Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7563408 | Copper alloy and method of manufacturing the same A copper alloy of superior flex durability is provided that is suitable for the conducting members of flexible printed circuits. This is a copper alloy where the integrated intensity ratio I{200}/I{111} found by x-ray diffraction of the rolled ... | 07/21/2009 |
| 7297215 | Copper base alloy, and cast ingot and parts to be contacted with liquid By exactly comprehending the true properties of the rare elements (such as Bi and Se) which are alternative components for Pb, the alloy is enabled to secure machinability equal to the bronze alloy (CAC406) generally used hitherto and acquire mechanical properties a... | 11/20/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7262505 | Selective electroless-plated copper metallization Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on... | 08/28/2007 |
| 7172662 | Copper alloy material for parts of electronic and electric machinery and tools A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of ... | 02/06/2007 |
| 7163753 | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc di... | 01/16/2007 |
| 7140728 | Method of forming magnetic eyeglass appliance An eyeglass accessory frame includes an auxiliary frame. The auxiliary frame includes a heat-treated magnetic alloy. The heat-treated magnetic alloy of the auxiliary frame is configured to magnetically couple the auxiliary frame to a primary frame having magnetizabl... | 11/28/2006 |
| 7091611 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 08/15/2006 |
| 7090732 | High-mechanical strength copper alloy A high-mechanical strength copper alloy, which comprises Ni 1.0 to 4.5% by mass, Si 0.2 to 1.0% by mass, Mg 0.01 to 0.20% by mass, Sn 0.05 to 1.5% by mass, Zn 0.2 to 1.5% by mass, and S less than 0.005% by mass (including 0% by mass), with the balance being made of ... | 08/15/2006 |
| 7067421 | Multilevel copper interconnect with double passivation Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods for forming multilevel wiring interconnects in an integrated circuit... | 06/27/2006 |
| 6995470 | Multilevel copper interconnects with low-k dielectrics and air gaps Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which ... | 02/07/2006 |
| 6943090 | Aluminum-beryllium alloys for air bridges A typical air bridge is an aluminum conductor suspended across an air-filled cavity to connect two components of an integrated circuit, two transistors for example. The air-filled cavity has a low dielectric constant which reduces cross-talk between neighboring cond... | 09/13/2005 |
| 6749699 | Silver containing copper alloy A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impur... | 06/15/2004 |
| 6716292 | Unwrought continuous cast copper-nickel-tin spinodal alloy An unwrought continuous cast Cu—Ni—Sn spinodal alloy and a method for producing the same is disclosed. The Cu—Ni—Sn spinodal alloy is characterized by an absence of discontinuous γ′ phase precipitate at the grain boundaries, ductile fracture behavior duri... | 04/06/2004 |
| 6716541 | Material for a metal strip The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: | 04/06/2004 |
| 6695934 | Copper alloy and process for obtaining same A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from abo... | 02/24/2004 |
| 6687324 | Coated metal articles A metallic uranium article having a protective coating of a copper-tin alloy containing from 45 to 50% by weight of copper and from 55 to 50% by weight of tin, said alloy being firmly bonded to the metallic uranium.... | 02/03/2004 |
| 6346215 | Copper-tin alloys and uses thereof A copper alloy contains from 4 to 20 wt. % tin and various other metals. The alloys can be used in the manufacture of structural parts which are joined together through the use of heat such as jewelry, clothing accessories and mechanically stressed struct... | 02/12/2002 |
| 6344171 | Copper alloy for electrical or electronic parts Provided is a copper alloy for electrical or electronic parts which is superior in yield strength, electric conductivity, spring limit value, resistance property of stress relaxation, bendability and Sn plating property. The copper alloy for electrical or... | 02/05/2002 |
| 6264764 | Copper alloy and process for making same Copper alloys for electrical applications, particularly in the computer industry, and a process for making the copper alloys. The copper alloys contain 13-15% by weight of zinc, 0.7-0.9% by weight of tin, and 0.7-0.9% by weight of iron, the balance being ... | 07/24/2001 |
| 6251199 | Copper alloy having improved resistance to cracking due to localized stress A copper alloy having improved resistance to cracking due to localized plastic deformation and the process of making it. The alloy consists essentially of: from 0.7 to 3.5 weight percent nickel; from 0.2 to 1 weight percent silicon; from 0.05 to 1 weight ... | 06/26/2001 |
