Penn Jillette of Penn and Teller fame has patented a "Hydro-Therapeutic Stimulator", which uses a hot tub for stimulation.
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| Number | Title | Issue Date |
| 8182873 | Method for electroless plating and metal-plated article A method for metal plating with good adhesion to materials that are difficult to plate wherein a material to be plated is surface-treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated ... | 05/22/2012 |
| 8168258 | Method of producing a temperature sensor In a method of producing a temperature sensor including at least one lead wire of a non-noble metal or of an alloy containing a non-noble metal, at first a lead wire is attached to the temperature sensor. An oxide layer is removed from at least one portion of the le... | 05/01/2012 |
| 8137752 | Method and apparatus for the treatment of individual filaments of a multifilament yarn A method and apparatus for treating the surfaces of individual filaments in multifilament yarn. The method includes the steps of immersing the yarn into a liquid treatment solution and coating all exposed surface areas of each individual filament with the treatment ... | 03/20/2012 |
| 7959977 | Substrate processing method and apparatus A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting tre... | 06/14/2011 |
| 7867564 | Metal plating method and pretreatment agent The object of the present invention is to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method involves surface treating an article to be plated with a liquid prepared by... | 01/11/2011 |
| 7862860 | Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes,... | 01/04/2011 |
| 7758923 | Method of producing a metallized molded article utilizing a pressurized fluid containing a metal complex The present invention provides a method of producing a molded article, which can be perform the continuous processes and effectively impregnate a modifying material such as metal complexes in the thermoplastic resin for short period of time. The above object is achi... | 07/20/2010 |
| 7666476 | Process of metallizing polymeric foam to produce an anti-microbial and filtration material A method of producing a metallized polymeric foam that produces an anti-microbial material using an advanced method of metallizing polymeric foam with a metal, such as silver. The foam material may be polyurethane, polyester, polyether, or a combination thereof. The... | 02/23/2010 |
| 7527826 | Adhesion of a metal layer to a substrate by utilizing an organic acid material Methods and resulting structures are described in which a metal layer is adhered to a surface of a substrate. The methods involve applying a sacrificial acidic organic layer to the surface of the substrate prior to depositing the metal layer onto the substrate. Duri... | 05/05/2009 |
| 7438950 | Metallic pattern forming method and conductive pattern material The invention provides a metallic pattern forming method comprising: forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide and has a functional group that interacts with either an electroless plating... | 10/21/2008 |
| 7429401 | Superconformal metal deposition using derivatized substrates The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal proce... | 09/30/2008 |
| 7425256 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 09/16/2008 |
| 7410650 | Method of fabricating nano-silver fibers A method of fabricating nano-silver fibers is provided. An organic solution of a dispersant is prepared. Then, a silver salt and a reductant are added into the organic solution. The organic solution is stirred to let the silver salt and the reductant react to form s... | 08/12/2008 |
| 7399501 | Gas sensor manufacturing process A process for manufacturing a gas sensor including a detecting element having an electrode containing a precious metal formed on a surface of a solid electrolyte, comprising: a first step of applying a nuclei of a precious metal having a catalyzing action on a gas t... | 07/15/2008 |
| 7367118 | Method for forming metal wires by microdispensing pattern A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a cat... | 05/06/2008 |
| 7357853 | Electroplating composite substrates An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described. ... | 04/15/2008 |
| 7354354 | Article comprising a fine-grained metallic material and a polymeric material Lightweight articles comprising a polymeric material at least partially coated with a fine-grained metallic material are disclosed. The fine-grained metallic material has an average grain size of 2 nm to 5,000 nm, a thickness between 25 micron and 5 cm, and a hardne... | 04/08/2008 |
| 7338547 | EMI-absorbing air filter Electro-magnetic-energy absorbing materials are used to treat air filters, such as those used in association with electronic equipment thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are processes and materials for ... | 03/04/2008 |
| 7321422 | SERS-active structures having nanoscale dimensions SERS-active structures including features having nanoscale dimensions are disclosed, including methods for forming such SERS-active structures and methods for forming a plurality of such SERS-active structures. Methods for performing SERS using SERS-active structure... | 01/22/2008 |
| 7303939 | Electro- and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 12/04/2007 |
