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| Number | Title | Issue Date |
| 7429401 | Superconformal metal deposition using derivatized substrates The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal proce... | 09/30/2008 |
| 7367118 | Method for forming metal wires by microdispensing pattern A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a cat... | 05/06/2008 |
| 7311615 | Golf club head with ceramic layer A hollow club head having an aluminum alloy base material covered with another material layer of Ni or Ni/P with ceramic granules. The thickness of the material layer on the striking face is thicker than on the rest of the club head. The material layer has a hardnes... | 12/25/2007 |
| 7297451 | Black matrix, method for the preparation thereof, flat display device and electromagnetic interference filter employing the same A novel black matrix, a method for preparing the same, and a flat display device and an electromagnetic interference filter to which the black matrix is applied. The black matrix is prepared by exposing a photoactive compound to form a latent pattern of nuclei for c... | 11/20/2007 |
| 7268365 | Volatile copper (II) complexes and reducing agents for deposition of copper films by Atomic Layer Deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. ... | 09/11/2007 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—... | 09/04/2007 |
| 7264453 | Horizontal scroll compressor having a connecting passage on the opposite side of a suction port for connecting a motor accommodating chamber with a suction chamber A motor accommodating chamber accommodates an electric motor such that a rotation axis of the motor is substantially horizontal. The pressure in the motor accommodating chamber is equal to the pressure in a suction chamber. A connecting passage connects a bottom por... | 09/04/2007 |
| 7229923 | Multi-step process for forming a barrier film for use in copper layer formation Methods for forming robust copper structures include steps for providing a substrate with an insulating layer with openings formed therein. At least two barrier layers are then formed followed by the deposition of a copper seed layer which is annealed. Bulk copper d... | 06/12/2007 |
| 7205422 | Volatile metal β-ketoiminate and metal β-diiminate complexes Metal ketoiminate or diiminate complexes, containing copper, silver, gold, cobalt, ruthenium, rhodium, platinum, palladium, nickel, osmium, or indium, and methods for making and using same are described herein. In certain embodiments, the metal complexes described h... | 04/17/2007 |
| 7205098 | Method for manufacturing high-transmittance optical filter for image display devices A method for manufacturing a high-transmittance optical filter for image display devices, which may include the steps of coating a photocatalytic compound on a transparent substrate to form a photocatalytic film, selectively exposing the photocatalytic film to light... | 04/17/2007 |
| 7202159 | Diffusion barriers comprising a self-assembled monolayer The present invention provides a method for forming a diffusion barrier layer, a diffusion barrier in an integrated circuit and an integrated circuit. The method for forming a diffusion barrier involves the following steps: 1) preparing a silicon substrate; 2) conta... | 04/10/2007 |
| 7189615 | Single mask MIM capacitor and resistor with in trench copper drift barrier The formation of a MIM (metal insulator metal) capacitor (164) and concurrent formation of a resistor (166) is disclosed. A copper diffusion barrier (124) is formed over a copper deposition (110) that serves as a bottom electrode (170 | 03/13/2007 |
| 7166152 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components... | 01/23/2007 |
| 7147896 | Electroless nickel plating method for the preparation of zirconia ceramic An electroless nickel plating method for the preparation of zirconia ceramic material. The surface of the zirconia ceramic material is first cleaned of contaminants. This is followed by an etching step where the surface of the material is etched by an acid. Then, ac... | 12/12/2006 |
| 7138014 | Electroless deposition apparatus An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/21/2006 |
| 7112349 | Method and treating hinge holder A method for treating a hinge holder includes the following steps: polishing a surface of the hinge holder; degreasing the hinge holder; cleaning the hinge holder; baking the hinge holder; cooling the hinge holder; screen-printing a part of the surface of the hinge ... | 09/26/2006 |
| 7087774 | Volatile copper(II) complexes and reducing agents for deposition of copper films by atomic layer deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. ... | 08/08/2006 |
| 7087268 | Method of plating a golf club head A method (10 or 20) for plating a component of a golf club head (42) is disclosed herein. The component of the golf club head that is plated is preferably composed of a metal material selected from the group consisting of magnesium alloys, alumi... | 08/08/2006 |
| 7071026 | Production method for making film carrier tape for mounting electronic devices thereon A film carrier tape for mounting electronic devices thereon has a tin-bismuth alloy deposit in which the bismuth content in the deposit is substantially uniform along a thickness direction thereof. The film carrier tape can be produced by plating at least a part of ... | 07/04/2006 |
| 7063762 | Circuitized substrate and method of making same A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating... | 06/20/2006 |
| 7063779 | Method for manufacturing metal-coated optical fiber The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, ... | 06/20/2006 |
| 7056448 | Method for forming circuit pattern A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper ... | 06/06/2006 |
| 7026012 | Method and apparatus for forming a metallic feature on a substrate A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp t... | 04/11/2006 |
| 7001641 | Seed layer treatment Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surf... | 02/21/2006 |
| 6996425 | Cellular phone housing There is provided a cellular phone housing formed with a base made of a resin material by molding, wherein the base is coated with a metal multilayer including a lower metal layer formed on a surface of the base with metal plating and an upper metal layer formed on ... | 02/07/2006 |
| 6992389 | Barrier for interconnect and method A method of creating a multi-layered barrier for use in an interconnect, a barrier for an interconnect, and an interconnect including the barrier are disclosed. The method includes creating the multi-layered barrier in a recess of the device terminal by use of a sin... | 01/31/2006 |
| 6969541 | Method and device for structuring a surface to form hydrophilic and hydrophobic regions A method for structuring a surface includes, by an assigned modification device, creating a latent structure of at least a first layer of the surface, which has a polymer therein, so as to form hydrophilic and hydrophobic regions for producing a printing form for of... | 11/29/2005 |
| 6960370 | Methods of forming medical devices Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxe... | 11/01/2005 |
| 6949269 | Method for producing vertical patterned layers made of silicon dioxide A method is taught for fabricating patterned silicon dioxide layers on process areas disposed perpendicularly or at an inclination to a substrate surface. Firstly, a starter layer having leaving groups is produced by non-conformal deposition of a reactive component.... | 09/27/2005 |
| 6942351 | Forming a silver coating on a vitreous substrate A process for forming a silver coating on a surface of a vitreous substrate is described. The process comprises an activating step in which said surface is contacted with an activating solution, a sensitising step in which said surface is contacted with a sensitisin... | 09/13/2005 |
| 6933230 | Method for making interconnects and diffusion barriers in integrated circuits The inventor devised methods of forming interconnects that result in conductive structures with fewer voids and thus reduced electrical resistance. One embodiment of the method starts with an insulative layer having holes and trenches, fills the holes using a select... | 08/23/2005 |
| 6932892 | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece A process for applying a metallization interconnect as to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer... | 08/23/2005 |
| 6919013 | Apparatus and method for electrolytically depositing copper on a workpiece A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin see... | 07/19/2005 |
| 6905622 | Electroless deposition method Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substr... | 06/14/2005 |
| 6902765 | Method for electroless metal plating A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selecti... | 06/07/2005 |
| 6899816 | Electroless deposition method Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substr... | 05/31/2005 |
| 6875260 | Copper activator solution and method for semiconductor seed layer enhancement The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at lea... | 04/05/2005 |
| 6875475 | Methods for producing submicron metal line and island arrays This process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. ... | 04/05/2005 |
| 6824665 | Seed layer deposition Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures. ... | 11/30/2004 |
| 6824666 | Electroless deposition method over sub-micron apertures An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble me... | 11/30/2004 |
