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| Number | Title | Issue Date |
| 8139377 | IC device and method of manufacturing the same An IC device includes a base plate, a plurality of terminal pins, a functional component such as an IC chip, and a resin package for protection of the functional component. The base plate is generally flat and formed with a plurality of through-holes into which the ... | 03/20/2012 |
| 8098499 | Circuit arrangement having two semiconductor switching elements and one freewheeling element One aspect is a circuit arrangement including a first semiconductor switching element, a second semiconductor switching element connected in series with the first semiconductor switching element and a freewheeling element connected in parallel with the second semico... | 01/17/2012 |
| 8009442 | Directing the flow of underfill materials using magnetic particles Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an ... | 08/30/2011 |
| 7995356 | Power semiconductor module comprising load connection elements applied to circuit carriers A power semiconductor module is disclosed including a housing for receiving at least one essentially board-type circuit carrier, the circuit carrier being provided with a metallization on at least one part of its surface and being populated with and electrically con... | 08/09/2011 |
| 7545653 | Semiconductor integrated circuit device A disclosed semiconductor integrated circuit device includes a digital circuit and an analog circuit formed on one semiconductor substrate; a guard band configured to prevent noise generated in the digital circuit from being transmitted to the analog circuit; a firs... | 06/09/2009 |
| 7403399 | Active primary-sided circuit arrangement for a switch-mode power supply The invention under consideration refers to a circuit arrangement for a switch-mode power supply, wherein the switch-mode power supply has a primary side, which can be connected to a supply voltage, and a secondary side, which can be connected to a consumer, and whe... | 07/22/2008 |
| 7371108 | Printed circuit board having battery holder A printed circuit board includes a board, an electronic component mounted on the board, and a battery holder for holding a battery that has a positive pole and a negative pole. The battery holder includes a housing, and two contacts assembled to the housing and resp... | 05/13/2008 |
| 7363501 | Semiconductor integrated circuit with function to manage license information A semiconductor integrated circuit includes one or more function blocks, a nonvolatile memory unit which stores therein coded license information, and a decoder circuit which decodes the license information stored in the nonvolatile memory unit, and makes one of the... | 04/22/2008 |
| 7359590 | Semiconductor device integrated with optoelectronic components A semiconductor device integrated with optoelectronic components includes a carrier board with at least two openings; a first and a second optoelectronic component disposed in the openings respectively, each of them having an active surface and an opposite non-activ... | 04/15/2008 |
| 7352197 | Octal/quad site docking compatibility for package test handler A test system configuration is provided to enable testing of integrated circuit (IC) packages. The test system includes a test controller, an interface apparatus including a PC board with lines connecting the test controller to contact areas for contacting the IC pa... | 04/01/2008 |
| 7352587 | Power semiconductor module having a half-bridge configuration A power semiconductor module having a carrier plate, on which at least four substrates are arranged, and having a first and a second busbar having two conductive plates is disclosed. The conductive plates are arranged such that they are at a distance from one anothe... | 04/01/2008 |
| 7351905 | Apparatus for powering an electronic musical instrument Apparatus for providing electrical power to signal conditioner circuitry inside a musical instrument having a signal output jack mounted thereon to carry a conditioned music signal via a signal cable to a remote location. The power source is a battery mounted inside... | 04/01/2008 |
| 7338837 | Semiconductor packages for enhanced number of terminals, speed and power performance An integrated circuit device package with a first part (101) having a cavity (104) to mount the chip (105), further I/O terminals (102) on the top surface and terminals (103) on the bottom surface. The chip has contact pads (107... | 03/04/2008 |
| 7332363 | Integrated battery pack with lead frame connection An integrated battery package, that contains semiconductor chips, for example to control and regulate battery charging and to monitor the package operation, uses a single lead frame to interconnect several internal chips, to internally connect said control chips to ... | 02/19/2008 |
| 7334206 | Cell builder for different layer stacks A library cell, a method and/or a system for adding the cell to a circuit is disclosed. The method generally comprises a first step for generating a final layout of the cell having an area of interest in at least one upper layer within a first layer stack used for t... | 02/19/2008 |
| 7322736 | LED positioning structure An improved LED positioning structure includes a retaining holder and a cover; multiple slots being disposed on one side of the retaining holder; a slope externally extending beneath each slot gradually and externally extending a slope; a hole connecting through eac... | 01/29/2008 |
