Mouthguard made at least partially from an edible candy
A mouthguard includes a U-shaped upper bite plate which removably fits over upper teeth of a person, with the entire upper bite plate being made from a soft, deformable and edible gummi candy.
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8017195 | Method for vibrational damping of gas turbine engine airfoils A coating system and coating method for damping vibration in an airfoil of a rotating component of a turbomachine. The coating system includes a metallic coating on a surface of the airfoil, and a ceramic coating overlying the metallic coating. The metallic coating ... | 09/13/2011 |
| 7998537 | Method for selectively removing hydrogen from molecules Methods for removing hydrogen from molecules are disclosed. In one embodiment, hydrogen-containing molecules are deposited on a solid substrate and are bombarded with hydrogen projectile particles. The particles may have energies of 5-100 eV, or more preferably 10-5... | 08/16/2011 |
| 7887890 | Method of manufacturing plastic substrate using plasma process and plastic substrate manufactured using the method Provided is a method of manufacturing a plastic substrate with lower auto-fluorescence and better specificity. The method includes: (a) preparing a plastic substrate having an Atomic Force Microscopic (AFM) surface roughness of Ra | 02/15/2011 |
| 7645494 | Pre-plating surface treatments for enhanced galvanic-corrosion resistance The invention relates to a method that involves (a) removing graphite from at least one surface of a metal graphite composite material; (b) chemically cleaning or plasma etching the surface of the metal graphite composite material; (c) applying a metal-containing ma... | 01/12/2010 |
| 7595096 | Method of manufacturing vacuum plasma treated workpieces A method of manufacturing vacuum plasma treated workpieces includes the steps of introducing at least one workpiece to be treated into a vacuum chamber; treating the workpiece in the vacuum chamber, thereby establishing a plasma discharge in the vacuum chamber by a ... | 09/29/2009 |
| 7569256 | Plasma CVD apparatus and dry cleaning method of the same In a parallel flat plate type plasma CVD apparatus, plasma damage of constituent parts in a reaction chamber due to irregularity of dry cleaning in the reaction chamber is reduced and the cost is lowered. In the parallel flat plate type plasma CVD apparatus in which... | 08/04/2009 |
| 7374642 | Treatment process for improving the mechanical, catalytic, chemical, and biological activity of surfaces and articles treated therewith A continuous, uninterrupted two-step treatment process capable of forming nanometer scale physical structures on the surface of articles fabricated from metallic, ceramic, glass, or plastic materials, and then depositing a thin conformal coating on the nanostructure... | 05/20/2008 |
| 7372691 | Apparatus and method for joining two substrates A substrate attaching device (3) includes a vacuum chamber (31), a first electrostatic chuck (32) at least partly set in the vacuum chamber, and further includes a chuck body (321) with a plurality of gas releasing holes (322), a w... | 05/13/2008 |
| 7368151 | Antiscattering grid and a method of manufacturing such a grid An antiscattering grid for an X-ray imaging apparatus of the type comprising a substrate having a plurality of metallized partitions that together define a plurality of cells distributed over the substrate. The partitions allow passage of the X-rays emitted from a s... | 05/06/2008 |
| 7365026 | CHsacrificial layer for cu/low-k interconnects A semiconductor method of manufacturing involving low-k dielectrics is provided. The method includes depositing a hydrocarbon of the general composition CxHy on the surface of a low-k dielectric. The hydrocarbon layer is deposited by reacting a... | 04/29/2008 |
| 7361387 | Plasma enhanced pulsed layer deposition A process system and a deposition method for depositing a highly controlled layered film on a workpiece is disclosed. The basic component of the apparatus is a pulsing plasma source that is capable of either exciting or not-exciting a first precursor. The pulsing pl... | 04/22/2008 |
| 7361233 | Methods of hydrogen cleaning of metallic surfaces The pulsed partial pressure hydrogen cleaning of cobalt-based alloys in turbine components is achieved by disposing the component within a vacuum furnace and heating the component. Upon heating to about 1400° F., a partial pressure hydrogen gas and a vacuum are rep... | 04/22/2008 |
| 7354631 | Chemical vapor deposition apparatus and methods This invention includes chemical vapor deposition apparatus, methods of chemical vapor depositing an amorphous carbon comprising layer on a substrate, and methods of chemical vapor depositing at least one of Si3N4 and SixOy | 04/08/2008 |
| 7351607 | Large scale patterned growth of aligned one-dimensional nanostructures A method of making nanostructures using a self-assembled monolayer of organic spheres is disclosed. The nanostructures include bowl-shaped structures and patterned elongated nanostructures. A bowl-shaped nanostructure with a nanorod grown from a conductive substrate... | 04/01/2008 |
| 7347915 | Plasma in-situ treatment of chemically amplified resist A method for creating semiconductor devices by etching a layer over a wafer is provided. A photoresist layer is provided on a wafer. The photoresist layer is patterned. The wafer is placed in a process chamber. The photoresist is hardened by providing a hardening pl... | 03/25/2008 |
| 7326442 | Antireflective composition and process of making a lithographic structure An antireflective composition and a lithographic structure comprising a silicon-metal oxide, antireflective material derived from the composition. The antireflective composition comprises a polymer of formula I, | 02/05/2008 |
| 7316764 | System and method for performing sputter etching using independent ion and electron sources and a substrate biased with an a-symmetric bi-polar DC pulse signal A system and method for performing sputter etching includes an ion source that generates an ion current that is directed at a substrate and an electron source that generates an electron current directed at the substrate. Biasing circuitry biases the substrate with a... | 01/08/2008 |
| 7309515 | Method for fabricating an imprint mold structure The present invention is related to a method for fabricating an imprint mold which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more cap... | 12/18/2007 |
