...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 7326889 | PTC element and production process thereof A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline ... | 02/05/2008 |
| 7241478 | Process for coating three-dimensional substrates with thin organic films and products The present invention relates to an apparatus and process for producing a thin organic film on a substrate using an ultrasonic nozzle to produce a cloud of micro-droplets in a vacuum chamber. The micro-droplets move turbulently within the vacuum chamber, isotropical... | 07/10/2007 |
| 7239160 | Method of electrical testing of an integrated circuit with an electrical probe A method of electrical testing devices such as integrated circuits that include conductive pads formed on the surface. A material having a desired bulk resistivity and viscosity is applied to either the device or the electrical probe prior to testing. The applicatio... | 07/03/2007 |
| 7214295 | Method for tantalum pentoxide moisture barrier in film resistors The present invention discloses a method of manufacturing a thin film resistor with a moisture barrier by depositing a metal film layer on a substrate and depositing a layer of tantalum pentoxide film overlaying the metal film layer. The present invention also inclu... | 05/08/2007 |
| 7132840 | Method of electrical testing A method of electrical testing devices such as integrated circuits that include conductive pads formed on the surface. A material having a desired bulk resistivity and viscosity is applied to either the device or the electrical probe prior to testing. The applicatio... | 11/07/2006 |
| 7089652 | Method of manufacturing flip chip resistor The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a ... | 08/15/2006 |
| 7057490 | Resistor and production method therefor A resistor having reliability in electrical connection between an upper surface electrode and a side face electrode, and in bonding strength between a first thin film and a second thin film is provided. The resistor includes upper surface electrodes formed on a main... | 06/06/2006 |
| 7008565 | Flexible electroconductive foam, and method of preparation thereof A method of preparing an electroconductive foam, and the foam so prepared. An electroconductive polymer such as polyaniline is dispersed in a liquid medium that includes an aromatic solvent such as xylene and an organic dopant/dispersant such as an aromatic sulfonic... | 03/07/2006 |
| 6995984 | Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly The invention relates to an electronic assembly, in particular for low power consumption electric switching devices such as low power contactors, time relays or the like. In order to provide protection against input current pulses, an ohmic resistor (6) is pr... | 02/07/2006 |
| 6935023 | Method of forming electrical connection for fluid ejection device A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection de... | 08/30/2005 |
| 6882509 | GMR configuration with enhanced spin filtering Disclosed is a method of making a SVGMR sensor element. In the first embodiment a buffer layer is formed between a seed layer and a ferromagnetic (FM) free layer, the buffer layer being composed of alpha-Fe2O3 having a crystal lattice constant ... | 04/19/2005 |
| 6824814 | Preparation of LCPMO thin films which have reversible resistance change properties A method of forming a perovskite thin film includes preparing a perovskite precursor solution; preparing a silicon substrate for deposition of a perovskite thin film, including forming a bottom electrode on the substrate; securing the substrate in a spin-coating app... | 11/30/2004 |
| 6808740 | Magnetoresistance effect film and method of forming same A magnetoresistance effect film includes a substrate, a plurality of ferromagnetic particles disposed on the substrate, a nonmagnetic film deposited on the substrate and covering the plurality of ferromagnetic particles, and a pair of electrodes arranged on the nonm... | 10/26/2004 |
| 6711807 | Method of manufacturing composite array structure The present invention provides a method of manufacturing a composite array structure that comprises a plurality of elements of an electrically conductive composite material interconnected by at least one region of an electrically insulating material. The method comp... | 03/30/2004 |
| 6699521 | Method of fabricating a ferroelectric/pyroelectric infrared detector using a crystallographically oriented electrode and a rock salt structure material substrate A method of fabricating an uncooled ferroelectric/pyroelectric infrared detector having a semi-transparent electrode material includes using a lattice matched substrate material and a crystallographically oriented bottom electrode material as a template f... | 03/02/2004 |
| 6663793 | Sol-gel-based composite materials for direct-write electronics applications The present invention relates to a method for producing a low temperature 0-3 composite material, comprising the steps of providing a mixture, wherein the mixture comprises a liquid phase and a particulate phase and wherein the liquid phase comprises a re... | 12/16/2003 |
| 6568265 | Humidity sensor and method for making A humidity sensor includes a pair of interdigital electrodes disposed on an insulating substrate and defining a gap therebetween, an undercoat layer of silane compound lying on the gap-defining electrodes and substrate, and a humidity sensitive thin film ... | 05/27/2003 |
| 6317023 | Method to embed passive components The invention is directed to a method of embedding thick film passive components on an organic substrate wherein a flexible metallic substrate has a conductive paste underprint applied thereon. The method comprises the following steps: applying a conducto... | 11/13/2001 |
| 6315853 | Method for manufacturing an ink jet recording head A method for manufacturing an ink jet recording head by combining each of the processes to fabricate a heater board comprises (I) the first step of patterning a resistive layer on a substrate, (II) the second step of laminating a first protection layer an... | 11/13/2001 |
