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| Number | Title | Issue Date |
| 7407689 | Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of t... | 08/05/2008 |
| 7354354 | Article comprising a fine-grained metallic material and a polymeric material Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2 nm to 5,000 nm, a thickness between 25 micron and 5 cm, and a hardne... | 04/08/2008 |
| 7351448 | Anti-reflective coating on patterned metals or metallic surfaces An apparatus and process for coating surfaces of metal or metallic components including providing at least one metal having a patterned outer surface exhibiting an optical reflection greater than about 40%, providing at least one anti-reflective coating material, th... | 04/01/2008 |
| 7338686 | Method for producing conductive particles The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mai... | 03/04/2008 |
| 7314650 | Method for fabricating sputter targets Sputter targets comprising a target backing plate and a target deposit, are manufactured using electroless and electrolytic deposition of metal and metal alloys on a surface of the target backing plate. Portions of the target backing plate other than the surface can... | 01/01/2008 |
| 7297373 | Conductive composites A conductive composite material formed from an organic polymer base, a highly conductive metal interlayer, and an electroless nickel top layer is described. The composite material may be electrically conductive and resistant to corrosion. The highly conductive metal... | 11/20/2007 |
| 7279407 | Selective nickel plating of aluminum, copper, and tungsten structures A method of selectively plating nickel on an intermediate semiconductor device structure. The method comprises providing an intermediate semiconductor device structure having at least one aluminum or copper structure and at least one tungsten structure. One of the a... | 10/09/2007 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7256115 | Asymmetric plating A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of eithe... | 08/14/2007 |
| 7252714 | Apparatus and method for thermally controlled processing of microelectronic workpieces Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing ... | 08/07/2007 |
| 7239747 | Method and system for locating position in printed texts and delivering multimedia information Apparatus and methods are disclosed for processing printed material to provide an index of locations within the printed material that can be associated with external actions such as displaying a graphical image, providing an audio or video output, or providing a mul... | 07/03/2007 |
| 7189313 | Substrate support with fluid retention band An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath ... | 03/13/2007 |
| 7166502 | Method of manufacturing a thin film transistor The present invention discloses a method of manufacturing a thin film transistor, including: preparing a substrate and a mixed solution, the mixed solution having a reductant and a first metal; forming a photoresist pattern on the substrate; etching a portion of the... | 01/23/2007 |
| 7160583 | Microfabrication using patterned topography and self-assembled monolayers A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolaye... | 01/09/2007 |
| 7138014 | Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/21/2006 |
| 7132124 | Die for molding honeycomb structure and manufacturing method thereof In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 μm by forming the coating layer by a substrate layer with a th... | 11/07/2006 |
| 7062850 | Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length A method of forming an electrical conductor, comprising forming electrically conductive segments incorporating electromigration-inhibiting plugs. A row of windows is formed in a planar surface and electromigraation-inhibiting material is deposited over the planar su... | 06/20/2006 |
| 7060364 | Film carrier tape for mounting electronic devices thereon A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devic... | 06/13/2006 |
| 6998151 | Method for applying a NiAl based coating by an electroplating technique The present invention provides a method to coat an article using a plating process, either electroless or electrolytic, whereby nickel is plated on the article using a solution that includes a suspension of powders or containing one or more of the following elements... | 02/14/2006 |
| 6936302 | Electroless Ni-B plating liquid, electronic device and method for manufacturing the same There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexin... | 08/30/2005 |
| 6919011 | Complex waveform electroplating A method of electroplating an object includes providing a electroplating bath solution with one or more anodes therein, disposing an object to be electroplated in the bath, and passing a complex current waveform between the anode nodes and the object. The waveform i... | 07/19/2005 |
| 6913791 | Method of surface treating titanium-containing metals followed by plating in the same electrolyte bath and parts made in accordance therewith A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surfa... | 07/05/2005 |
| 6911269 | Lead-free chemical nickel alloy Lead-free chemically produced nickel alloy containing nickel, phosphorus, bismuth and antimony, process for the production of such a nickel alloy by externally electroless metal deposition in an aqueous electrolyte and articles plated therewith. ... | 06/28/2005 |
| 6908504 | Electroless plating bath composition and method of using The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures... | 06/21/2005 |
| 6905622 | Electroless deposition method Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substr... | 06/14/2005 |
| 6902765 | Method for electroless metal plating A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selecti... | 06/07/2005 |
| 6824666 | Electroless deposition method over sub-micron apertures An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/30/2004 |
| 6800121 | Electroless nickel plating solutions This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous... | 10/05/2004 |
| 6797312 | Electroless plating solution and process Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be ... | 09/28/2004 |
| 6790481 | Corrosion-resistant heat exchanger A corrosion-resistant, copper-finned heat exchanger for a water heater is provided. The heat exchanger includes a conduit through which water runs, heat-transfer fins extending from the conduit and an anti-corrosive coating containing electroless nickel. The heat-tr... | 09/14/2004 |
| 6783807 | Method for coating apparatuses and parts of apparatuses for the construction of chemical installations The surfaces of apparatuses and apparatus parts for chemical plant construction, including, for example, apparatus, container and reactor walls, discharge apparatuses, fittings, pumps, filters, compressors, centrifuges, columns, heat exchangers, dryers, comminuting ... | 08/31/2004 |
| 6780467 | Plating pretreatment agent and metal plating method using the same The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is trea... | 08/24/2004 |
| 6780456 | Method of manufacturing electronic part, electronic part and electroless plating method A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni s... | 08/24/2004 |
| 6767817 | Asymmetric plating A method and apparatus are disclosed for forming a tapered contact structure over a contact pad. The tapered contact structure may be used to securely anchor an overlying solder bump or solder ball. Additionally, the tapered contact structure allows the use of eithe... | 07/27/2004 |
| 6767392 | Displacement gold plating solution The present invention provides a non-cyanide displacement gold plating solution with which even an electroless nickel-boron plated or electrolytic nickel plated substrate can be subjected to displacement gold plating with good adhesion properties and high solderabil... | 07/27/2004 |
| 6761929 | Method for preparation of thermally and mechanically stable metal/porous substrate composite membranes A method is provided for the preparation of metal/porous substrate composite membranes by flowing a solution of metal to be plated over a first surface of a porous substrate and concurrently applying a pressure of gas on a second surface of the porous substrate, suc... | 07/13/2004 |
| 6733823 | Method for electroless gold plating of conductive traces on printed circuit boards A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid ... | 05/11/2004 |
| 6706329 | Local nickel plating for aluminum alloy radiator A method for locally nickel-plating an aluminum alloy fin structure including placing the aluminum alloy fin structure on a sponge that is located at the bottom of a “zinc” tank containing a volume of zinc chemical solution for zinc plating; and thereafter rotat... | 03/16/2004 |
| 6706422 | Electroless Ni—B plating liquid, electronic device and method for manufacturing the same There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexin... | 03/16/2004 |
| 6685990 | Nodule-free electroless nip plating Abnormal nodule formation during electroless plating, e.g., of amorphous NiP "seed" layers utilized in the manufacture of magnetic recording media, is eliminated or substantially reduced by performing the electroless plating process in an apparatus employ... | 02/03/2004 |
