Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 7948770 | ACLED system in single chip with three metal contacts A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC_LED system in single chip with four metal contacts is also discl... | 05/24/2011 |
| 7401933 | Mounting apparatus for light emitting diode A mounting apparatus for a light emitting diode having a shoulder extending therefrom includes a panel, a base, and a bracket. The panel defines a through hole therein for the light emitting diode emitting light therethrough. The base extends from the panel round th... | 07/22/2008 |
| 7338843 | Method for producing an electronic component, especially a memory chip A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of ... | 03/04/2008 |
| 7329035 | Child's nightlight There is disclosed a nightlight that can be held or worn by a child and that can display projected images in 3-D mode upon a flat surface to comfort and provide assurance for a child when left in the dark. ... | 02/12/2008 |
| 7227259 | Low-inductance circuit arrangement for power semiconductor modules A circuit arrangement for a power semiconductor module provides low parasitic inductances and low loss. An electrically insulating substrate supports metallic ribbon connectors which in turn power attached semiconductor components. DC port conducts are positioned in... | 06/05/2007 |
| 7188410 | Insertion of electrical component within a via of a printed circuit board A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed ... | 03/13/2007 |
| 7148503 | Semiconductor device, function setting method thereof, and evaluation method thereof The present invention provides a semiconductor device, in which a plurality of chip IPs are mounted onto a common semiconductor circuit board, an evaluation method for the same, and a function setting method for the same. Various IP groups can be mounted as chip IPs... | 12/12/2006 |
| 7088592 | ESD protection structure and device utilizing the same An electronic device utilizing an electrostatic discharge (ESD) protection structure. The electronic device comprises a housing and a printed circuit board (PCB) with an ESD protection structure disposed thereon. The PCB has at least one metal layer with a ground ci... | 08/08/2006 |
| 7071423 | Circuitized substrate assembly and method of making same A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to ... | 07/04/2006 |
| 7031170 | Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the elect... | 04/18/2006 |
| 6902308 | Illumination system A lighting assembly includes a printed circuit board and a cover. The printed circuit board carries a plurality of groups of LEDs. The cover is unitarily formed and receives the printed circuit board. The cover defines a corresponding plurality of windows. Each of t... | 06/07/2005 |
| 6798662 | Electromagnetic interference and heatsinking A first apparatus includes a semiconductor device and a heatsink thermally coupled to the semiconductor device. The heatsink is located and formed to screen the device from external electromagnetic radiation or to contain radiation produced by the device. A second a... | 09/28/2004 |
| 6621716 | LED package An LED package having a generally tubular electrically conductive body, a circuit board which is mounted across the body at or adjacent one end thereof and which has an outer face on which an LED is mounted, an end contact exposed at the end of the body r... | 09/16/2003 |
| 6612890 | Method and system for manufacturing electronic packaging units A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing moldi... | 09/02/2003 |
| 6538901 | Optical transceiver module An optical transceiver module includes a body and an optical transceiver unit. The body includes a seat, a mini head cover coaxially arranged within the seat, and a tubular sleeve coaxially engaged to the seat. The optical transceiver unit includes a reta... | 03/25/2003 |
| 6304448 | Power module Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface o... | 10/16/2001 |
| 6275387 | Light emitting device mounting bracket A light emitting device mounting bracket includes a body and mounting hooks for fixing the bracket to a computer enclosure. The body defines a hole for mounting a light emitting device, a turret with a snap being formed at one side of the hole and a battl... | 08/14/2001 |
| 6217228 | Fiber channel drive adapter An interface is provided, the interface having at least two form factors--one for interfacing to a connector on a fiber channel drive and one or more other form factors for interfacing to one or more other styles of connectors. The first form factor is on... | 04/17/2001 |
| 6188551 | Method of controlling compressor for refrigerator A method of controlling a refrigerator including a power supply unit, an inverter applying three-phase power to a compressor is disclosed. The compressor is driven initially for a predetermined period of time. If the RPM of the compressor is not within th... | 02/13/2001 |
| 6046901 | Support structure, electronic assembly An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurali... | 04/04/2000 |
| 5929519 | Semiconductor module including switching device chips and diode chips An inverter device includes plural modules, each module being formed by a series circuit having a parallel circuit of a switching device and a first diode, and a parallel circuit of a second switching device and a second diode, allowing a reduced size, hi... | 07/27/1999 |
| 5841178 | Optical component package Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side surfaces. The resulting assembly is solder bonded to the bottom ... | 11/24/1998 |
| 5689279 | Integrated electro-optical package An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected... | 11/18/1997 |
| 5640308 | Field programmable circuit module The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is then formed over the one or both surfaces of the substrate... | 06/17/1997 |
| 5612855 | Adapter for mounting on a circuit board An adapter (1, FIG. 1) is provided for the connection of an optoelectronic component such as an LED (light emitting diode) (2) to a circuit board (8) that lies in a case (34), wherein the adaptor positions the LED close to a window (32) in the top wall (3... | 03/18/1997 |
| 5572409 | Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable socket adapter in one embodiment. The socket adapter can be used for interconnecting an electronic component having terminals in a first config... | 11/05/1996 |
| 5534718 | LED package structure of LED display An improved light emitting diode (LED) package structure for an LED lighting device comprises a reflector having a bowl-shaped reflecting surface formed by a pressing technique. A stand member extends from the center of the reflecting surface to the focus... | 07/09/1996 |
| 5432358 | Integrated electro-optical package An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected... | 07/11/1995 |