| 6309695 | Process for the preparation of a thick film resistor useful for making strain gauge This invention particularly relates to a thick film resistor and a process for the preparation of said thick firm resistor useful for making strain gauge with enhanced gauge factor upto 1000. The thick film resistor of the present invention is obtained by... | 10/30/2001 |
| 6303192 | Process to improve adhesion of PECVD cap layers in integrated circuits A method for making a multi-layered integrated circuit structure, includes depositing a methyl compound spin on glass layer over a substrate. The spin on glass layer is treated by plasma-deposition to form a SiO2 skin on the methyl compound spi... | 10/16/2001 |
| 6272736 | Method for forming a thin-film resistor A method for forming a thin-film resistor includes forming two insulators on the thin-film resistor, forming contact holes by performing wet etching processes, and forming interconnect and contact plugs at the same time. The invention also provides anothe... | 08/14/2001 |
| 6269534 | Method for producing an electric resistor and a mechano-electric transducer A method for producing an electric resistor, in particular a resistance strain gauge, in which an insulating layer and a resistive layer are sequentially applied to a carrier element. The insulating layer or the resistive layer is applied to a backing she... | 08/07/2001 |
| 6238741 | Single mask screening process A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure prod... | 05/29/2001 |
| 6232144 | Nickel barrier end termination and method A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal reg... | 05/15/2001 |
| 6187372 | Method for producing large area thick film resistors with uniform thickness A method for creating large area, thick film resistors with improved predictability and uniformity. "Tent poles" are employed during the printing of the large area resistors to prop up the screen mesh to ensure the resultant resistor does not have a scoop... | 02/13/2001 |
| 6180164 | Method of forming ruthenium-based thick-film resistors A method for forming a ruthenium-based thick-film resistor having copper terminations, in which the thick-film resistor is fired in a non-oxidizing atmosphere so as not to oxidize the copper terminations yet without reducing the thick-film resistor to met... | 01/30/2001 |
| 6174606 | Corrosion and dissolution protection of a conductive silver/polymer composite A conductive composite is described containing silver particles and a polymer which covers each silver particle and wherein a heterocyclic organic compound containing nitrogen such as benzotriazole (BTA) is present to reduce Ag dissolution and ion mobilit... | 01/16/2001 |
| 6171644 | Electronic component and method of manufacture therefor The present invention aims to present an electronic component which is free from the fear of sneaking-in of water etc. from the edge of electrode, by covering the electrode edge with resin. For the purpose, external electrodes (3) are formed at both ends ... | 01/09/2001 |
| 6153256 | Chip resistor and method of making the same A chip resistor includes a spaced pair of main top electrodes on an insulating substrate, a resistor layer formed on the insulating substrate to bridge between the main top electrodes, an overcoat layer formed over the resistor layer, and a pair of auxili... | 11/28/2000 |
| 6136390 | Method for manufacturing a thin film actuatable mirror array having an enhanced structural integrity An inventive method for manufacturing an array of M×N thin film actuatable mirrors, the method being capable of preserving the structural integrity thereof, comprises the steps of: preparing an active matrix; depositing a passivation layer and an etchant... | 10/24/2000 |
| 6127040 | Electroceramic component and method of manufacture thereof Electroceramic component having a component body (10), connection metallization coatings (2, 3) and also a protective encapsulation (15 to 18) made of two different materials on in each case two mutually opposite areas of the component body (10) which are... | 10/03/2000 |
| 6090435 | Electronic component and method for fabricating the same The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer forme... | 07/18/2000 |
| 6047463 | Embedded trimmable resistors A resistor may be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, for instance, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded int... | 04/11/2000 |
| 5935642 | Formation of resistor with small occupied area Resistor material such as polysilicon is deposited on the insulating surface of a substrate and patterned to form resistor layers disposed generally parallel. Another resistor material such as polysilicon is deposited filling each space between adjacent r... | 08/10/1999 |
| 5884391 | Process for manufacturing an electrical device comprising a PTC element An electrical device comprising a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating l... | 03/23/1999 |
| 5874885 | Electrical devices containing conductive polymers An electrical device (1) in which an element (7) composed of a conductive polymer is positioned in contact with the surface layer of one or more metal electrodes (3,5). The metal electrode contains a base layer (9) which comprises a first metal, an interm... | 02/23/1999 |
| 5866196 | Electronic component and method for fabricating the same The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer forme... | 02/02/1999 |
| 5858452 | Method for fabricating wiring substrate with subminiature thru-holes The present invention is an electronic wiring substrate for sensors formed over a subminiature through hole. Because of the small diameter of the through hole, the material that fills the through hole and the through hole itself have an essentially neglig... | 01/12/1999 |
| 5837178 | Method of manufacturing varistor precursors A method for use in making multilayered varistors including the steps of forming a plurality of interleaved layers of ceramic material and conductive material, confining the conductive material to spaced areas arranged in rows and columns, displacing the ... | 11/17/1998 |