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| Number | Title | Issue Date |
| 7858025 | Method for manufacturing cubic copper or copper oxide nanoparticles The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and... | 12/28/2010 |
| 7434720 | Gold/nickel/copper/titanium brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 20 to about 60 percent by weight gold, about 6 to about 16 percent by weight nickel, about 16 to about 60 percent by weight copper and about 6 to about 16 percent by weight titanium. ... | 10/14/2008 |
| 7422994 | Platinum-copper-tungsten fuel cell catalyst A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper an... | 09/09/2008 |
| 7404866 | Sliding member and method for manufacture thereof A sliding member includes a superficial portion forming a sliding surface. The superficial portion includes an oxygen-containing alloy containing at least one metallic element selected from the group consisting of molybdenum and tungsten in an amount of from 2 to 80... | 07/29/2008 |
| 7374651 | Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it The present invention pertains to an electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1500 μm (or more) to 20000 μm in an electrolytic copper plating method employing a phosphorous copper anode... | 05/20/2008 |
| 7255151 | Near liquidus injection molding process An injection-molding process for molding a metal alloy into a near net shape article that is characterized in that the processing temperature of the alloy at injection is approaching the liquidus, preferably having a maximum solids content of %, whereby a net-shape ... | 08/14/2007 |
| 7248141 | Current fuse and method of making the current fuse In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weig... | 07/24/2007 |
| 7186370 | Copper-base alloy and its use A copper-base alloy with increased melting point above 1000° C., which is resistant or immune to carburization, metal dusting and coking, resistant to oxidation at elevated temperatures. The alloy has the following composition (in weight-%): Al 4–15, Si 0.1–6, ... | 03/06/2007 |
| 7169731 | Method for the synthesis of a fuel cell electrocatalyst A method for forming a supported metal-containing powder. The method comprises forming a dispersion of a particulate support in a solution, which comprises a solvent and a dissolved metal. Heat is removed from the dispersion to precipitate the dissolved metal from t... | 01/30/2007 |
| 7135775 | Enhancement of an interconnect A method, apparatus, system, and machine-readable medium for an interconnect structure in a semiconductor device and its method of formation is disclosed. Embodiments comprise a carbon-doped and silicon-doped interconnect having a concentration of silicon to avoid t... | 11/14/2006 |
| 6979646 | Hardening of copper to improve copper CMP performance A method for reducing the topography from CMP of metal layers during the semiconductor manufacturing process is described. Small amounts of solute are introduced into the conductive metal layer before polishing, resulting in a material with electrical conductivity a... | 12/27/2005 |
| 6953539 | Composite material A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper ... | 10/11/2005 |
| 6921497 | Composition of matter tailoring: system I The present invention relates to new compositions of matter, particularly metals and alloys, and methods of making such compositions. The new compositions of matter exhibit long-range ordering and unique electronic character. ... | 07/26/2005 |
| 6914032 | Method of producing tungsten-copper based composite powder and sintered alloys for heat-sink using said composite powder The present invention relates to a method of producing W—Cu based composite powder, which is used in heat-sink materials for high-power integrated circuits, electric contact materials, etc, and to a method of producing a W—Cu based sintered alloy by using the co... | 07/05/2005 |
| 6761306 | Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers A phosphorus-copper brazing material formed of a phosphorus-copper brazing alloy which can easily be cold-worked into a thin sheet, a brazing sheet having a brazing layer of the phosphorus-copper brazing alloy, and a flow path structure for heat exchangers construct... | 07/13/2004 |
| 6758920 | Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a physical vapor deposition target includes an alloy of copper and silver, with the... | 07/06/2004 |
| 6645352 | Optical data storage disk A sputtering target made of Agx May Mbz or Cux May Mbz, where x>50 at % and Ag or Cu are a first metal, Ma is a second metal and Mb is a third metal is used in a method for manufacturing da... | 11/11/2003 |
| 6645427 | Copper sputtering target assembly and method of making same Described is a sputtering target assembly of high purity copper diffusion bonded to a precipitation hardened aluminum alloy backing plate via an intermediate layer of a CuCr alloy and in which the copper contains a micro alloy addition of at least one of ... | 11/11/2003 |
| 6616727 | Porous metal powder The present invention relates to a method of preparing porous metal powder, a starting metal being oxidized and then reduced followed by that the obtained block metal body is milled. According to the present invention, the starting metal is oxidized in th... | 09/09/2003 |
