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| Number | Title | Issue Date |
| 6641775 | Reducing manufacturing and raw material costs for device manufacture with nanostructured powders Methods for lowering processing and raw material costs are disclosed. Specifically, the use of nanostructured powders is disclosed for faster and lower sintering temperatures whereby electrodes currently employing platinum can be substituted with lower me... | 11/04/2003 |
| 6638564 | Method of electroless plating and electroless plating apparatus A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in a... | 10/28/2003 |
| 6638406 | Hydrocarbon sensor and method for producing the same A hydrocarbon sensor of the present invention includes a substrate made of a solid electrolyte that conducts protons, and a pair of electrodes formed on the substrate, and at least one electrode of the pair of electrodes contains Au and Al. Assuming that ... | 10/28/2003 |
| 6630203 | Electroless process for the preparation of particle enhanced electric contact surfaces The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an o... | 10/07/2003 |
| 6618940 | Fine pitch circuitization with filled plated through holes A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metalliz... | 09/16/2003 |
| 6620530 | Synthetic anti-parallel spin valve, having improved robustness, and process to manufacture it A spin valve structure and a method for manufacturing it are described. The spin valve uses a modified pinned layer that consists of two cobalt iron layers separated by a layer of either ruthenium, iridium, or rhodium. A key feature of the invention is th... | 09/16/2003 |
| 6610367 | Use of an array of polymeric sensors of varying thickness for detecting analytes in fluids Chemical sensors for detecting the activity of a molecule or analyte of interest is provided. The chemical sensors comprise and array or plurality of sensors that are capable of interacting with a molecule of interest, wherein the interaction provides a r... | 08/26/2003 |
| 6607804 | Molded part made of an electrically conductive ceramic and process for the production of contact zones on such molded parts A filter having two zones, the first zone having a low electrical conductivity and the second zone having a high electrical conductivity at electrode attachment zones due to infiltration of metal within the second zone.... | 08/19/2003 |
| 6607779 | Nanotechnology for photonic and optical components Nanostructured non-stoichiometric materials are disclosed. Novel photonic materials and their applications are discussed. More specifically, the specifications teach the use of nanotechnology and nanostructured materials for developing novel photonic and ... | 08/19/2003 |
| 6586043 | Methods of electroless deposition of nickel, methods of forming under bump metallurgy, and constructions comprising solder bumps The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to pa... | 07/01/2003 |
| 6586533 | Method of manufacture of polybutadiene and polyisoprene based thermosetting compositions Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic ... | 07/01/2003 |
| 6579565 | Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof A multilayered circuit board is produced by: a. laminating a copper foil conductor layer and a nickel foil or nickel plating etch-stopping layer by simultaneously press-bonding the nickel and copper layer to form a multilayered clad sheet; b. selectively etchi... | 06/17/2003 |
| 6575801 | Method for fabricating cathode in color cathode ray tube Method for fabricating a cathode in a cathode ray tube, the cathode having a cathode sleeve with a heat radiative coating layer formed on an inside wall thereof for emission of thermal electrons, the heat radiative coating layer being formed by a method i... | 06/10/2003 |
| 6576301 | Method of producing contact structure A method for producing a contact structure having a contactor for achieving an electrical connection with a contact target. The method include the steps of providing a substrate, forming a polymer layer on a surface of the dielectric substrate, positionin... | 06/10/2003 |
| 6576365 | Ultra-thin electrochemical energy storage devices An ultra-thin electrochemical multi-cell energy storage device is provided within a single lightweight flexible casing. The energy storage device utilizes perforated isolating frames to form its internal structure. By adhering multi-layer current collecto... | 06/10/2003 |
| 6575552 | Printer head A surface processing method for processing the surface of an insulating article in which an ion-implanted surface-modified layer is effectively formed on the article 2. In surface processing the article 2 of an insulating material, an electrically conduct... | 06/10/2003 |
| 6572930 | Holder for electroless plating and method of electroless plating A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells t... | 06/03/2003 |
| 6569501 | Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) The present invention relates to an enhanced sequential atomic layer deposition (ALD) technique suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and ot... | 05/27/2003 |
| 6565936 | Film laminate comprising a biaxially oriented polyester film with high oxygen barrier, its use and a process for its production A film laminate is disclosed and comprises a biaxially oriented polyester film and another film laminated onto the polyester film, where the polyester film comprises a base layer at least 80% by weight of which is composed of a thermoplastic polyester, at... | 05/20/2003 |
| 6558739 | Titanium nitride/titanium tungsten alloy composite barrier layer for integrated circuits A method for forming a barrier layer upon an electrode contact. There is first provided a silicon substrate layer having an electrode contact region formed within the silicon substrate layer. There is then formed over the silicon substrate layer a titaniu... | 05/06/2003 |
| 6558578 | Conductive paste for the electrical industry and its use Conductive paste for the electrical industry based on at least one elastomer (10) and on an admixture of conducting particles in the form of fibers (20), in which the fibers (20) are flexible and have been embedded in the elastomer (10) in random orientat... | 05/06/2003 |
