Bizarre Patents
A small umbrella which may be removably attached to a beverage container in order to shade the beverage container from the direct rays of the sun.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 4632806 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also ... | 12/30/1986 |
| 4631171 | Copper-zinc-manganese-nickel alloys Copper-zinc-manganese-nickel alloys comprising 30 to 70 weight percent copper, 15 to 45 weight percent zinc, 5 to 20 weight percent manganese, 1 to 20 weight percent nickel, 0.05 to 2 weight percent silicon and less than about 0.05 weight percent of other... | 12/23/1986 |
| 4612167 | Copper-base alloys for leadframes A copper-base alloy for leadframes comprising 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, and balance Cu and inevitable impurities, the ratio of Ni to Ti being 1-4. It may also comprise 0.1-2.0 weight % of Zn. It may further comprise 0.01-2.0 weight %... | 09/16/1986 |
| 4591484 | Lead materials for semiconductor devices A lead material for semiconductor devices comprising from 0.4 to 4.0 wt % of Ni, from 0.1 to 1.0 wt % of Si, from 0.05 to 1.0 wt % of Zn, from 0.01 to 1.0 wt % of Mn, from 0.001 to less than 0.01 wt % of Mg, from 0.001 to less than 0.01 wt % of Cr, up to ... | 05/27/1986 |
| 4430298 | Copper alloys for electric and electronic devices and method for producing same A copper alloy for electric and electronic devices, comprising: 3.0-3.5 wt % of Ni, 0.5-0.9 wt % of Si, 0.02-1.0 wt % of Mn, 0.1-5.0 wt % of Zn and the balance Cu and the inevitable impurities.... | 02/07/1984 |
| 4366117 | Copper alloy for use as lead material for semiconductor devices A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of... | 12/28/1982 |
| 4362579 | High-strength-conductivity copper alloy A copper alloy with high strength and excellent electrical conductivity, corrosion resistance, and spring qualities, comprises 0.4-8% nickel, 0.1-3% silicon, 10-35% zinc, concomitant impurities, and the remainder copper, all by weight. It further comprise... | 12/07/1982 |
| 4345108 | Case for a semiconductor component Case for a semiconductor component, including at least two parts, one of the parts being a cap, at least the cap being formed of a material having low hydrogen permeability and a weak catalytic effect for an oxyhydrogen gas reaction.... | 08/17/1982 |
| 4171972 | Corrosion resistant copper base alloys for heat exchanger tube An alloy system is disclosed which is particularly useful for heat exchanger and water tubing applications. This alloy system utilizes additions of zinc, nickel and iron to a copper base. Cobalt and manganese may also be added to the alloy and such elemen... | 10/23/1979 |
| 4003715 | Copper-manganese-zinc brazing alloy A brazing alloy composition is provided for brazing together a ferrous metal part to another part, said alloy comprising about 15% to 30% manganese, about 15% to 30% zinc, 0 to about 10% nickel (e.g. 0.5% to 10%) and the balance essentially copper ranging... | 01/18/1977 |
