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| Number | Title | Issue Date |
| 7829153 | Microwave-attenuating composite materials, methods for preparing the same, intermediates for preparing the same, devices containing the same, methods of preparing such a device, and methods of attenuating microwaves The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials. ... | 11/09/2010 |
| 7829152 | Electroless plating method and apparatus An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also... | 11/09/2010 |
| 7425256 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 09/16/2008 |
| 7416763 | Process for forming metal layers A process in which a base metal film is formed on the surface of a plastic film using a dry plating process, and a liquid containing an organic monomer is then brought in contact with the base metal film, thereby selectively forming a conductive organic polymer coat... | 08/26/2008 |
| 7410650 | Method of fabricating nano-silver fibers A method of fabricating nano-silver fibers is provided. An organic solution of a dispersant is prepared. Then, a silver salt and a reductant are added into the organic solution. The organic solution is stirred to let the silver salt and the reductant react to form s... | 08/12/2008 |
| 7399501 | Gas sensor manufacturing process A process for manufacturing a gas sensor including a detecting element having an electrode containing a precious metal formed on a surface of a solid electrolyte, comprising: a first step of applying a nuclei of a precious metal having a catalyzing action on a gas t... | 07/15/2008 |
| 7384458 | Non-cyanide electroless gold plating solution and process for electroless gold plating The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electrol... | 06/10/2008 |
| 7354733 | Method for sorting and separating living cells We disclose methods of sorting or separating mixtures of living cells (e.g., eukaryotic, prokaryotic, mammalian, pathogenic, bacterial, viral, etc.). We perform our methods by activating cell-selective photophoric labels, which photosensitize and chemically reduce a... | 04/08/2008 |
| 7351448 | Anti-reflective coating on patterned metals or metallic surfaces An apparatus and process for coating surfaces of metal or metallic components including providing at least one metal having a patterned outer surface exhibiting an optical reflection greater than about 40%, providing at least one anti-reflective coating material, th... | 04/01/2008 |
| 7338686 | Method for producing conductive particles The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mai... | 03/04/2008 |
| 7332193 | Cobalt and nickel electroless plating in microelectronic devices An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing... | 02/19/2008 |
| 7332198 | Plating apparatus and plating method There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease th... | 02/19/2008 |
| 7329363 | Method of forming a hydrophobic coating layer on a surface of a nozzle plate for an ink-jet printhead A method of forming a hydrophobic coating layer on a surface of a nozzle plate for an ink-jet printhead includes preparing a nozzle plate having a nozzle, forming a metal layer on a surface of the nozzle plate, forming a material layer covering the metal layer, sele... | 02/12/2008 |
| 7323218 | Synthesis of composite nanofibers for applications in lithium batteries Methods of fabricating one-dimensional composite nanofiber on a template membrane with porous array by chemical or physical process are disclosed. The whole procedures are established under a base concept of “secondary template”. First of all, tubular first nano... | 01/29/2008 |
| 7320936 | Plating of multi-layer structures An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an i... | 01/22/2008 |
| 7314650 | Method for fabricating sputter targets Sputter targets comprising a target backing plate and a target deposit, are manufactured using electroless and electrolytic deposition of metal and metal alloys on a surface of the target backing plate. Portions of the target backing plate other than the surface can... | 01/01/2008 |
| 7297373 | Conductive composites A conductive composite material formed from an organic polymer base, a highly conductive metal interlayer, and an electroless nickel top layer is described. The composite material may be electrically conductive and resistant to corrosion. The highly conductive metal... | 11/20/2007 |
| 7294934 | Low-K dielectric structure and method A low-k dielectric sacrificial material is formed within a microelectronic structure covered with a suitable porous or low density permeable material. At an appropriate time, the underlying sacrificial material is decomposed and diffused away through the overlying p... | 11/13/2007 |
| 7288177 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 10/30/2007 |