| 6596131 | Carbon fiber and copper support for physical vapor deposition target assembly and method of forming The invention includes a method of forming an assembly of a physical vapor deposition target and support. A physical vapor deposition target is provided. The physical vapor deposition target has a coefficient of thermal expansion of less than 10×10-... | 07/22/2003 |
| 6572792 | Composition of matter tailoring: system 1 A composition of matter includes a changed underlying electronic structure of a mass or matter containing a `p`, `d` and/or `f` atomic orbital. The structural change is accompanied by changes in energy or mass or both.... | 06/03/2003 |
| 6475642 | Oxidation-resistant coatings, and related articles and processes An oxidation-resistant coating is described, formed of an alloy containing: about 40 to about 50 atom % aluminum and about 0.5 atom % to about 3 atom % tantalum; with a balance of nickel; cobalt, iron, or combinations thereof. The coating may also include... | 11/05/2002 |
| 6475635 | Sliding material made of copper alloy, method of producing same, and sliding bearing A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy ph... | 11/05/2002 |
| 6451135 | High-purity copper sputtering targets and thin films There is provided copper targets for sputtering capable of forming a deposition film with low electric resistance indispensable for high-speed operation elements and also with excellent thickness uniformity, and such thin copper films. A high-purity coppe... | 09/17/2002 |
| 6413649 | Silver-copper-nickel infiltration brazing filler metal and composites made therefrom The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 an... | 07/02/2002 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper fr... | 05/21/2002 |
| 6187071 | Bond for abrasive tool A bond for a single layer metal bond abrasive tool can be easily chemically and electrochemically stripped from the metal core of a recovered used tool to facilitate reuse of the core. Relative to conventionally bonded tools, the speed of stripping the no... | 02/13/2001 |
| 6174344 | Copper fine powder and method for preparing the same Copper fine powder has an electrical resistance in its powdery state of not more than 1×10-3Ω.cm; a BET specific surface area ranging from 0.15 to 0.3 m2 /g; a tap density of not less than 4.5 g/cc; a product of the tap density and... | 01/16/2001 |
| 6149739 | Lead-free copper alloy An improved white manganese bronze alloy containing, in weight percent, about 1.0-3.0 wt % aluminum, about 2.0-4.0 wt % bismuth, about 53-59 wt % copper, about 0.8-2.0 wt % iron, about 11-15 wt % manganese, about 5.0-7.0 wt % nickel, about 1.3-2.5 wt % ti... | 11/21/2000 |
| 6093499 | Copper alloy foils Copper alloy foils are provided having far greater strength and heat resistance than conventional copper foils, and having better productivity, are characterized by a composition comprising, all by weight, from 0.01 to 0.4% Cr, from 0.01 to 0.25% Zr, from... | 07/25/2000 |
| 6063506 | Copper alloys for chip and package interconnections Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package ... | 05/16/2000 |
| 6037067 | High temperature abrasion resistant copper alloy A laminate material comprising a metal substrate and a laser overlaid layer of a high temperature abrasion resistant copper alloy suitable for the material of engine parts such as valve seats and valve guides, wherein the copper alloy consists essentially... | 03/14/2000 |
| 5955176 | Integrated suspension using a high strength conductive material A slider suspension system for use in a magnetic recording disk file comprised of a laminated suspension positioned between an actuator arm and a read/write slider. The laminated suspension is comprised of a conductor layer, a dielectric layer and a suppo... | 09/21/1999 |
| 5865910 | Copper alloy and process for obtaining same Copper base alloys consisting essentially of 1.0 to 4.0% tin, 0.01 to 0.20% phosphorous, 0.01 to 0.80% iron, 0.1 to 12.0% zinc and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix. The alloy is char... | 02/02/1999 |
| 5858125 | Magnetoresistive materials A magnetoresistive material of the present invention has a structure in which many clusters are surrounded by a crystal phase of Cu and/or Ag, where each cluster has a grain size of 20 nm or less and composed of an amorphous phase containing at least one ... | 01/12/1999 |
| 5675883 | Method of manufacturing a copper-nickel-silicon alloy casing The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The metho... | 10/14/1997 |
| 5667751 | Alloy material with improved catalytic properties This invention relates to a catalytic fuel composition capable of reducing pollutants in the combustion gasses generated upon combustion of the same. A catalytic material is combined with a liquid, petroleum-based fuel, mixed and solid particles are separ... | 09/16/1997 |
| 5578266 | Alloys suitable for hydrogen storage, method of producing the same and electrode using the same Disclosed are a hydrogen storage alloy which contains carbon in a proportion of from 30 to 500 ppm and is represented by the stoichiometric formula Ax B5.0, wherein A is La or a mixture of La with at least one rare earth metal other ... | 11/26/1996 |
| 5523022 | Semiconductor compound Novel compound semiconductors are of the general formula, X5 YZ4, wherein X is a member selected from the group consisting of Cu, Ag and mixtures thereof, Y is a member selected from the group consisting of Al Ga, Tl and mixtures the... | 06/04/1996 |
| 5516484 | Copper-nickel-tin based alloy A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, ... | 05/14/1996 |
