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"During my service in the United States Congress, I took the initiative in creating the Internet."
Al Gore ; The basis for the later misquote by US Republicans that Gore had "invented" the Internet. Gore was the leading political champion of the modern-day Internet.
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| Number | Title | Issue Date |
| 8427844 | Widebody coil isolators Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage bre... | 04/23/2013 |
| 8400784 | Flip chip package for monolithic switching regulator Methods and apparatuses related to packaging a monolithic voltage regulator are disclosed. In one embodiment, an apparatus includes: (i) a monolithic voltage regulator with a transistor arranged as parallel transistor devices; (ii) bumps on the monolithic voltage re... | 03/19/2013 |
| 8358514 | Electronic control device In an electronic control device, an electrically-conductive adhesive is arranged on an outer edge portion of a first surface of a circuit board as a stress reducing portion for reducing stress of the circuit board received by a molding resin. An elastic modulus of t... | 01/22/2013 |
| 8254147 | Box for an electronics module for controlling a machine A box for an electronics module for controlling a machine, in particular an engine, wherein the box comprises: a portion co-operating with at least one harness for connecting the box mechanically and electrically to the machine; an... | 08/28/2012 |
| 8184453 | Increased capacity semiconductor package Disclosed is a lead frame and a semiconductor device including the same. The lead frame is provided with a die pad, and first, second and third lands sequentially arranged on an outer circumferential edge. The lead frame can separate the first and second lands or th... | 05/22/2012 |
| 8159835 | Laser apparatus A laser apparatus comprises: a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead; mold resin that has a top surface, does not seal the first outer lead but does seal the first inner lead and cleaves part of the first i... | 04/17/2012 |
| 8116102 | Integrated circuit device and method of producing An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and a semiconductor chip attached to the lead frame. ... | 02/14/2012 |
| 8085553 | Lead assembly for a flip-chip power switch A power switch assembly includes a flip-chip type integrated circuit chip and a lead-frame with a plurality of spaced apart parallel lead sections. The flip-chip type integrated circuit chip includes a distributed transistor, and first and second pluralities of flip... | 12/27/2011 |
| 8040690 | Inner-connecting structure of lead frame and its connecting method An inner-connecting structure of a lead frame. The lead frame includes a metal frame having a plurality of leads. The inner-connecting structure of the lead frame includes an insulation film arranged on some of those leads, covering a portion of a first surface of t... | 10/18/2011 |
| 7697303 | Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadfr... | 04/13/2010 |
| 7688599 | Lead frame module for manufacturing light emitting diodes A lead frame module integrally formed from a single thin metal sheet includes: parallel first and second rails extending in a first direction; and first and second lead frame sets connected to the first and second rails, respectively. The first and second lead frame... | 03/30/2010 |
| 7435102 | Interconnecting electrical devices A male contact having a longitudinal axis includes a head configured to contact a corresponding electrical contact and a first portion extending along the longitudinal axis and configured to be received within a socket of a corresponding terminal assembly. The first... | 10/14/2008 |
| 7425470 | Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at lea... | 09/16/2008 |
| 7425756 | Semiconductor device and electronic device This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconducto... | 09/16/2008 |
| 7405467 | Power module package structure A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips... | 07/29/2008 |
| 7400002 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/15/2008 |
| 7394146 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/01/2008 |
| 7391101 | Semiconductor pressure sensor A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a... | 06/24/2008 |
| 7385394 | Integrated magnetic sensor component A sensor component used to measure a magnetic field strength is disclosed. In one embodiment, the sensor component contains a plurality of leads and a sensor semiconductor chip, which measures the magnetic field strength. The sensor semiconductor chip has pads on it... | 06/10/2008 |
| 7370134 | System and method for memory hub-based expansion bus A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also having access to the memory module. The memory hub controller is coupl... | 05/06/2008 |
| 7366920 | System and method for selective memory module power management A memory module includes a memory hub that monitors utilization of the memory module and directs devices of the memory module to a reduced power state when the module is not being used at a desired level. System utilization of the memory module is monitored by track... | 04/29/2008 |
| 7363419 | Method and system for terminating write commands in a hub-based memory system A memory hub receives downstream memory commands and processes each received downstream memory command to determine whether the memory command includes a write command directed to the memory hub. The memory hub operates in a first mode when the write command is dire... | 04/22/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7358619 | Tape carrier for TAB A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides... | 04/15/2008 |
| 7353320 | Memory hub and method for memory sequencing A memory module includes a memory hub coupled to several memory devices. The memory hub includes at least one performance counter that tracks one or more system metrics—for example, page hit rate, prefetch hits, and/or cache hit rate. The performance counter commu... | 04/01/2008 |
| 7351911 | Connection box An connection box includes a circuit board. The box includes a control board connected to the circuit board. The control board includes an insulation board. The box includes a radiative device mounted on the control board. The radiative device is spaced away from th... | 04/01/2008 |
| 7347719 | Electrical connector with strain relief features A preferred embodiment of a connector system includes a first electrical connector for mounting on a first substrate. The first electrical connector has a housing, and a contact mounted on the housing. The connector system also includes a second electrical connector... | 03/25/2008 |
| 7342267 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 03/11/2008 |
| 7342297 | Sawn power package In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to ... | 03/11/2008 |
| 7342309 | Semiconductor device and fabrication method thereof A semiconductor device has four levels of semiconductor chips stacked on a die pad of a lead frame. Specifically, the first, second, third and fourth semiconductor chips are stacked in turn. The first semiconductor chip shifts from the second semiconductor chip, and... | 03/11/2008 |
| 7339797 | Chip mount, methods of making same and methods for mounting chips thereon The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in ele... | 03/04/2008 |
| 7332757 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 02/19/2008 |
| 7332844 | Alternator with removable brush block and method of changing brushes in an alternator An alternator comprises a housing including a first portion, and a second portion having a plurality of electrical connectors and having an aperture; a stator supported in the first portion of the housing; a rotor supported for rotation relative to the stator and co... | 02/19/2008 |
| 7330992 | System and method for read synchronization of memory modules A memory module includes several memory devices coupled to a memory hub. The memory hub includes several link interfaces coupled to respective processors, several memory controller coupled to respective memory devices, a cross-bar switch coupling any of the link int... | 02/12/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7323774 | Integrated circuit package system with pedestal structure An integrated circuit package system includes providing a substrate having a bond finger thereon and forming a pedestal on a portion of the bond finger. A first die is mounted on the substrate and adjacent to the bond finger. A portion of the first die, a portion of... | 01/29/2008 |
| 7312547 | Alternator with replaceable resistor, and method of changing the maximum output current of an alternator An alternator comprises a housing including a first portion, and a second portion having a plurality of electrical connectors and having an aperture; a stator supported in the first portion of the housing; a rotor supported for rotation relative to the stator and co... | 12/25/2007 |
| 7311451 | Method of manufacturing optical communication module, and optimum mold and lead frame for use in the manufacturing method A method of manufacturing an optical communication module, and a mold and a lead frame that are suitable for the method are provided. The method comprises the steps of: placing in a mold the lead frame on which a ferrule and an optical communication facility section... | 12/25/2007 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7310748 | Memory hub tester interface and method for use thereof A memory hub including a memory test bridge circuit for testing memory devices. Test command packets are coupled from a tester to the memory hub responsive to a test clock signal having a test clock frequency. The test bridge circuit generates memory device command,... | 12/18/2007 |