| 7309652 | Method for removing photoresist layer and method for forming metal line in semiconductor device using the same Disclosed are a method for removing a photoresist layer and a method for forming a metal line using the same. The method for removing a photoresist pattern, including the steps of: forming a bottom layer on a substrate by using the photoresist pattern as a mask; and... | 12/18/2007 |
| 7300684 | Method and system for coating internal surfaces of prefabricated process piping in the field The coating of internal surfaces of a workpiece is achieved by connecting a bias voltage such that the workpiece functions as a cathode and by connecting an anode at each opening of the workpiece. A source gas is introduced at an entrance opening, while a vacuum sou... | 11/27/2007 |
| 7291565 | Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid A method and system is described for treating a substrate with a high pressure fluid, such as carbon dioxide in a supercritical state. A process chemistry is introduced to the high pressure fluid for treating the substrate surface. The process chemistry comprises fl... | 11/06/2007 |
| 7288769 | Method for the production of and protective layer for a layer of luminescent material A protective layer is provided for an image detector used for an x-ray image. This image detector comprises a layer of luminescent material that is to be protected against mechanical stress and moisture. A polymeric protective layer is disposed thereupon and is hard... | 10/30/2007 |
| 7288284 | Post-cleaning chamber seasoning method A method for seasoning a process chamber is disclosed. The seasoning method includes providing a seasoning film on the interior surfaces of a process chamber, typically after cleaning of the chamber. ... | 10/30/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7273821 | Method for producing a porous coating The present invention relates to a process for producing a porous layer adhering to a substrate, which comprises the steps: a. preparation of a composition comprising an organic polymer constituent and an inorganic-organic constituent and/or an inorgani... | 09/25/2007 |
| 7270854 | Method for forming a head having improved spin valve properties A method for forming a magnetic head having an improved PtMn layer, including forming a PtMn layer by ion beam deposition, forming an antiparallel (AP) pinned layer structure above the PtMn layer, and forming a free layer above the AP pinned layer structure. The met... | 09/18/2007 |
| 7268646 | Temperature controlled MEMS resonator and method for controlling resonator frequency There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical reso... | 09/11/2007 |
| 7255772 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 08/14/2007 |
| 7250197 | Plasma treatment of contact lens and IOL Intraocular lenses or contact lenses 20 are placed on a lower spindle 34 and held there by a vacuum in conduit 34. Noble and reactive gases 56, 58 are introduced and a voltage is applied across upper spindle 32 and lower spindle | 07/31/2007 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing A method and system for processing a substrate in a film removal system. The method includes providing the substrate in a substrate chamber of a film removal system, where the substrate has a micro-feature containing a dielectric film on a sidewall of the micro-feat... | 07/31/2007 |
| 7250196 | System and method for plasma plating An exemplary system and method for plasma plating are provided to generate a deposition layer on a substrate. The method for plasma plating includes positioning a substrate within a vacuum chamber, positioning a depositant in a filament within the vacuum chamber, re... | 07/31/2007 |
| 7241696 | Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer Disclosed is a method for depositing a metal layer on an interconnect structure for a semiconductor wafer. In the method, a metal conductor is covered by a capping layer and a dielectric layer. The dielectric layer is patterned so as to expose the capping layer. The... | 07/10/2007 |
| 7238412 | Thermally and electrically conducting high index contrast multi-layer mirrors and devices An optical device is provided. The optical device includes a plurality of high index layers. The optical device also includes a plurality of low index layers. The optical device is formed by creating alternating layers of the plurality of high layers and the plurali... | 07/03/2007 |
| 7229915 | Method for manufacturing semiconductor device A first insulating film, a second insulating film, a third insulating film, an antireflective film, and a resist film are formed in this order on a lower-layer wiring. After dry etching the third insulating film and the second insulating film, using the resist film ... | 06/12/2007 |
| 7226869 | Methods for protecting silicon or silicon carbide electrode surfaces from morphological modification during plasma etch processing Methods for forming a protective polymeric coating on a silicon or silicon-carbide electrode of a plasma processing chamber are provided. The polymeric coating provides protection to the underlying surface of the electrode with respect to exposure to constituents of... | 06/05/2007 |
| 7223702 | Method of and apparatus for performing sequential processes requiring different amounts of time in the manufacturing of semiconductor devices A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each... | 05/29/2007 |
| 7223446 | Plasma CVD apparatus and dry cleaning method of the same In a parallel flat plate type plasma CVD apparatus, plasma damage of constituent parts in a reaction chamber due to irregularity of dry cleaning in the reaction chamber is reduced and the cost is lowered. In the parallel flat plate type plasma CVD apparatus in which... | 05/29/2007 |
| 7220448 | Glass molding die and renewing method thereof A glass molding die and renewing method thereof. The molding die for molding glass includes a substrate, a first noble metal layer overlying the substrate, a second noble metal layer overlying the first noble metal layer, a carbon-containing third noble metal layer ... | 05/22/2007 |
| 7220665 | H plasma treatment Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive l... | 05/22/2007 |
| 7221495 | Thin film precursor stack for MEMS manufacturing This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a ... | 05/22/2007 |