Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 7367118 | Method for forming metal wires by microdispensing pattern A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a cat... | 05/06/2008 |
| 7354354 | Article comprising a fine-grained metallic material and a polymeric material Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2 nm to 5,000 nm, a thickness between 25 micron and 5 cm, and a hardne... | 04/08/2008 |
| 7354870 | Process for chemical etching of parts fabricated by stereolithography A process for chemically etching a stereolithography resin involves chemically etching a shaped object of the resin at a temperature in a range of from about 20° C. to about 30° C. for a time of from about 30 seconds to about 60 seconds with a saturated aqueous so... | 04/08/2008 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 02/19/2008 |
| 7305761 | Method for manufacturing wiring substrate A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the gr... | 12/11/2007 |
| 7288287 | Circuit formation part and manufacturing method for this circuit formation part The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and ... | 10/30/2007 |
| 7267862 | Controlled COF films Disclosed are methods and compositions of films using selected blends of primary and secondary fatty amide additives at critical ratios, which enable the primary fatty amides to interact favorably with the secondary amides so as to provide controlled COF and other u... | 09/11/2007 |
| 7205098 | Method for manufacturing high-transmittance optical filter for image display devices A method for manufacturing a high-transmittance optical filter for image display devices, which may include the steps of coating a photocatalytic compound on a transparent substrate to form a photocatalytic film, selectively exposing the photocatalytic film to light... | 04/17/2007 |
| 7205265 | Cleaning compositions and methods of use thereof A remover composition and method for removing resists from substrates containing nucleophilic amine and at least one solvent is described. Optionally, a chelating agent can also be included in the remover composition. The remover composition is especially suitable f... | 04/17/2007 |
| 7144817 | Etching solutions and processes for manufacturing flexible wiring boards The disclosure relates to methods and solutions for precisely and rapidly etching a polyimide resin layer. Etching solutions of the present invention include 3–65% by weight of a diol containing 3 to 6 carbon atoms or a triol containing 4 to 6 carbon atoms, 10–5... | 12/05/2006 |
| 7138014 | Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/21/2006 |
| 7067470 | Fabric care compositions having reduced fabric abrasion The present in relates to fabric enhancement compositions which provide reduced fabric abrasion damage. ... | 06/27/2006 |
| 7049234 | Multiple stage electroless deposition of a metal layer A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactiv... | 05/23/2006 |
| 7041606 | Electroless deposition of doped noble metals and noble metal alloys A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with t... | 05/09/2006 |
| 7033648 | Means of seeding and metallizing polyimide A method to selectively metallize polyimide with an all-electroless process. ... | 04/25/2006 |
| 7028399 | Wiring process The present invention provides a process for wiring electrical contact sites, in particular on the surface of an electronic or microelectronic component, with the following steps: applying and patterning at least one dielectric on the component surface; currentlessl... | 04/18/2006 |
| 7026012 | Method and apparatus for forming a metallic feature on a substrate A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp t... | 04/11/2006 |
| 7008871 | Selective capping of copper wiring Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during el... | 03/07/2006 |
| 6923919 | Liquid crystal polymers for flexible circuits A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the ... | 08/02/2005 |
| 6905622 | Electroless deposition method Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substr... | 06/14/2005 |
| 6905726 | Component having at least two mutually adjacent insulating layers and corresponding production method The invention relates to a component having two adjacent insulating layers and to a production process therefore. The component has an activated insulating layer, which can be converted into an electrically conductive layer by metallization. ... | 06/14/2005 |
| 6875260 | Copper activator solution and method for semiconductor seed layer enhancement The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at lea... | 04/05/2005 |
| 6863936 | Method of forming selective electroless plating on polymer surfaces A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippab... | 03/08/2005 |
| 6861097 | Electroless plating processes The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, mangane... | 03/01/2005 |
| 6802985 | Method for fabricating metal wirings There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film ... | 10/12/2004 |
| 6776826 | Composition and method for electroless plating of non-conductive substrates Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and appro... | 08/17/2004 |
| 6774049 | Electroless deposition of doped noble metals and noble metal alloys A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal salt with t... | 08/10/2004 |
| 6770369 | Conductive electrolessly plated powder, its producing method, and conductive material containing the plated powder A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic pow... | 08/03/2004 |
| 6740425 | Method for manufacturing copper-resin composite material A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst ac... | 05/25/2004 |
| 6712948 | Process for metallizing a plastic surface A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treat... | 03/30/2004 |
| 6706326 | Process for plating plastics using a catalytic filler A process for the deposition of a metal on surfaces of a shaped plastic body. A catalyst for metal deposition is incorporated into a shaped body. After removing material from a surface of the body and activating the catalyst with an acid, metal is deposited on the s... | 03/16/2004 |
| 6645557 | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; cont... | 11/11/2003 |
| 6638564 | Method of electroless plating and electroless plating apparatus A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in a... | 10/28/2003 |
| 6610365 | Methods of producing conductor layers on dielectric surfaces A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched i... | 08/26/2003 |
| 6599563 | Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various processing solutions that require elevated temperatures, and ... | 07/29/2003 |
| 6589593 | Method for metal coating of substrates A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electro... | 07/08/2003 |
| 6582767 | Metal pattern forming method A method for forming a metal pattern by the micro-stamping process involves the steps of treating a substrate bearing a thin film of a reducing silicon polymer with a solution containing a salt of a metal having a standard oxidation-reduction potential of... | 06/24/2003 |
| 6534117 | Electroless plating method and electroless plating solution When a barrier layer formed on a surface of a contact hole is subjected to electroless plating of copper, a salt of a metal such as gold, nickel, palladium, cobalt or platinum is added as a plating accelerator in an amount of 1 mol % or less based on a co... | 03/18/2003 |
| 6521285 | Method for printing a catalyst on substrates for electroless deposition Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substr... | 02/18/2003 |
| 6518198 | Electroless deposition of doped noble metals and noble metal alloys A method for forming an oxidation barrier including at least partially immersing a semiconductor device structure in an electroless plating bath that includes at least one metal salt and at least one reducing agent. The reaction of the at least one metal ... | 02/11/2003 |
