/12/2008
7371487Method of fabricating black matrix of a color filter
A method of fabricating a black matrix of a color filter is provided. In the method, a black matrix layer formed of a hydrophobic organic material is formed on an upper surface of a transparent substrate. A black matrix is formed by patterning the black matrix layer...
05/13/2008
7368402Systems and methods for forming tantalum oxide layers and tantalum precursor compounds
A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum precursor compound that includes alkoxide ligands, for example. ...
05/06/2008
7368377Method for selective deposition of a thin self-assembled monolayer
A method for selective deposition of self-assembled monolayers to the surface of a substrate for use as a diffusion barrier layer in interconnect structures is provided comprising the steps of depositing a first self-assembled monolayer to said surface, depositing a...
05/06/2008
7341792Biaxially oriented saturated polyester film, method of making the same, laminate of biaxially oriented saturated polyester film and method of making the same
A biaxially oriented saturated polyester film made by a biaxial orientation method, includes a heat-seal side formed in at least one of two sides of the film, the heat-seal side being made by applying a low-temperature plasma treatment to a film surface so that the ...
03/11/2008
7316831Tilted vertical alignment of liquid crystals employing inorganic thin film composition and ion beam treatment
A liquid crystal display device includes an alignment layer with constituent materials. The constituent materials have a stoichiometric relationship configured to provide a given pretilt angle. Liquid crystal material is provided in contact with the alignment layer....
01/08/2008
7273638High density plasma oxidation
A method of oxidizing a substrate having area of about 30,000 mm2 or more. The surface is preferably comprised of silicon-containing materials, such as silicon, silicon germanium, silicon carbide, silicon nitride, and metal suicides. A mixture of oxygen-b...
09/25/2007
7265404Bottom conductor for integrated MRAM
A structure that is well suited to connecting an MTJ device to a CMOS integrated circuit is described. It is built out of three layers. The bottom layer serves as a seed layer for the center layer, which is alpha tantalum, while the third, topmost, layer is selected...
09/04/2007
7250197Plasma treatment of contact lens and IOL
Intraocular lenses or contact lenses 20 are placed on a lower spindle 34 and held there by a vacuum in conduit 34. Noble and reactive gases 56, 58 are introduced and a voltage is applied across upper spindle 32 and lower spindle
07/31/2007
7229675Protective coating method for pieces made of heat resistant alloys
The invention relates to metallurgy and mechanical engineering, in particular to the development of methods for providing metallic pieces with protective coatings with a view to improving the performance characteristics thereof. In accordance with the inventive meth...
06/12/2007
7220460Thin film forming method, optical film, polarizing film and image display method
A method of forming a layer or layers are disclosed which comprises the steps of transporting a substrate having a first surface and a second surface on the side opposite the first surface to a gap formed between a first electrode and a second electrode opposing eac...
05/22/2007
7214327Anisotropic dry etching of Cu-containing layers
A method and apparatus for dry etching pure Cu and Cu-containing layers (220, 310) for manufacturing integrated circuits. The invention uses a directional beam of O-atoms with high kinetic energy (340) to oxidize the Cu and Cu-containing layers, and et...
05/08/2007
7169440Method for removing photoresist and etch residues
A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an oxygen-containing gas, where low or zero bias ...
01/30/2007
7166342Thermoplastic resin film and process for producing the same
A heat-shrinkable resin film which has heat shrinkage in the maximum shrinkage direction of 20% or higher when a 10 cm×10 cm square sample cut out thereof is immersed in hot water at 85° C. for 10 seconds, pulled out, subsequently immersed in water at 25° C. for ...
01/23/2007
7143990Apparatus and method for the production of ophthalmic lenses
An apparatus and method for the production of ophthalmic lenses, and particularly contact lenses, which minimizes damage of the lens in removal from the mold. The ophthalmic lens is produced in a mold having a male part and a female part that are placed in proximate...
12/05/2006
7141311Ferrite thin film for high frequency and method for preparation thereof
The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the ...
11/28/2006
7141277Self-generating inorganic passivation layers for polymer-layered silicate nanocomposites
A method for preparing high-use temperature, light-weight polymer/inorganic nanocomposite materials with enhanced thermal stability and performance characteristics, which comprises treating a polymer/inorganic nanocomposite material with oxygen plasma under conditio...
11/28/2006
7138187Polyvinyl alcohol-based film exhibiting improved adhesion
Modifications to the surface of polyvinyl alcohol-based films are disclosed that result in improved adhesion to optical materials. Specifically, the surface chemistry of the polyvinyl alcohol-based film is altered to include fluorine bonds, which surprisingly improv...
11/21/2006
7101810Transparent article having protective silicon nitride film
Transparent articles comprising transparent, nonmetallic substrate and a transparent film stack is sputter deposited on the substrate. The film stack is characterized by including at least one infrared reflective metal film, a dielectric film over the metal film, an...
09/05/2006
7094680Formation of a tantalum-nitride layer
A method of forming a tantalum nitride layer for integrated circuit fabrication is disclosed. In one embodiment, the method includes forming a tantalum nitride layer by chemisorbing a tantalum precursor and a nitrogen precursor on a substrate disposed in a process c...
08/22/2006
7084042Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same
A Metal-Insulator-Metal (MIM) capacitor structure and method of fabricating the same in an integrated circuit improve capacitance density in a MIM capacitor structure by utilizing a sidewall spacer extending along a channel defined between a pair of legs that define...
