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Class 414/941 - Includes means for gripping wafer


Subclass of Class 414 - Material or article handling
Definition: A collection of art which includes means having seizing,
No. of patents: 433
Last issue date: 01/03/2012


1                      
NumberTitleIssue Date
8087708Handling device and handling method for wafers
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, t...
01/03/2012
7422411Gripping mechanisms, apparatus and methods
The present invention provides grasping mechanisms, gripper apparatus/systems, and related methods. Grasping mechanisms that include stops, support surfaces, and height adjusting surfaces to determine three translational axis positions of a grasped object are provid...
09/09/2008
7401828Substrate conveyance device for fabrication of liquid crystal display device
A substrate conveyance device for fabricating a liquid crystal display device is provided. The substrate conveyance device conveys substrates and aligns substrates without using an additional aligning apparatus. The substrate conveyance device includes an arm that f...
07/22/2008
7400158Test fixture and method for testing a semi-finished chip package
A test fixture has a base, a positioning board, multiple probes, a cushion board, multiple springs and multiple inner bolts. The base has a recess defined in the base. The positioning board is mounted in the recess. The probe is mounted on the positioning board and ...
07/15/2008
7396199Substrate processing apparatus and substrate processing method
A substrate processing apparatus for processing a substrate while transferring the substrate among a plurality of units with which the substrate is to be processed or on which the substrate is to be placed. This apparatus is provided with: a first unit group dispose...
07/08/2008
7384083O-ring locking mount
An end effecter (201) is provided herein which comprises a blade (203) having a depression (213) formed in the surface (210) thereof, an elastomeric pad (209) disposed in the depression and a fastener (215) for releasably se...
06/10/2008
7380850Holding structure for holding an object
A holding structure, such as a manipulator, includes a plurality fingers. At least one of the fingers is movable such that an object can be held or released by a closing or opening motion of the movable finger. At least one contact surface of the fingers, which is c...
06/03/2008
7371287Substrate handling system
A substrate handling system and method in which an air chuck produces a film of air between the substrate and the air chuck, a magnetic chuck attracts the substrate to the air chuck, and an actuator subsystem moves the magnetic chuck closer to and away from the air ...
05/13/2008
7354335CMP apparatus and load cup mechanism
In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a ...
04/08/2008
7334826End-effectors for handling microelectronic wafers
End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutmen...
02/26/2008
7335090Substrate processing apparatus and substrate handling method
A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for ...
02/26/2008
7326021Device for loading and unloading silicon wafers in an oven from a multiple-cassette station
Device for automatically loading and unloading a feed to be treated in a heat treatment unit (1) such as a diffusion oven, comprising at least a cantilever (2) designed to receive the whole feed and to introduce the feed in the oven. The feed can consi...
02/05/2008
7300082Active edge gripping and effector
The present invention generally relates to an end effector that utilizes a gripping mechanism to grip a peripheral edge of the wafer and secure the wafer to the end effector. In one embodiment, the gripping mechanism includes a pair of gripper arms that pivot betwee...
11/27/2007
7293811Ultra low contact area end effector
The present invention comprises a vacuum end effector having workpiece supports that work in conjunction with distorted workpiece surfaces. In one embodiment, each workpiece support has the ability to gimbal and conform the workpiece surface in contact with an outer...
11/13/2007
7290813Active edge grip rest pad
The present invention comprises a distal rest pad for supporting a portion of a wafer seated on an end effector. In one embodiment, the rest pad includes a bottom support pad and an edge stop. Each element is mounted separately to the distal end of a support plate. ...
11/06/2007
7278203Random-period chip transfer apparatus
A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of t...
10/09/2007
7270510Device and method for transporting wafer-shaped articles
An apparatus for treating wafer-shaped articles includes at least one linear arranged array of a plurality of at least two process units wherein in each such process unit one single wafer-shaped article can be treated, a cassette-holding unit for holding at least on...
09/18/2007
7250084Downward mechanism for support pins
A downward mechanism for support pins is applicable to a reactor of removable type. Support pins are located on the base of the reactor, and each support pin has a base thereunder. The downward mechanism has an elevator mechanism and a board fixed thereto. The board...
07/31/2007
7241099Center ball O-ring
A self-retaining O-ring having at least two radial struts connectively extending from inside surfaces to a central sphere-shaped retainer. The top surfaces of the radial struts are formed below the top surfaces of the O-ring. The central sphere-shaped retainer is co...
07/10/2007
7234913Fast swapping station for wafer transport
An apparatus for accepting and transferring at least one disk-like member is provided. The apparatus includes a pick- and place-mechanism including gripping means. In effect, the mechanism is adapted to provide pick- and/or place-cycles, which during operation provi...