| 6103188 | High-conductivity copper microalloys obtained by conventional continuous or semi-continuous casting We provide a new copper microalloy with high-conductivity, excellent heat resistance and high strain strength, which can be obtained by conventional continuous or semi-continuous casting, which essentially consists of at least one element selected from th... | 08/15/2000 |
| 6099663 | Copper alloy and process for obtaining same A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from abo... | 08/08/2000 |
| 6074604 | Brazing material for stainless steel Provided is a brazing filler metal for brazing stainless steel at low temperatures so as not to adversely affect the properties of the stainless steel, and without producing any brittleness in the brazed joint. The brazing filler metal essentially consist... | 06/13/2000 |
| 5942056 | Plumbing fixtures and fittings employing copper-bismuth casting alloys A plumbing fixture or fitting fabricated from a bismuth and mischmetal containing copper alloy.... | 08/24/1999 |
| 5882442 | Iron modified phosphor-bronze There is provided a phosphor bronze alloy having a grain structure that is refined by the addition of a controlled amount of iron. Direct chill cast alloys containing from 1.5% to 2.5%, by weight tin, from 1.65% to 2.65% iron, from 0.03% to 0.35% phosphor... | 03/16/1999 |
| 5853505 | Iron modified tin brass There is provided a tin brass alloy having a grain structure that is refined by the addition of controlled amounts of both zinc and iron. Direct chill cast alloys containing from 1% to 4%, by weight of tin, from 0.8% to 4% of iron, from an amount effectiv... | 12/29/1998 |
| 5833920 | Copper alloy for electronic parts, lead-frame, semiconductor device and connector The present invention provides a copper alloy for electronic part which is excellent in adhesion of silver(Ag) and reliability of solderability and adhesion of plating without impairing excellent strength and electrical conductivity of a copper-nickel-sil... | 11/10/1998 |
| 5665480 | Copper-lead alloy bearing A copper-lead alloy bearing having a high corrosion resistance, especially a high corrosion resistance to sulfur, comprising a back metal and a copper-lead-based bearing alloy bonded thereto. The copper-lead-based bearing alloy consists of more than 10 bu... | 09/09/1997 |
| 5653827 | Brass alloys Reduced-lead yellow brass alloys are disclosed. The alloys comprise copper; zinc; an amount of bismuth effective to enhance castability of the alloys; and an amount of selenium effective to increase machinability of the alloy. Preferably, the alloys furth... | 08/05/1997 |
| 5624506 | Copper alloy for use in electrical and electronic parts A copper alloy for use in an electrical and electronic parts contains Fe of 1.8-2.0 weight %, P of 0.025-0.040 weight %, Zn of 1.7-1.9 weight %, Sn of 0.40-1.0 weight %, and Ca of 0.0001-0.01 weight %, the balance being Cu and inevitable impurities. Furth... | 04/29/1997 |
| 5523006 | Ultrafine powder lubricant An ultrafine particle copper, tin, nickel, zinc lubricant with a surface area of from 5 to 70 m2 /g and a particle size of from about 0.01 to about 0.5 μm. The powder dispersed in a carrier to form a dispersion stabilized by Brownian movement.... | 06/04/1996 |
| 5516484 | Copper-nickel-tin based alloy A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, ... | 05/14/1996 |
| 5508001 | Copper based alloy for electrical and electronic parts excellent in hot workability and blankability A copper based alloy for use as a material for electrical and electronic parts has a chemical composition by weight, of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3 Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, 0.001 to 0.2% Mg, 0.0001 to 0.001% C, a... | 04/16/1996 |
| 5487867 | Copper-bismuth casting alloys A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, ... | 01/30/1996 |
| 5424030 | Copper alloy for fine pattern lead frame A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substanc... | 06/13/1995 |
| 5387293 | Copper base alloys and terminals using the same A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm2, a spring limit of at least 40 kgf/mm2, a stress relaxation of not more than 10% and a conduct... | 02/07/1995 |
| 5378294 | Copper alloys to be used as brazing filler metals The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphorus, tin and possibly small amounts of manganese. The alloys are produced by means of atomization methods. Their advantages are low liq... | 01/03/1995 |
| 5346668 | Copper based alloy for wear resistant sliding layer and sliding member A Cu-based wear-resistant alloy of a sliding material consists essentially of, by weight, 10-35% Zn, 2-20% Pb, 1-10% Ni, 0.1-1% B and, as required, 0.5-10% of Sn. The alloy can be used under severe conditions of use at elevated speed and temperature with ... | 09/13/1994 |
| 5344606 | Fluid treatment alloy casting of Cu-Sn-Ni-Zn A suitable casting alloy for use in a fluid treatment device may be made as a copper-nickel-zinc-tin (CU--NI--ZN--SN) alloy without the addition of silver, silicon or magnesium, if certain identified trace metals are kept below certain levels. It appears ... | 09/06/1994 |
