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| Number | Title | Issue Date |
| 8105063 | Three piece mold cavity design for packaging integrated circuits One aspect of the present invention relates to a molding system for use in packaging integrated circuits. The molding system includes a top cavity bar, a middle cavity bar, a bottom cavity bar, a tape and an injection unit. When an electronic substrate is positioned... | 01/31/2012 |
| 8057206 | Reconfigurable tooling using variable stiffness material In some embodiments, reconfigurable tooling is provided having an array of actuator columns affixed to a support base. A programmable controller is configured to position the actuator columns. The reconfigurable tooling has a tooling surface which includes a variabl... | 11/15/2011 |
| 8033806 | Apparatus for manufacturing secondary battery Disclosed herein is an apparatus for manufacturing a secondary battery by performing insert injection molding with respect to a portion of a battery cell while the battery cell is located in a mold, wherein the apparatus comprises a pair of upper and lower molds, at... | 10/11/2011 |
| 7837454 | Apparatus for distributing in a thin layer a mix based on agglomerate stone or ceramic material In a plant for producing thin articles in the form of a slab, manufactured with a mix (M) based on agglomerate stone or ceramic material, the mix is distributed in a thin layer on a support (90) using a distributor (100) comprising a hopper (120) and an underlying e... | 11/23/2010 |
| 7690905 | Apparatus for manufacturing semiconductor device An apparatus for manufacturing a semiconductor device is provided. The semiconductor device includes a chip packaged with a resin mold. The apparatus includes a first mold, a second mold, and a buffer sheet. The first mold has a first cavity for forming the resin mo... | 04/06/2010 |
| 7597549 | Moulding The invention provides methods and moulding devices for moulding three-dimensional productions from a mass of foodstuff which is suitable for human consumption, in particular from a mass of meat, in particular chicken. The method comprises filling a mould cavity wit... | 10/06/2009 |
| 7438846 | Apparatus and method for the non-destructive separation of hardened material layers from a flat construction plane An apparatus and a method for the separation of a material layer (4) hardened on a flat plane (2) serving as a reference by means of a flexible, elastic separating layer (1) arranged between plane and material layer and designed in the form of a... | 10/21/2008 |
| 7419372 | Method and apparatus for continuous molding of fiber reinforced plastic member with curvature In a continuous molding apparatus equipped with a long core 10 having a curvature disposed on a plane, a release film supplied from a lower release film feeder 20 is sent onto the core 10, and prepreg sheets supplied from a prepreg sheet feeder ... | 09/02/2008 |
| 7407608 | Resin molding equipment and resin molding method The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section havin... | 08/05/2008 |
| 7371618 | Method of manufacturing wafer-level chip-size package and molding apparatus used in the method Provided are a method of manufacturing wafer-level chip-size packages and a molding apparatus suitable for practicing the method whereby a semiconductor wafer having a plurality of semiconductor chips formed thereon may be encapsulated. The semiconductor wafer, typi... | 05/13/2008 |
| 7364686 | System and method for printing and supporting three dimensional objects A method for printing and supporting a three-dimensional (3-D) object is provided. The method of printing can include dispensing a first interface material for the construction of the three-dimensional object, dispensing a second interface material to form a support... | 04/29/2008 |
| 7347963 | Method of molding resin to protect a resolver winding At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7 | 03/25/2008 |
| 7348220 | Resin-encapsulated type semiconductor packages, and production method and apparatus therefor The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is tak... | 03/25/2008 |
| 7338628 | Resin infused acrylic shell An improved method of forming fiber-reinforced plastic shells for bathtubs utilizes a fiber mat placed on a rear surface of a plastic shell. The fiber mat is infused with a resin, and is then cured. The mat and resin are preferably received within a vacuum chamber a... | 03/04/2008 |
| 7338277 | Stamping device A stamping device stamps characteristic data, especially in the form of code numbers (22), into plastic products. Such containers are preferably produced according to blowing, filling and gelling methods. At least one stamp (32), having a stamping unit... | 03/04/2008 |
| 7306444 | Apparatus and method for forming food products by gradual compression The present invention is directed to methods and apparatuses for processing food products and utilizes a series of guides for moving platens through several operative zones to press a food product intermediate. In particular, the present invention relates to an appa... | 12/11/2007 |
| 7300619 | Compositions and methods for use in three dimensional model printing A pseudo composite material, may include, inter alia, a first phase and a second phase, wherein each phase may include, inter alia, an organic compound, wherein each phase comprising a multiplicity of construction layers, wherein the layers were deposited by ink-jet... | 11/27/2007 |