06/26/2007
7232286Seal device and method for operating the same and substrate processing apparatus comprising a vacuum chamber
The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas...
06/19/2007
7226269Substrate edge grip apparatus
In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaw...
06/05/2007
7226512Load lock system for supercritical fluid cleaning
A substrate is transferred from an environment at about vacuum into a load lock through a first door. The substrate is then sealed within the load lock. The pressure within the load lock is raised to a high pressure above vacuum. A second door coupling the load lock...
06/05/2007
7179044Method of removing substrates from a storage site and a multiple substrate batch loader
A substrate handling robot includes an arm drive mechanism. A first arm is connected to the arm drive mechanism. A multiple substrate batch loader is connected to the first arm. A second arm is also connected to the arm drive mechanism. A single plane end effector i...
02/20/2007
7175214Wafer gripping fingers to minimize distortion
An apparatus for measuring semiconductor wafer shape that minimizes wafer distortion. The apparatus includes a plurality of wafer gripping fingers for holding a wafer in a predetermined position during wafer measurement. Each finger includes a groove that contacts t...
02/13/2007
7156602Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine
A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are dispos...
01/02/2007
7153087Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method
A centering unit comprises a plate, centering mechanism, link mechanism, and cylinder mechanism. The plate vertically divides the interior of a frame. The support table is located substantially on the center of the plate. The centering mechanism can center each wafe...
12/26/2006
7151981Methods and apparatus for positioning a substrate relative to a support stage
In a first aspect, a substrate positioning system includes a plurality of pushers arranged in a spaced relation about a stage adapted to support a substrate. Each pusher is adapted to assume a retracted position so as to permit the substrate to be loaded onto and un...
12/19/2006
7144056Detection and handling of semiconductor wafers and wafers-like objects
An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported waf...
12/05/2006
7140655Precision soft-touch gripping mechanism for flat objects
A precision soft-touch gripping mechanism has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the p...
11/28/2006
7134827Reduced footprint tool for automated processing of microelectronic substrates
The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool desig...
11/14/2006
7108899Chip tray with tacky surface
A tray for handling and retaining a plurality of components, wherein the tray has a rigid body portion and an elastomeric contact layer. The contact layer has a planar upper surface for contacting and retaining the components, and may be formed from a thermoplastic ...
09/19/2006
7108470Buffer device for semiconductor processing apparatus
The invention provides a buffer device for a processing apparatus for semiconductor components. The apparatus comprises a transportation track for conveying semiconductor components between processing machines, and a transfer mechanism for transferring semiconductor...
09/19/2006
7104579Detection and handling of semiconductor wafers and wafer-like objects
An end effector has one or more vortex chucks to support a wafer, and at least two detectors for detecting different portions of the wafer before the wafer is picked up. If one of the detectors detects a wafer and the other one does not, an alarm is generated to ale...
09/12/2006
7104578Two level end effector
An end effector alternately (or simultaneously) transports susceptors and wafers. Separate contact surfaces are provided for wafer transport and for susceptor transport. In one embodiment, the wafer contact surface is spaced above the susceptor contact surface, and ...
09/12/2006
7073834Multiple section end effector assembly
Embodiments of an end effector assembly for a substrate robot are provided herein. In one embodiment, the end effector assembly includes a wrist and a first and a second end effector coupled to the wrist in a spaced apart relationship. The first end effector include...
07/11/2006
7064512Positioning apparatus, exposure apparatus, and semiconductor device manufacturing method
A positioning apparatus includes an X stage, a linear motor (X-axis) which drives the X stage along the X-axis, a linear motor (Y-axis) which drives a Y stage along the Y-axis, a laser interferometer which detects position information of the stages along the X and Y...
06/20/2006
7048316Compound angled pad end-effector
This invention provides a method and a support device for a wafer transfer process which has a first vertical, second horizontal and third compound angled surfaces, as well as a pair of sidewalls all contiguously connected to one another. The third surface has at le...
05/23/2006
7044521Chuck and suction board for plates
An apparatus for transferring a plate member such as a wafer by supporting the plate member with a plurality of support pins, and vacuum-sucking the plate member with a suction disk without allowing the suction disk to make contact with the plate member. Vacuum gene...
05/16/2006
7033126Method and apparatus for loading a batch of wafers into a wafer boat
A receiver frame loads and unloads a batch of semiconductor wafers onto wafer holders in a wafer boat. The wafer holders extends continuously about the perimeter of an overlying wafer. The receiver frame is provided with a plurality of supporting arms which are immo...
04/25/2006
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