Class 361/808 - Mounting pad

Subclass of Class 361 - Electricity: electrical systems and devices
Definition: Subject matter wherein an intermediate support connected
No. of patents: 167
Last issue date: 01/10/2012

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Number	Title	Issue Date
8094463	Crystal oscillator for surface mounting A crystal oscillator for surface mounting comprising: a case main body including concave portions on both principal surfaces; a crystal element hermetically encapsulated in one concave portion; an IC chip housed in the other concave portion; mounting terminals provi...	01/10/2012
7957158	Circuit device A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements...	06/07/2011
7474541	Printed circuit board and heat dissipating metal surface layout thereof In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the...	01/06/2009
7440281	Thermal interface apparatus An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining ...	10/21/2008
7414317	BGA package with concave shaped bonding pads In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a per...	08/19/2008
7411795	Desktop holder for portable terminal Provided is a desktop holder for a portable terminal. The desktop holder for a portable terminal includes a main body and a soft member. The soft member is elastically assembled with the main body, has an opening corresponding to a shape of any portable terminal sel...	08/12/2008
7365991	Dual LED board layout for lighting systems Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line ...	04/29/2008
7335970	Semiconductor device having a chip-size package Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided i...	02/26/2008
7333771	Mounting pedestal for a cellular signal enhancer A relatively low cost, easy to install and aesthetically pleasing cellular signal enhancer, also known as a wireless repeater, suitable for use in a home or business. The device includes a removable mounting pedestal that can be plugged into both an upper and a lowe...	02/19/2008
7322834	Electrical connector with improved contacts An electrical connector (1) for mounting to a circuit board includes a dielectric housing (10) and a number of conductive contacts (20) positioned in the housing. The dielectric housing has a mounting surface and a top surface opposite thereto, ...	01/29/2008
7319275	Adhesion by plasma conditioning of semiconductor chip A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method c...	01/15/2008
7298629	Circuit board for mounting a semiconductor circuit with a surface mount package A circuit board has a plurality of pads arranged as a grid array in a quadrangle region. A surface mount type circuit component is connected to the circuit board through the pads. Each of pads arranged in the outermost side of the quadrangle region is formed in a su...	11/20/2007
7247931	Semiconductor package and leadframe therefor having angled corners A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package. ...	07/24/2007
7236372	Surface mounted power supply circuit apparatus and method for manufacturing it A surface mounted power supply circuit apparatus, including a circuit substrate, circuit constituting parts mounted on the circuit substrate, and a sealing member provided on the circuit substrate for covering the circuit constituting parts, at least one portion of ...	06/26/2007
7212400	Fixing apparatus for motherboard A fixing apparatus is for fixing a motherboard (60) in a chassis (20). The chassis includes a supporting board (30). The supporting plate includes a number of clips (36, 38), and a screw hole (391). The motherboard (60) defi...	05/01/2007
7207845	Multi-function electrical connector An electrical connector (100) includes a first housing piece (2), a second housing piece (3) interrelated with the first housing piece, and a number of contacts (4) assembled to the first and second housing pieces. The first housing piece...	04/24/2007
7193306	Semiconductor structure having stacked semiconductor devices A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavitie...	03/20/2007
7134880	Connector with self-adjusting vertical alignment feature A connector has a plurality of holes formed in an insulating layer. Contacts inside these holes have contact parts at the top and bottom. Each contact has a base part, a pair of contact parts which extend up and down from the base part, a lip which is connected to t...	11/14/2006
7120033	Electrically conducting bonding connection An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting ...	10/10/2006
7095625	Electronic component mounting circuit board and electronic component replacing method An electronic component mounting circuit board for mounting an electronic component, comprises a circuit board, and connection pads provided on the circuit board, the connection pads being formed with a plurality of holes for inserting terminals of the electronic co...	08/22/2006
7079776	Optical signal transmission board and apparatus An individual optical signal transmission substrate includes an optical signal transmission area where at least one of a light emitting element for sending an optical signal to other optical signal transmission substrates or a light receiving element for receiving a...	07/18/2006