| 7288287 | Circuit formation part and manufacturing method for this circuit formation part The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and ... | 10/30/2007 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7241372 | Plating apparatus and plating liquid removing method A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with... | 07/10/2007 |
| 7241479 | Thermal CVD synthesis of nanostructures The present invention is generally directed to a novel process for the production of nanowires and nanobelts and the novel nanostructures which can be produced according to the disclosed processes. The process can be carried out at ambient pressure and includes loca... | 07/10/2007 |
| 7235483 | Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth The method of the invention comprises accumulating experimental data or obtaining existing data with regard to the optimal time-temperature relationship of the deposition process on various film-formation stages for various materials, forming nuclei of a selected ma... | 06/26/2007 |
| 7223694 | Method for improving selectivity of electroless metal deposition A method of depositing a metal cladding on conductors in a damascene process is described. The potential between, for instance, cobalt ions in electroless solution and the surface of an ILD between the conductors is adjusted so as to repel the metal from the ILD. | 05/29/2007 |
| 7220296 | Electroless plating baths for high aspect features An electroless plating bath for filling high aspect ratio features with copper metal comprises water, a water soluble copper containing compound having an initial concentration of 0.5 to 50 g/L, a catalyst reducing agent having an initial concentration of 0.02 to 1.... | 05/22/2007 |
| 7204871 | Metal plating process A process for forming a coating on a metal substrate includes contacting the substrate with a molybdate solution having a pH of between 3.5 and 5 inclusive containing an acid with the proviso that the acid is not nitric acid. The substrate is contacted with the solu... | 04/17/2007 |
| 7176133 | Controlled electroless plating An electroless metal deposition process to make a semiconductor device uses a plating bath solution having a reducing agent. A sample of the bath solution is taken and the pH of the sample is increased. The hydrogen evolved from the sample is measured. The hydrogen ... | 02/13/2007 |
| 7172785 | Process for deposition of metal on a surface The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding... | 02/06/2007 |
| 7169215 | Copper molybdenum electroless deposition process and materials Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a solu... | 01/30/2007 |
| 7163835 | Method for producing thin semiconductor films by deposition from solution A method is described for producing thin semiconductor films on a substrate by contacting a substrate with a solution containing a metal salt, a source of a Group VIa element, and chelating agent, and a noble metal in its elemental form. The resulting semiconductor ... | 01/16/2007 |
| 7138014 | Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/21/2006 |
| 7112349 | Method and treating hinge holder A method for treating a hinge holder includes the following steps: polishing a surface of the hinge holder; degreasing the hinge holder; cleaning the hinge holder; baking the hinge holder; cooling the hinge holder; screen-printing a part of the surface of the hinge ... | 09/26/2006 |
| 7087104 | Preparation of electroless deposition solutions A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electrol... | 08/08/2006 |
| 7084059 | CMP system for metal deposition A system for dished metal redevelopment by providing a metal deposition solution at an interface between a moving semiconductor wafer and a moving polishing pad, which deposits metal onto dished metal in trenches in a layer of an interlayer dielectric; and by polish... | 08/01/2006 |
| 7081680 | Self-aligned corrosion stop for copper C4 and wirebond An electrical structure including a substrate and an interconnect. The substrate includes an electrically conductive and corrosion resistant metallic layer on a metal layer. The interconnect is electrically coupled to the metallic layer. A top surface of the metalli... | 07/25/2006 |
| 7078796 | Corrosion-resistant copper bond pad and integrated device The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt... | 07/18/2006 |
| 7078340 | Metal deposit process Method and system for controllable deposit of copper onto an exposed surface of a workpiece, such as a semiconductor surface. A seed thickness of copper is optionally deposited onto the exposed surface, preferably using oxygen-free liquid ammonia to enhance this dep... | 07/18/2006 |
| 7067172 | Component formation via plating technology Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typica... | 06/27/2006 |
| 7063762 | Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 06/20/2006 |