| 6546607 | Method of manufacturing a crater-style capacitor for high-voltage radio-frequency applications A method for forming a crater-style sampling capacitor. The capacitor includes a dielectric having a smooth crater shaped input electrode on a first surface and output and guard electrodes on a second surface. A sampling capacitor is defined by the input ... | 04/15/2003 |
| 6538147 | Organocopper precursors for chemical vapor deposition The present invention provides a copper precursor according to the formula (R3 COOCR2 COR1)Cu+1 {L}x, where x is 1, 2 or 3 and L is a neutral ligand. The precursors in the present invention, which are... | 03/25/2003 |
| 6533849 | Electroless gold plated electronic components and method of producing the same An neutral electroless gold plating method that minimises "black band" corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to al... | 03/18/2003 |
| 6528181 | Surface-treated steel sheet having lowered contact resistance and connecting terminal members made by using the same A plated steel sheet and a connection terminal material using the plated steel sheet have low contact resistance and excellent corrosion resistance. The coated film, which has excellent adhesion, is formed by coating a stainless steel base sheet which is ... | 03/04/2003 |
| 6517896 | Spin filter bottom spin valve head with continuous spacer exchange bias A high performance specular free layer bottom spin valve is disclosed. This structure made up the following layers: NiCr/MnPt/CoFe/Ru/CoFe/Cu/free layer/Cu/Ta or TaO/Al2 O3. A key feature is that the free layer is made of a very thin... | 02/11/2003 |
| 6517939 | Noble metal coated substrate pigments A silver/gold coated laminar substrate pearlescent product is improved by incorporating rhodium in an amount of up to about 2% into the coating and/or by overcoating with a silane in an amount of up to about 5%.... | 02/11/2003 |
| 6514575 | Magnetic composites exhibiting distinct flux properties due to gradient interfaces Magnetic composites exhibit distinct flux properties due to gradient interfaces. The composites can be used to improve fuel cells and effect transport and separation of different species of materials. A variety of devices can be made utilizing the composi... | 02/04/2003 |
| 6514559 | Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate A novel process for producing an electron source substrate is disclosed for formation of electron-emitting element at high efficiency with less shape irregularity. In the process, the region for electroconductive film formation is divided into plural subr... | 02/04/2003 |
| 6514453 | Thermal sensors prepared from nanostructureed powders This invention describes a method of rapidly monitoring the temperature of a medium and a method of preparing a quantum confined device that can enable such measurements. The monitoring principle uses changes in impedance of nanostructured devices, i.e. d... | 02/04/2003 |
| 6503356 | Chip element holder and method of handling chip elements Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing f... | 01/07/2003 |
| 6500498 | Method for fabricating a magneto-optic modulator A method for fabricating a magneto-optic modulator, such as for use with a solid state ring resonator gyroscope. The method includes inducing a magnetic field at a substrate holder as a layer of magnetic material is being deposited on a substrate. The mag... | 12/31/2002 |
| 6495001 | Method for manufacturing a metallic composite strip A method for manufacturing a metal composite strip for the production of electrical contact components. A film made of tin or a tin alloy is first applied onto an initial material made of an electrically conductive base material. A film of silver is then ... | 12/17/2002 |
| 6495224 | Functionally enhanced protective shrink-wrap coverings and methods for their manufacture and use Functionally enhanced shrink-wrap materials having protective coatings composed of mixtures of a water-compatibilized, modified polyolefin resins (Component A) and a mixture of a water-compatibilized acrylic resin (Component B) and a water-compatibilized ... | 12/17/2002 |
| 6488981 | Method of manufacturing a touch screen panel A method of manufacturing a touch screen panel, the method including applying a resistive coating to one surface of an insulative substrate, applying an insulative protective coating to the resistive coating, depositing a conductive edge electrode pattern... | 12/03/2002 |
| 6479095 | Composite material for heat sinks for semiconductor devices and method for producing the same A high-pressure vessel is allowed to be in an initial state, and a first chamber is disposed downward. Copper or copper alloy is placed in the first chamber, and SiC is set in a second chamber. The high-pressure vessel is tightly sealed, and then the insi... | 11/12/2002 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste A process wherein a low viscosity, metal-containing paste is screened onto a ceramic greensheet and then sets up to increase its viscosity. In one method, the low viscosity is caused by excess solvent which is then blotted or otherwise removed so that the... | 11/05/2002 |
| 6465347 | Tungsten film forming method A method of forming a tungsten film is capable of forming a tungsten film having a low resistivity. The method of forming a tungsten film (50) on a surface of a workpiece by a vacuum processing system (2) comprises, in sequential steps: a seed crystal gro... | 10/15/2002 |
| 6458411 | Method of making a mechanically compliant bump Mechanically compliant bumps for flip-chip bonding have a base that is deposited, for example, on the contact pad of a semiconductor chip. A thin wall depends from the periphery of the upper surface of base. The wall advantageously completely encircles th... | 10/01/2002 |
| 6451375 | Process for depositing a film on a nanometer structure A process of depositing a thin film on a nanometer structure in which a coating, which may be an aerogel material or metallic seed layer, is prepared. The coating is combined with a supercritical composition to form a supercritical coating composition. Th... | 09/17/2002 |