7057291	Methods for securing vertically mountable semiconductor devices in back-to back relation A method for assembling vertically mountable semiconductor devices includes positioning the semiconductor devices so that backsides thereof face one another and that edges of the vertically mountable semiconductor devices along which contacts are disposed are in ali...	06/06/2006
7052289	Conductive terminal and the electrical connector using the conductive terminal A conductive terminal and the electrical connector using the conductive terminal, the conductive terminal is received in a terminal channel defined in an insulative housing of the electrical connector which can transmit signal between an electronic component and a c...	05/30/2006
7045902	Circuitized substrate for fixing solder beads on pads A circuitized substrate has contact pads for mounting a Surface Mount Device (SMD). First and second contact pads are located on a surface of the substrate corresponding to a first terminal and a second terminal of the SMD. The first and the second contact pads have...	05/16/2006
7029183	Optical fiber array connector An optic array connector is disclosed. The fiber optic array includes a first faceplate having a plurality of openings. The first faceplate is oriented in a first direction. The fiber optic array also includes a second faceplate having a plurality of openings. The s...	04/18/2006
7029292	Electrical connector and contact Disclosed is an electrical connector having an insulative housing and conductive connector wherein conductive connector has a distal end which is angled and generally rectangular in shape with the four corners of the rectangular shape of the distal end bent to recei...	04/18/2006
7031170	Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the elect...	04/18/2006
7019982	Foolproof polarity indications of poled electronic parts or devices in printed circuit board A foolproof polarity indication for poled electronics parts or devices to be mounted to a printed circuit board assures that the poled electronics parts and/or devices are correctly mounted with respect of their polarities to meet occasional requirements dependent o...	03/28/2006
7005586	Supplying power/ground to a component having side power/ground pads In various embodiments, one or more connectors are configured to make electrical contact with side power and ground pads on a component. The connectors may include, in some embodiments, a conductive member and a compressible conductor for making electrical contact w...	02/28/2006
7002813	Assembly comprised of a panel-like constructed module and of a connection unit, production method and device An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with...	02/21/2006
6994918	Selective application of conductive material to circuit boards by pick and place A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a fi...	02/07/2006
6992898	Smart-card module with an anisotropically conductive substrate film A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The...	01/31/2006
6977338	Wiring board and magnetic disk apparatus A wiring board is constructed such that a base layer constituted of photosensitive polyimide, a conductor layer constituted of copper, and a cover layer constituted of photosensitive polyimide are formed in this order on a stainless layer. On an electronic part moun...	12/20/2005
6915566	Method of fabricating flexible circuits for integrated circuit interconnections A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (...	07/12/2005
6906408	Assemblies and packages including die-to-die connections A semiconductor device assembly includes a first semiconductor die, such as a logic device, with bond pads arranged in an array on an active surface thereof, and at least one second semiconductor die, such as a memory device or an ancillary or parallel logic device,...	06/14/2005
6873037	Vertical surface mount package utilizing a back-to-back semiconductor device module A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the device module. The device module may be sec...	03/29/2005
6812570	Organic packages having low tin solder connections An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface there...	11/02/2004
6785144	High density stackable and flexible substrate-based devices and systems and methods of fabricating A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be applied to t...	08/31/2004
6781223	Semiconductor device having a signal lead exposed on the undersurface of a sealing resin with an air gap between the signal lead and a mounting substrate This semiconductor device comprises a semiconductor chip, a signal lead connected to a signal electrode of the semiconductor chip, an external signal electrode connected with the signal lead, a ground lead extending along the signal lead, and a sealing resin sealing...	08/24/2004
6774317	Connection components with posts A subtractively created interconnection scheme and apparatus, typically used with microelectronic devices, wherein a flexible support structure is attached to a conductive sheet. The conductive sheet is then selectively removed, preferably using an etching process, ...	08/10/2004

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Class 361/808 - Mounting pad