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| Number | Title | Issue Date |
| 7803314 | Non-toxic shot formulation and method of making Non-toxic shot having 40-60% tungsten, 20-60% tin and 0-10% iron. A process of formulating the material is disclosed in which 95% by weight of the particles of each component having mesh sizes less than 325 are blended with a flux having 99.9% by weight particles le... | 09/28/2010 |
| 7537728 | Method for increasing the effectiveness of a component of a material A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared containing the component in a first concentration. The component is at le... | 05/26/2009 |
| 7282175 | Lead-free solder A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point ... | 10/16/2007 |
| 7220493 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liq... | 05/22/2007 |
| 7201304 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 04/10/2007 |
| 7180170 | Lead-free integrated circuit package structure An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive mate... | 02/20/2007 |
| 7175804 | Sn-Zn lead-free solder alloy, and solder junction portion An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt %... | 02/13/2007 |
| 7172726 | Lead-free solder A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and ... | 02/06/2007 |
| 7169328 | Multiphase nanocomposite material and method for its manufacture A multiphase composite material having utility as an electrochemical electrode or catalyst includes a first active phase which is an amorphous, electrochemically active material; and a second, stabilizer phase which includes one or more of: metals, carbon, ceramics,... | 01/30/2007 |
| 7159756 | Method of soldering and solder compositions The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and conne... | 01/09/2007 |
| 7161807 | Heat spreader module A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interpo... | 01/09/2007 |
| 7148426 | Lead-free solder, and connection lead and electrical component using said lead-free solder In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip ... | 12/12/2006 |
| 7145236 | Semiconductor device having solder bumps reliably reflow solderable A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps a... | 12/05/2006 |
| 7111771 | Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same A doped tin-indium solder composition is disclosed. The doped tin-indium solder exhibits a retained fine-grain structure and superplasticity after significant thermal cycling and thermal and mechanical stresses experienced in a microelectronic package. A process of ... | 09/26/2006 |
| 7070736 | Sn-Zn lead-free solder alloy and soldered bond An Sn—Zn lead-free solder alloy according to the present invention is constructed in a manner such that it is an Sn-based solder alloy indispensably containing 6 to 10 wt % zinc at least and further containing 0.0015 to 0.03 wt % magnesium and 0.0010 to 0.006 wt %... | 07/04/2006 |
| 7051915 | Capillary for wire bonding and method of wire bonding using it A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed therethrough so as to permit wire to be placed thereth... | 05/30/2006 |
| 7048813 | Foil-form soldering metal and method for processing the same The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subj... | 05/23/2006 |
| 7037559 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 05/02/2006 |
| 7029542 | Lead-free solder alloy A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high ... | 04/18/2006 |
| 7022282 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 04/04/2006 |
| 7017795 | Solder pastes for providing high elasticity, low rigidity solder joints Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity w... | 03/28/2006 |
| 7018721 | Structure for interconnecting conductors and connecting method A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, ... | 03/28/2006 |
| 7013564 | Method of producing an electronic device having a PB free solder connection A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi al... | 03/21/2006 |
| 7005106 | Lead-free solder alloy and electronic components using it Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire h... | 02/28/2006 |
| 6998344 | Method for fabricating semiconductor components by forming conductive members using solder An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts (e.g., bond... | 02/14/2006 |
| 6958446 | Compliant and hermetic solder seal A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or ot... | 10/25/2005 |
| 6946190 | Thermal management materials A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a di... | 09/20/2005 |
| 6936219 | Lead-free alloy Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt. %. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wire, atomized powder, solder ... | 08/30/2005 |
| 6926849 | Solder paste A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids ... | 08/09/2005 |
| 6921497 | Composition of matter tailoring: system I The present invention relates to new compositions of matter, particularly metals and alloys, and methods of making such compositions. The new compositions of matter exhibit long-range ordering and unique electronic character. ... | 07/26/2005 |
| 6902102 | Soldering method and solder joint member In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ... | 06/07/2005 |
| 6893512 | Solder alloy and soldered bond A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.002... | 05/17/2005 |
| 6853077 | Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn—Zn-based l... | 02/08/2005 |
| 6837947 | Lead-free solder This invention discloses a lead-free Sn—Zn—Al—Ag solder alloy, which is composed of 7-10 wt % of Zn, up to 0.5 wt % of Al, up to 4.0 wt % of Ag, and the balance of Sn; and a lead-free Sn—Zn—Al—Ag—Ga solder alloy, which is composed of 7-10 wt % of Zn, u... | 01/04/2005 |
| 6835332 | PROCESS FOR PRODUCING AN ELECTRODE MATERIAL FOR A RECHARGEABLE LITHIUM BATTERY, AN ELECTRODE STRUCTURAL BODY FOR A RECHARGEABLE LITHIUM BATTERY, PROCESS FOR PRODUCING SAID ELECTRODE STRUCTURAL BODY, A RECHARGEABLE LITHIUM BATTERY IN WHICH SAID ELECTRODE STRUCTURAL BODY IS USED, AND A PROCESS FOR PRODUCING SAID RECHARGEABLE LITHIUM BATTERY A process for producing an electrode material for a rechargeable lithium battery, comprising the steps of mixing a metal compound (a) of a metal (a′) capable of being electrochemically alloyed with lithium, a transition metal compound (b) of a transition metal (bâ... | 12/28/2004 |
| 6824039 | Lead free tin based solder composition Lead-free solder alloys based on a Sn—Ag—Mg system are disclosed. The alloy compositions have a melting temperature close to 183° C. and a similar surface tension to that of Sn—Pb solder, and can thus be a readily substituted for conventional Sn—Pb solders.... | 11/30/2004 |
| 6815066 | Composite material containing tungsten, tin and organic additive A composite material for use as a lead replacement, comprising a high density metal such as tungsten (W), a lower density metal such as tin (Sn) and an organic additive is disclosed. Also disclosed are processes for forming such composites. The composite is particul... | 11/09/2004 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a... | 10/19/2004 |
| 6783057 | Anti-tombstoning solder alloys for surface mount applications The object of this invention is to employ a solder alloy comprising tin/lead/silver in order to provide a wider solidification range and achieve balance between the surface tensions of both side of a small leadless component. The expanded solidification range slows ... | 08/31/2004 |
| 6692691 | Pb-free soldering alloy A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the ... | 02/17/2004 |
