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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 5658528 | Lead-free solder A lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less t... | 08/19/1997 |
| 5580520 | Lead-free alloy containing tin, silver and indium A low melting point solder alloy comprising effective amounts of tin, silver and indium.... | 12/03/1996 |
| 5569433 | Lead-free low melting solder with improved mechanical properties We have made the surprising discovery that small amounts of Ag below 1% by weight are effective in making Bi--Sn alloys less strain-rate sensitive without deleteriously affecting the melting character of the alloy. A Pb-free solder composition comprising ... | 10/29/1996 |
| 5538686 | Article comprising a PB-free solder having improved mechanical properties Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183° C.&#b1;10° C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The nove... | 07/23/1996 |
| 5520752 | Composite solders A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniform... | 05/28/1996 |
| 5500183 | Sn alloy bullet therefor The invention relates to a bullet based on an Sn alloy, wherein the Sn alloy comprises Cu, Sb, Bi and/or Zn as an alloying element, wherein the Sn alloy preferably contains 0.2-10% by weight Cu, preferably 0.2-6% by weight Cu, or 0.2-10% by weight Cu and ... | 03/19/1996 |
| 5286417 | Method and composition for making mechanical and electrical contact A fusible conductive adhesive for making electrical and mechanical contact is provided. The fusible conductive adhesive contains a polymer having a glass transition temperature and a thermal expansion co-efficient. The thermal expansion co-efficient of th... | 02/15/1994 |
| 5256370 | Lead-free alloy containing tin, silver and indium A low melting point solder alloy comprising effective amounts of tin, silver and indium.... | 10/26/1993 |
| 5242658 | Lead-free alloy containing tin, zinc and indium A low melting point solder alloy comprising effective amounts of tin, zinc and indium.... | 09/07/1993 |
| 5229070 | Low temperature-wetting tin-base solder paste A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The se... | 07/20/1993 |
| 5207885 | Target for reactive sputtering Target for reactive sputtering in a vacuum coating apparatus consists of at least one of tin and lead doped with 20 to 200 ppm gallium and 2 to 20 ppm phosphorus.... | 05/04/1993 |
| 5094813 | Non toxic self fluxing soldering materials A low temperature, non-toxic soldering alloy of the following composition by weight: 2.80 to 3.50% copper 0.20 to 0.50% zinc 0.08 to 0.16% nickel 0.08 to 0.16% silver 95.68 to 96.84% tin.... | 03/10/1992 |
| 5019336 | Micro-additions to tin alloys Tin-based alloys that include micro-additions of certain elements avoid the discoloration that otherwise afflict those alloys when they are melted. The discoloration, which results from tin oxidation, correlates with poor performance of the alloys in fill... | 05/28/1991 |
| 5019187 | Brazing paste for bonding metal and ceramic According to the present invention, there is provided an electronic component part comprising (i) a high thermal conductivity ceramic circuit board, (ii) terminal pins located over said circuit board, and (iii) a metal brazing material having metal brazin... | 05/28/1991 |
| 4797328 | Soft-solder alloy for bonding ceramic articles Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.... | 01/10/1989 |
| 4795682 | Tin-cobalt bearing overlay alloys Alloys of the type known as overlays for bearings are described. An overlay for a bearing comprises between 0.5 and 15 wt % of cobalt the balance being tin apart from incidental impurities.... | 01/03/1989 |
| 4756747 | Synthesis of new amorphous metallic spin glasses Amorphous metallic precipitates having the formula (M1)a (M2)b wherein M1 is at least one transition metal, M2 is at least one main group metal and the integers "a" and "b" provide stoichio... | 07/12/1988 |
| 4749626 | Whisker resistant tin coatings and baths and methods for making such coatings The present invention relates to an addition to tin coating solutions for inhibiting the growth of tin whiskers. The addition comprises a concentration of a metal salt selected from the group consisting of palladium salt, silver salt, nickel salt, iron sa... | 06/07/1988 |
| 4626296 | Synthesis of new amorphous metallic spin glasses Amorphous metallic precipitates having the formula (M1)a (M2)b wherein M1 is at least one transition metal, M2 is at least one main group metal and the integers "a" and "b" provide stoichio... | 12/02/1986 |
| 4540437 | Tin alloy powder for sintering A tin alloy powder containing up to 5% P is disclosed. Reduced sensitivity to sintering conditions is achieved by use of present alloy powder in production of sintered bronze articles. Means for controlling the growth of the article during sintering are a... | 09/10/1985 |
| 4512950 | Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more ... | 04/23/1985 |
| 4492842 | Process of brazing using low temperature braze alloy of gold-indium tin A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip carrying substrates which are to be reworked.... | 01/08/1985 |
| 4397888 | Thick film sensor for hydrogen and carbon monoxide An improved thick film stannic oxide sensor is disclosed whereby the sensitivity of the sensor to CO is enhanced by the addition of a rare earth oxide to the sensor composition and the catalytic reactivity of the sensor, when contacted by a gas containing... | 08/09/1983 |
| 4396677 | Metal, carbon, carbide and other composites thereof As an article for manufacture, a tin, lead, indium, and alloys of each, admixed with a carbide or carbonyl former, for forming these with said tin, lead and indium, and their alloys into an "active" alloy form; these "active" alloy forms are suitable for ... | 08/02/1983 |
| 4358884 | Tin-base body solder In a preferred embodiment, a method is presented for filling depressions in fabricated steel surfaces by applying a metallic body solder consisting of 14 to 20 weight percent copper, 1 to 7.5 weight percent zinc, 0.5 to 1.5 weight percent iron and the bal... | 11/16/1982 |
| 4318741 | Rare earth metal stannides A new family of rare earth-rhodium-tin intermetallic compounds, with the representative formula (RE)Rhx Sny, has been synthesized in single crystal form. The compounds containing the heavier rare earths are superconducting and those ... | 03/09/1982 |
| 4308248 | Material and method to dissociate water A material and method to decompose/dissociate water into hydrogen and oxygen. The material comprises a reactive alloy of an alkali metal and aluminum combined with a catalytically effective amount of an alloy comprising a metal selected from the platinum ... | 12/29/1981 |
| 4189525 | Bearing metal for large engines A bearing metal for large size engines having excellent compatibility and as well as embeddability even when used under a poorly lubricated condition. Such bearing metal consists of three or four layers, including a layer of a bearing alloy which contains... | 02/19/1980 |
| 4164420 | Master alloy for the preparation of zirconium alloys The invention relates to a master alloy intended for the preparation of zirconium-base alloys and more particularly for the preparation of alloys such as those known as zircaloy 2 and zircaloy 4 useful for nuclear applications. This master alloy contains,... | 08/14/1979 |
| 4042725 | Solder alloy and soldering process A difficulty solderable metal of iron, nickel, copper or an alloy thereof having an oxide surface is soldered by dipping in a bath of a molten solder alloy consisting essentially of 15 to 98% by weight of Zn, 85 to 2% by weight of Sn, 0.01 to 0.5% by weig... | 08/16/1977 |
| 3966470 | Photo-conductive coating containing Ge, S, and Pb or Sn As a photoconductive material there is provided a carrier having a coating thereon of a germanium-sulphur-lead alloy or a germanium-sulphur-tin alloy.... | 06/29/1976 |
| 3962501 | Method for coating of corrosion-resistant molten alloy Coating of steel articles with zinc-tin alloys by hot-galvanizing with addition of aluminum to improve the applicability and adhesion of the coating as well as the corrosion resistance, coated surface appearance and formabilities thereof.... | 06/08/1976 |