| 7284973 | Moulding The invention provides methods and moulding devices for moulding three-dimensional products from a mass of foodstuff which is suitable for human consumption, in particular from a mass of meat, in particular chicken. The method comprises filling a mould cavity with a... | 10/23/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7261532 | In-mold decoration apparatus and horizontal direction decorating sheet feeding machine In an in-mold decoration apparatus, with decorating sheets pinched between a fixed mold half and a movable mold half, molten resin is injected into the mold so that the decorating sheets are respectively bonded to surfaces of a resin molded article. The in-mold deco... | 08/28/2007 |
| 7252281 | Apparatus for making a formwork for molding concrete walls A formwork making apparatus includes a bottom block, two side locating boards arranged in parallel on the bottom block, two forming boards respectively adhered to the side locating boards and set facing each other, two blocking plates set between the two side locati... | 08/07/2007 |
| 7242089 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 07/10/2007 |
| 7241414 | Method and apparatus for molding a semiconductor device A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface... | 07/10/2007 |
| 7238251 | Method of preparing cured in place liner using resin impregnation tower A non-pressurized resin impregnation tower for continuously impregnating the resin impregnable layer of a tubular cured in place liner is provided. The tower is at a height to provide sufficient resin pressure head to impregnate the resin impregnable layer fully. Th... | 07/03/2007 |
| 7195472 | Apparatus and method for the non-destructive separation of hardened material layers from a flat construction plane An apparatus and a method for the separation of a material layer (4) hardened on a flat plane (2) serving as a reference by means of a flexible, elastic separating layer (1) arranged between plane and material layer and designed in the form of a... | 03/27/2007 |
| 7192543 | Method and mould for manufacturing a moulded article comprising at least an elastomeric polyurethane skin For manufacturing a moulded article comprising at least an elastomeric polyurethane skin (9) and optionally a structural backing layer (10) and an intermediate foam layer (12) a mould is used having at least a first mould part (1) compris... | 03/20/2007 |
| 7186589 | Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a leadframe. The mold cavity plates also include runners configured to direct... | 03/06/2007 |
| 7179410 | Foam plastics manufacturing method and machine Production of foamed materials in a horizontal machine, and said machine itself, reactants being fed to a conveyor at one end of the machine and foam produced being removed at the other end, wherein the foam is generated in an expansion chamber defined at its inlet ... | 02/20/2007 |
| 7175405 | Compression molding machine A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by th... | 02/13/2007 |
| 7173332 | Placement tool for wafer scale caps A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient of thermal expansion which is about the same as that of the wafer. T... | 02/06/2007 |
| 7160093 | Apparatus for continuously producing artificial marble Disclosed is an apparatus for continuously producing an artificial marble plate capable of simultaneously and uniformly hardening a raw material compound for an artificial marble plate, preventing the warpage of the artificial marble plate, and improving heat transm... | 01/09/2007 |
| 7160098 | String hopper making machine A string hopper making machine has a dough container removably mounted in a vertical manner in a frame. An extrusion piston is mounted on a vertical rod extending through a vertical guide channel formed in a guiding block mounted on the frame. The vertical rod is pi... | 01/09/2007 |
| 7152813 | Cap with a suction type spray head A cap with a suction type spray head includes an air guiding chamber, an intake passage, an outgoing passage, a liquid sucking mouth and an air pressure balancing aperture for a container with a sprayer. The liquid in the container can be sucked out due to air press... | 12/26/2006 |
| 7153116 | Resin molding machine The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a moldi... | 12/26/2006 |
| 7147447 | Plastic semiconductor package having improved control of dimensions A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The enc... | 12/12/2006 |
| 7128869 | Method and device for producing shell-shaped, plastic parts reinforced with fibre mats A process and a production installation for producing shell-shaped, fiber-reinforced plastic parts are provided. The plastic parts can be produced efficiently, in an automated manner which is flexible with respect to the process and workpiece and is operationally re... | 10/31/2006 |
| 7126216 | Two part mold for wafer scale caps The invention provides a two part mold for forming wafer scale caps. The mold has a first half and a second half. The first half and second half, when brought together defining mold cavities for wafer scale caps. The caps have central areas surrounded by sidewalls a... | 10/24/2006 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an inte... | 09/26/2006 |
| 7101935 | Longitudinal shrink films A heat-shrinkable film and a method of its manufacture are provided. In an exemplary embodiment, a polystyrene film exhibits heat-induced growth in the cross direction of great than or equal to 5% with greater than or equal to 30% concomitant shrinkage in the machin... | 09/05/2006 |
| 7101163 | Process and apparatus for the continuous production of slabstock foam Slabstock foam free of cavities can be produced without any restriction, i.e. also from rapidly reacting chemical systems, by introducing the liquid reaction mixture from underneath, in front of, and/or through an optionally swivellable floor plate, wherein the floo... | 09/05/2006 |