08/01/2006
7077935Oand HO barrier material
O2 and H2O barrier materials suitable for the protection of LCDs and flexible OLEDs are fabricated on a polymer substrate using dense inorganic barrier layers. A polymer surface having a low surface roughness has an inorganic layer of aluminum ...
07/18/2006
7078074Lens plasma coating system
The invention provides a method for plasma coating of optical lenses, particularly lenses made of silicone-containing polymer. The method of the invention comprising selectively depressurizing and pressurizing an entry hold chamber and an exit hold chamber while con...
07/18/2006
7078356Low K interlevel dielectric layer fabrication methods
A low k interlevel dielectric layer fabrication method includes providing a substrate having integrated circuitry at least partially formed thereon. An oxide comprising interlevel dielectric layer comprising carbon and having a dielectric constant no greater than 3....
07/18/2006
7064077Method for high aspect ratio HDP CVD gapfill
A method of depositing a high density plasma silicon oxide layer having improved gapfill capabilities. In one embodiment the method includes flowing a process gas consisting of a silicon-containing source, an oxygen-containing source and helium into a substrate proc...
06/20/2006
7055937Heat generating resistant element film, substrate for ink jet head utilizing the same, ink jet head and ink jet apparatus
The invention provides a heat generating resistant element having a high durability and a high resistance suitable for constituting an electrothermal converting member in an ink jet head or an ink jet apparatus. There is employed, as the heat generating resistant el...
06/06/2006
7052988Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing
A nitrogen-free anti-reflective layer for use in semiconductor photolithography is fabricated in a chemical vapor deposition process, optionally plasma-enhanced, using a gaseous mixture of carbon, silicon, and oxygen sources. By varying the process parameters, accep...
05/30/2006
7041335Titanium tantalum nitride silicide layer
Methods and apparatus of forming titanium tantalum silicon nitride (TixTay(Si)Nz) layers are described. The titanium tantalum silicon nitride (TixTay(Si)Nz) layer may be formed using a cyclical deposi...
05/09/2006
7037858Method for manufacturing semiconductor device including an ozone process
A method for manufacturing a semiconductor device includes forming a barrier layer on an individual device formed on a semiconductor substrate and including a MOS transistor. An ozone process is performed on the barrier layer. A pre-metal dielectric (I′MD) layer i...
05/02/2006
7037560Film forming method, and film modifying method
A film forming and film modifying method utilizing a film forming apparatus which has an alcohol supply unit to form a metal oxide film on a semiconductor wafer in a vacuum atmosphere in which a vaporized metal oxide film material and a vaporized alcohol exist. The ...
05/02/2006
7033648Means of seeding and metallizing polyimide
A method to selectively metallize polyimide with an all-electroless process. ...
04/25/2006
RE39045Method of manufacturing a fluorocarbon-based coating film
A method of contacting a substrate having a surface containing hydroxyl groups with a non-aqueous solution containing a material having a chrolosilyl group; washing if desired; coating the substrate with a non-aqueous solvent containing a compound having a fluorocar...
03/28/2006
6995419Semiconductor constructions having crystalline dielectric layers
The invention includes semiconductor constructions. In one implementation, semiconductor construction includes a first conductive material. A first layer of a dielectric material is over the first conductive material. A second layer of the dielectric material is on ...
02/07/2006
6958112Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation
Methods and systems are provided for depositing silicon oxide in a gap on a substrate. The silicon oxide is formed by flowing a process gas into a process chamber and forming a plasma having an overall ion density of at least 1011 ions/cm3. The...
10/25/2005
6946166Magnetic recording medium, a method of manufacturing the same, and a magnetic storage device using the magnetic recording medium
A magnetic recording medium according to the invention includes a nonmagnetic substrate made of a polymer resin, the nonmagnetic substrate having been treated to improve an adhesion characteristic thereof; an adhesive layer on the nonmagnetic substrate, a nonmagneti...
09/20/2005
6942917Transparent article having protective silicon nitride film
Transparent articles comprising transparent, nonmetallic substrate and a transparent film stack is sputter deposited on the substrate. The film stack is characterized by including at least one infrared reflective metal film, a dielectric film over the metal film, an...
09/13/2005
6927166Method for manufacturing semiconductor devices and integrated circuit capacitors whereby degradation of surface morphology of a metal layer from thermal oxidation is suppressed
A method of manufacturing a semiconductor device having a metal layer is provided in which variation of surface morphology resulting from thermal oxidation is suppressed. The metal layer is pretreated at a first temperature so that an upper surface of the metal laye...
08/09/2005
6926932Method for forming silicon oxide layer
A method for forming a silicon oxide layer in the production of the polysilicon film transistor is disclosed. A plasma surface treatment is performed over a substrate after an amorphous silicon layer has been formed on the substrate by PECVD to transform a portion o...
08/09/2005
6919168Masking methods and etching sequences for patterning electrodes of high density RAM capacitors
A method of etching a noble metal electrode layer disposed on a substrate to produce a semiconductor device including a plurality of electrodes separated by a distance equal to or less than about 0.35 μm and having a noble metal profile equal to or greater than abo...
07/19/2005
6916709Non-volatile semiconductor memory device and manufacturing method for the same
A non-volatile semiconductor memory device comprising: a first insulating film provided on a silicon based substrate; a first electrode provided on the first insulating film as a floating gate; a second insulating film provided on the first electrode; and a second e...
07/12/2005
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