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Class 427/102 - Nonuniform coating


Subclass of Class 427 - Coating processes
Definition: Processes wherein the coating is (1) applied only to selected
No. of patents: 184
Last issue date: 10/14/2008


1          
NumberTitleIssue Date
7434475Fabricated strain sensor
A method of forming a strain sensor from a polymeric film includes the steps of selectively irradiating a surface of the polymer with high energy radiation to change the composition of the polymer and increase the electrical conductivity in selected portions of the ...
10/14/2008
7348373Polyimide compositions having resistance to water sorption, and methods relating thereto
Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly r...
03/25/2008
7326889PTC element and production process thereof
A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline ...
02/05/2008
7309830Nanostructured bulk thermoelectric material
A thermoelectric material comprises two or more components, at least one of which is a thermoelectric material. The first component is nanostructured, for example as an electrically conducting nanostructured network, and can include nanowires, nanoparticles, or othe...
12/18/2007
7280247Printer assembly having flexible ink channel extrusion
An elastomeric ink delivery extrusion transports ink and air to printhead modules in an ink jet printhead assembly. A series of patterned holes are laser ablated onto an upper surface of the extrusion. These interface with inlets on the underside of a series of prin...
10/09/2007
7215235Conductive substrate with resistance layer, resistance board, and resistance circuit board
A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface betw...
05/08/2007
7189297Method of manufacturing ESD protection component
A method of manufacturing an Electro Static Discharge (ESD) protection componentin which slurry including varistor particles and a resin binder is produced, and a varistor green sheet is formed from this slurry. A conductor layer is formed on a surface of the varist...
03/13/2007
7151431Resistor element, stress sensor and method for manufacturing them
A stress sensor in which the direction and magnitude of a stress being applied to a post (6) bonded to or integrated with the surface of an insulating board (3) can be grasped from variation in the resistance of a plurality of resistor elements (8
12/19/2006
7067324Photon reducing agents for fluorescence assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon reducing agents). The present invention further provides a method fo...
06/27/2006
6951666Precursor compositions for the deposition of electrically conductive features
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a viscosity of at least about 1000 centipoise and can be deposited by screen printing. The precursor composit...
10/04/2005
6858270Liquid crystal imprinting
Oriented materials and methods for their formation are disclosed. The oriented material is formed by depositing an oriented component from an oriented liquid crystal medium. Oriented materials having multiple layers and methods for their formation are also disclosed...
02/22/2005
6852393Transparent substrate coated with a polymer layer
The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic or organoinorganic nature. The invention also relates to the process...
02/08/2005
6841191Varistor and fabricating method of zinc phosphate insulation for the same
A fabricating method and apparatus of an zinc phosphate coating for a varistor has a insulation formed on a surface of a body which does not include two opposite ends of the body formed two outer terminals. The insulation has anti-etch feature for the electrolyte, s...
01/11/2005
6824603Composition and method for printing resistors, capacitors and inductors
A composition of matter comprising a mixture of an oxide powder or powders and a Reactive Organic Medium (ROM) which can be used to create electronic components on a suitable. The materials are applied to conventional polymer-based circuit substrates by any convenie...
11/30/2004
6808740Magnetoresistance effect film and method of forming same
A magnetoresistance effect film includes a substrate, a plurality of ferromagnetic particles disposed on the substrate, a nonmagnetic film deposited on the substrate and covering the plurality of ferromagnetic particles, and a pair of electrodes arranged on the nonm...
10/26/2004
6787182Resistor and method for producing the resistor
A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a thermosetting binder resin, and a conductive filler. The method further i...
09/07/2004
6725514Method of making thick film pressure and temperature sensors on a stainless steel diaphragm
A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed sur...
04/27/2004
6315853Method for manufacturing an ink jet recording head
A method for manufacturing an ink jet recording head by combining each of the processes to fabricate a heater board comprises (I) the first step of patterning a resistive layer on a substrate, (II) the second step of laminating a first protection layer an...
11/13/2001
6232144Nickel barrier end termination and method
A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal reg...
05/15/2001
6221612Photon reducing agents for use in fluorescence assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon reducing agents). The present invention further provides ...
04/24/2001
6214563Photon reducing agents for reducing undesired light emission in assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon reducing agents). The present invention further provides ...
