Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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| Number | Title | Issue Date |
| 7419627 | Co-cured vacuum-assisted resin transfer molding manufacturing method According to one embodiment of the invention, a co-cured vacuum-assisted resin transfer molding manufacturing method includes providing a tool base, disposing a prepreg skin panel outwardly from the tool base, disposing one or more tooling details outwardly from the... | 09/02/2008 |
| 7341687 | Method of forming a golf ball The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the p... | 03/11/2008 |
| 7270537 | Non-coaxial injection molding valve flow control In an injection molding machine having upstream and downstream channels communicating with each other for delivering fluid material to one or more mold cavities, apparatus for controlling delivery of the melt material from the channels to the one or more mold caviti... | 09/18/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7234929 | Injection molding flow control apparatus and method In an injection molding machine having upstream and downstream channels communicating with each other for delivering fluid material to one or more mold cavities, apparatus for controlling delivery of the melt material from the channels to the one or more mold caviti... | 06/26/2007 |
| 7229264 | Platen with self-cleaning exhaust holes and multi-opening press utilizing same A platen press for pressing loose wood-based material into structural panels at high temperature while exhausting steam generated in the process through vents distributed across the face of a platen to thereby produce an improved product. The vents are periodically ... | 06/12/2007 |
| 7175405 | Compression molding machine A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by th... | 02/13/2007 |
| 7169345 | Method for integrated circuit packaging According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that includes a first non-planar surface and a second mold plate that includes ... | 01/30/2007 |
| 7156633 | Apparatus for encapsulating a multi-chip substrate array A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carri... | 01/02/2007 |
| 7150625 | Method and system for forming a hole through a blow molded article A blow molding system for forming a hole through a blow molded article includes a mold that houses an outer core pin and a pin support. During the blow molding process, a compression area is created in the mold. After the compression area is formed, the outer core p... | 12/19/2006 |
| 7131625 | Ejector pin and method An insert for a mold comprising a plug, having an insert face, and a receiver defined by a sidewall with one of the plug and the receiver having a groove that receives a guide that extends from the other of the plug and the receiver so as to facilitate rotation of t... | 11/07/2006 |
| 7108041 | Hollow nickel shapes by vapor deposition A method and apparatus for producing a nickel shape or shell employs nickel vapor deposition onto the inside surface of a closed, multi-part mandrel. The closed multi-part mandrel eliminates the need for a separate deposition chamber and the nickel vapor deposition ... | 09/19/2006 |
| 7029257 | Apparatus and method for molding simultaneously a plurality of semiconductor devices Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of ... | 04/18/2006 |
| 7029268 | Non-coaxial injection molding valve flow control In an injection molding machine having upstream and downstream channels communicating with each other for delivering fluid material to one or more mold cavities, apparatus for controlling delivery of the melt material from the channels to the one or more mold caviti... | 04/18/2006 |
| 7008575 | Resin sealing mold and resin sealing method A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respectiv... | 03/07/2006 |
| 7005101 | Virtual gate design for thin packages The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so... | 02/28/2006 |
| 6981859 | Method for manufacturing electronic component and apparatus for manufacturing the same The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the... | 01/03/2006 |
| 6942478 | Packaging mold with electrostatic discharge protection The present invention relates to a packaging mold with electrostatic discharge protection comprising a pot block and at least one receiver. The pot block comprises a plurality of pots and runners. Each of the pots branches and connects the runners for injecting mold... | 09/13/2005 |
| 6908293 | Resin encapsulation system In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit,... | 06/21/2005 |
| 6899533 | Apparatus for making semiconductor device A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the secon... | 05/31/2005 |
| 6887418 | Post mold cooling of preforms Post-mold cooling of injection molded plastic articles such as preforms is achieved by transferring the articles directly from the mold cavities onto cooling cores carried by a take-out plate. The molded articles are supported on the cooling cores until they become ... | 05/03/2005 |
| 6863516 | Transfer molding and underfilling apparatus A method and apparatus for reducing or eliminating the formation of air pockets or voids in a flowable material provided in contact with at least one substrate. The flowable material is provided in a non-horizontal direction and flows from a lower portion to an uppe... | 03/08/2005 |
| 6857865 | Mold structure for package fabrication A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold... | 02/22/2005 |
| 6840751 | Vertical mold die press machine A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one a... | 01/11/2005 |
| 6773247 | Die used for resin-sealing and molding an electronic component A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a... | 08/10/2004 |
| 6755634 | Apparatus for forming a golf ball with deep dimples An apparatus and related techniques for making a golf ball having one or more deep dimples are disclosed. The apparatus is a molding assembly for making a golf ball which includes a mold body that defines a molding cavity. The molding cavity is adapted to accommodat... | 06/29/2004 |
| 6696006 | Mold for flashless injection molding to encapsulate an integrated circuit chip An injection mold is provided for injection molding an encapsulation material to encapsulate at least one integrated circuit chip. The injection mold includes at least two parts that define at least one injection circuit, and at least one blind complement... | 02/24/2004 |
| 6689303 | Injection molding method using a stacked mold An injection molding apparatus includes a vessel, mold, pusher, and thrust providing section. The vessel stores a molding material and has a nozzle hole which is formed in the bottom portion to inject the molding material and a first seal surface formed a... | 02/10/2004 |
| 6682958 | Method for manufacturing semiconductor device by using sealing apparatus A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven sur... | 01/27/2004 |
| 6616436 | Apparatus for manufacturing semiconductor packages A mold for manufacturing semiconductor packages, which allows leadframes to be easily separated from a top mold section after a molding process by utilizing eject pins therein. The mold includes a bottom mold section having housing parts on the upper surf... | 09/09/2003 |
| 6609041 | Method and system for SKU tracking and changeover A method for tracking multiple SKUs of ophthalmic devices in a manufacturing line, comprises the steps of: assembling first molding devices, at least one of the first molding devices having an identification device, such as, a bar-code or an inductive ... | 08/19/2003 |
| 6592352 | Offset edges mold for plastic packaging of integrated semiconductor devices A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the me... | 07/15/2003 |
| 6530764 | Mold for resin-sealing of semiconductor devices A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavit... | 03/11/2003 |
| 6508970 | Liquid transfer molding system for encapsulating semiconductor integrated circuits An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation materia... | 01/21/2003 |
| 6503433 | Liquid transfer molding system for encapsulating semiconductor integrated circuits An encapsulation system is used to encapsulate semiconductor products. A bottom mold unit includes a mold pot and a mold piston. A substrate loader loads a substrate into a cavity in the bottom mold unit. A liquid dispenser dispenses encapsulation materia... | 01/07/2003 |
| 6491508 | Molding die set A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to ... | 12/10/2002 |
| 6478562 | Resin molding machine The method of resin molding and a resin molding machine are capable of uniformly control amount of the resin for molding a work piece and pressure of the melted resin. A parting face of one of molding dies, which includes a pot and a cavity, is covered wi... | 11/12/2002 |
| 6461558 | Injection molding apparatus and method An injection molding apparatus and a method of encapsulating integrated circuits which include a plurality of molding presses, such as transfer molding presses for encapsulating integrated circuits, which are mounted on an indexable rotary table. Stationa... | 10/08/2002 |
| 6457963 | Resin-sealing apparatus The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-seal... | 10/01/2002 |
| 6444157 | Method of resin molding A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies... | 09/03/2002 |