| 7316934 | Personalized hardware A system for personalizing one or more electrical circuits having plurality of layers with electrical characteristics. The layers being produced by an electrical characteristic determination process (ECDP). The system for personalizing includes a wafer stage for rec... | 01/08/2008 |
| 7303941 | Methods and apparatus for providing a power signal to an area array package An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary... | 12/04/2007 |
| 7301755 | Architecture for power modules such as power inverters Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additional... | 11/27/2007 |
| 7279853 | Fluorescent lamp dimmer control A dimmer fixture has a ballast board 10, a main board 40 and switch 70. The ballast board and main board have no inductors so the fixture may be used for fluorescent and incandescent lamps. The ballast board 10 has two bridge circuits ... | 10/09/2007 |
| 7203071 | Component mounting circuit board with resin-molded section covering circuit pattern and inner components A component mounting circuit board includes a circuit pattern including a plurality of electrically conductive plates, an inner electrical component electrically connected to the circuit pattern, and a resin molded section made of a resin by way of molding so as to ... | 04/10/2007 |
| 7203073 | Circuit-constituting member and circuit unit A group of bus bars, forming a power circuit, are adhesively bonded to a surface of a control circuit board. Surface-mounting type relay switches are used as a switching unit for the power circuit. Contact-side terminals of each relay switch are mounted on the bus b... | 04/10/2007 |
| 7193324 | Circuit structure of package substrate A circuit structure for a package substrate or a circuit board is provided. The circuit structure has a dielectric layer with an upper surface and a lower surface, at least a first line and at least a second line. The first line is disposed on the dielectric layer o... | 03/20/2007 |
| 7161092 | Apparatus and method for protecting an electronic circuit The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle struc... | 01/09/2007 |
| 7157787 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices A method of vertically stacking wafers is provided to form three-dimensional (3D) wafer stack. Such method comprising: selectively depositing a plurality of metallic lines on opposing surfaces of adjacent wafers; bonding the adjacent wafers, via the metallic lines, ... | 01/02/2007 |
| 7133286 | Method and apparatus for sealing a liquid cooled electronic device A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate,... | 11/07/2006 |
| 7108517 | Multi-site chip carrier and method An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged t... | 09/19/2006 |
| 7101770 | Capacitive techniques to reduce noise in high speed interconnections Improved methods and structures are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. The present invention offers an improved signal to noise ration. The present invention provides for the fabr... | 09/05/2006 |
| 7091580 | Semiconductor device When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a resin member due to capillary action. However, since the gap becomes... | 08/15/2006 |
| 7085143 | In-module current source Disclosed is a method and structure for locally powering a semiconductor chip within a package. The structure and method incorporate a local voltage regulator mounted adjacent a semiconductor chip on a top surface of a carrier. The voltage regulator is electrically ... | 08/01/2006 |
| 7054599 | High density interconnect structure for use on software defined radio A radio and method of making the radio is disclosed having a first set of radio components for processing analog signals in a radio transmission and a second set of radio components for processing digital signals in a radio transmission. The radio comprises a substr... | 05/30/2006 |
| 7031170 | Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the elect... | 04/18/2006 |
| 7022553 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The... | 04/04/2006 |
| 7015579 | Semiconductor device for fingerprint recognition A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reli... | 03/21/2006 |
| 6995443 | Integrated circuits using optical fiber interconnects formed through a semiconductor wafer An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These opt... | 02/07/2006 |
| 6995441 | Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same An integrated circuit with a number of optical waveguides that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical waveguides include a highly reflective material that is deposited so as to line an inn... | 02/07/2006 |
| 6975026 | Package for mounting semiconductor device A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal. ... | 12/13/2005 |
| 6975515 | Electrical module An optical encoder module includes a housing that includes at least one recess having an open end and an opposite closed end, and an electrical component accommodated within the recess. A first locking member is formed on the electrical component and a second lockin... | 12/13/2005 |
| 6958536 | Microelectronic packages having rail along portion of lid periphery The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peri... | 10/25/2005 |
| 6956392 | Heat transfer apparatus for burn-in board An apparatus for transferring heat from semiconductor devices during a burn-in operation is disclosed. The apparatus includes a substantially planar base board through which a plurality of openings are extended. Heat sinks coordinated with the openings are connected... | 10/18/2005 |