04/10/2001
6200762Photon reducing agents and compositions for fluorescence assays
The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon reducing agents). The present invention further provides ...
03/13/2001
6187372Method for producing large area thick film resistors with uniform thickness
A method for creating large area, thick film resistors with improved predictability and uniformity. "Tent poles" are employed during the printing of the large area resistors to prop up the screen mesh to ensure the resultant resistor does not have a scoop...
02/13/2001
6171644Electronic component and method of manufacture therefor
The present invention aims to present an electronic component which is free from the fear of sneaking-in of water etc. from the edge of electrode, by covering the electrode edge with resin. For the purpose, external electrodes (3) are formed at both ends ...
01/09/2001
6153256Chip resistor and method of making the same
A chip resistor includes a spaced pair of main top electrodes on an insulating substrate, a resistor layer formed on the insulating substrate to bridge between the main top electrodes, an overcoat layer formed over the resistor layer, and a pair of auxili...
11/28/2000
6146552Zinc oxide ceramics and method for producing the same
Zinc oxide ceramics and a method for producing the same are provided wherein zinc oxide varistors for low and high voltages having excellent electric characteristics and high reliability upon DC loading and surge can be obtained in high yield by low-tempe...
11/14/2000
6127040Electroceramic component and method of manufacture thereof
Electroceramic component having a component body (10), connection metallization coatings (2, 3) and also a protective encapsulation (15 to 18) made of two different materials on in each case two mutually opposite areas of the component body (10) which are...
10/03/2000
6120835Process for manufacture of thick film hydrogen sensors
A thick film process for producing hydrogen sensors capable of sensing down to a one percent concentration of hydrogen in carrier gasses such as argon, nitrogen, and air. The sensor is also suitable to detect hydrogen gas while immersed in transformer oil...
09/19/2000
6090435Electronic component and method for fabricating the same
The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer forme...
07/18/2000
5935642Formation of resistor with small occupied area
Resistor material such as polysilicon is deposited on the insulating surface of a substrate and patterned to form resistor layers disposed generally parallel. Another resistor material such as polysilicon is deposited filling each space between adjacent r...
08/10/1999
5932280Printed circuit board having printed resistors and method of making printed resistors on a printed circuit board using thermal transfer techniques
Resistors for a printed circuit board and methods for making are provided using thermal transfer techniques to transfer coating material having some degree of electrical conductivity from a thermal transfer ribbon to the printed circuit board. Parts of th...
08/03/1999
5900275Method for reducing haze in tin oxide transparent conductive coatings
The haze in a conductive tin oxide coating deposited on a substrate, particularly glass, can be reduced by applying, to a desired thickness, a solid-state coating, where the solid-state layer is applied as a precursor liquid to the tin oxide layer, is the...
05/04/1999
5866196Electronic component and method for fabricating the same
The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer forme...
02/02/1999
5858452Method for fabricating wiring substrate with subminiature thru-holes
The present invention is an electronic wiring substrate for sensors formed over a subminiature through hole. Because of the small diameter of the through hole, the material that fills the through hole and the through hole itself have an essentially neglig...
01/12/1999
5837178Method of manufacturing varistor precursors
A method for use in making multilayered varistors including the steps of forming a plurality of interleaved layers of ceramic material and conductive material, confining the conductive material to spaced areas arranged in rows and columns, displacing the ...
11/17/1998
5766670Via fill compositions for direct attach of devices and methods for applying same
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, ...
06/16/1998
5702653Thick-film circuit element
A thick-film switch element includes a high-temperature glass frit fused to a non-conductive substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into the glass frit layer such that the resulting thick...
12/30/1997
5624782Method of manufacturing thick-film resistor elements
To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision. A method of manufacturing thick-film resistor elements by applying a thick-film resist...
04/29/1997
5614074Zinc phosphate coating for varistor and method
A method of providing a semiconductor device with an inorganic electrically insulative layer, the device having exposed semiconductor surfaces and electrically conductive metal end terminations, in which the device is reacted with phosphoric acid to form ...
03/25/1997
5609910Method for forming thermal-ink heater array using rectifying material
A heater array for an ink jet printhead includes an insulating substrate, which can be a layer of ceramic, flexible plastic, insulated flexible metal, polysilicon, or single crystalline silicon. A first material layer is deposited atop the insulating subs...
03/11/1997
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