| 7294527 | Method of forming a memory cell The invention relates to the fabrication of a resistance variable material cell or programmable metallization cell. The processes described herein can form a metal-rich metal chalcogenide, such as, for example, silver-rich silver selenide. Advantageously, the proces... | 11/13/2007 |
| 7288177 | Selective shield/material flow mechanism An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the w... | 10/30/2007 |
| 7288287 | Circuit formation part and manufacturing method for this circuit formation part The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and ... | 10/30/2007 |
| 7285494 | Multiple stage electroless deposition of a metal layer A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactiv... | 10/23/2007 |
| 7282387 | Electro- and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 10/16/2007 |
| 7276174 | Pre-treatment of plastic materials The invention concerns a method for chemical attack of the surface of a plastic material with a solution based on sulphuric acid and chromic anhydride, characterised in that (i) the sulphuric acid concentration ranges between 500 and 760 g/l and (ii) the chromic anh... | 10/02/2007 |
| 7268365 | Volatile copper (II) complexes and reducing agents for deposition of copper films by Atomic Layer Deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. ... | 09/11/2007 |
| 7264988 | Electro-and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 09/04/2007 |
| 7261803 | Non-cyanogen type electrolytic solution for plating gold A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethane... | 08/28/2007 |
| 7258898 | Processes for treating coral and coating an object The present invention generally relates to an improved process for the hydrothermal conversion of coral into hydroxyapatite, a process for coating an object with hydroxyapatite, a process for coating an object with a divalent metal phosphate and uses of objects prep... | 08/21/2007 |
| 7245025 | Low cost bonding pad and method of fabricating same A structure and a method of forming the structure. The structure including: an integrated circuit chip having a set of wiring levels from a first wiring level to a last wiring level, each wiring level including one or more damascene, dual-damascene wires or damascen... | 07/17/2007 |
| 7235464 | Patterning method The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomer... | 06/26/2007 |
| 7229923 | Multi-step process for forming a barrier film for use in copper layer formation Methods for forming robust copper structures include steps for providing a substrate with an insulating layer with openings formed therein. At least two barrier layers are then formed followed by the deposition of a copper seed layer which is annealed. Bulk copper d... | 06/12/2007 |
| 7228619 | Method of manufacturing a magnetic head with common seed layer for coil and pedestal A method for fabricating a coil and pedestal for a write head using a common seed layer is described. A nonmetallic gap layer is deposited on a planarized pole piece surface. Openings for the pole piece pedestal and the back gap pole piece are etched through the non... | 06/12/2007 |
| 7223694 | Method for improving selectivity of electroless metal deposition A method of depositing a metal cladding on conductors in a damascene process is described. The potential between, for instance, cobalt ions in electroless solution and the surface of an ILD between the conductors is adjusted so as to repel the metal from the ILD. | 05/29/2007 |
| 7204188 | Method of manufacturing stamper for manufacturing information medium, stamper, and photoresist master A stamper with a sharp uneven pattern for manufacturing high precision information media and a method of manufacturing a stamper. The method includes (1) manufacturing a photoresist master by forming a light absorption layer and a photoresist layer on substrate, (2)... | 04/17/2007 |
| 7205096 | Method for forming metal pattern by using metal nanocrystals Disclosed herein is a method for forming a metal pattern by using metal nanocrystals. The method comprises the steps of: (i) coating a photosensitive compound having a substituent, which is converted into a free carboxyl group by light exposure, on a substrate to fo... | 04/17/2007 |
| 7204886 | Apparatus and method for hybrid chemical processing A method and apparatus for performing multiple deposition processes is provided. In one embodiment, the apparatus includes a chamber body and a gas distribution assembly disposed on the chamber body. In one embodiment, the method comprises positioning a substrate su... | 04/17/2007 |
| 7205098 | Method for manufacturing high-transmittance optical filter for image display devices A method for manufacturing a high-transmittance optical filter for image display devices, which may include the steps of coating a photocatalytic compound on a transparent substrate to form a photocatalytic film, selectively exposing the photocatalytic film to light... | 04/17/2007 |
| 7202159 | Diffusion barriers comprising a self-assembled monolayer The present invention provides a method for forming a diffusion barrier layer, a diffusion barrier in an integrated circuit and an integrated circuit. The method for forming a diffusion barrier involves the following steps: 1) preparing a silicon substrate; 2) conta... | 04/10/2007 |