Bizarre Patents
Mouthguard made at least partially from an edible candy
A mouthguard includes a U-shaped upper bite plate which removably fits over upper teeth of a person, with the entire upper bite plate being made from a soft, deformable and edible gummi candy.
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| Number | Title | Issue Date |
| 7411134 | Hybrid ground grid for printed circuit board Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines i... | 08/12/2008 |
| 7397001 | Multi-strand substrate for ball-grid array assemblies and method A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M... | 07/08/2008 |
| 7361983 | Semiconductor device and semiconductor assembly module with a gap-controlling lead structure In a semiconductor device (1), semiconductor elements (2) and (3) are mounted on a lead frame (5) having leads (4). The semiconductor elements (2) and (3) are connected with the leads (4) by metallic wires (... | 04/22/2008 |
| 7321497 | Electronic circuit apparatus and method for stacking electronic circuit units The invention provides an electronic circuit apparatus having a plurality of electronic circuit units (101a-101n), a circuit board (102) and a connection unit (103), the circuit board (102) having a basic board elemen... | 01/22/2008 |
| 7247941 | Printed circuit board assembly with strain-alleviating structures A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the receiving zone. Each island portion includes a solder member for contacting ... | 07/24/2007 |
| 7199306 | Multi-strand substrate for ball-grid array assemblies and method A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M... | 04/03/2007 |
| 7139648 | Apparatus for actuating a control element for a heating or air-conditioning system in a motor vehicle The invention relates to an apparatus for actuating a control element, for example, an air flap, for a heating or air-conditioning system (34) in a motor vehicle, having an actuating drive (32), an electrical circuit (1) which controls the actua... | 11/21/2006 |
| 7082676 | Electrostatic discharge (ESD) tool for electronic device under test (DUT) boards An anti-electrostatic discharge (ESD) tool for engaging electronic device under test (DUT) boards whereby ESD damage to the tested devices is prevented. The tool includes an aluminum support frame, guides on opposing edges of one side of the frame for slidably recei... | 08/01/2006 |
| 7081591 | Circuit board The printed circuit board comprises a plate made of an insulating material and having opposite surfaces and having a connection strip portion including a grouping of at least three rows of sets of at least three spaced apart connection locations in each set on at le... | 07/25/2006 |
| 7031170 | Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the elect... | 04/18/2006 |
| 7012196 | Apparatus, method and system for interfacing electronic circuits A breadboard comprising a plate made of an insulating material and having a connection strip portion including a grouping of at least three rows of sets of at least three spaced apart holes in each set in the plate, the centers of the holes in each set being spaced ... | 03/14/2006 |
| 6831233 | Chip package with degassing holes A semiconductor device package includes multiple built-up layers of metal sandwiching non-conductive layers. The metal layers have grids of degassing holes arranged in rows and columns. The rows and columns are locatable via a first coordinate system. Signal traces ... | 12/14/2004 |
| 6787984 | Wiring substrate, manufacturing method therefor, and image display device A wiring substrate for a display panel having a plurality of wiring electrodes thereon includes an airtight container formed by disposing an opposing substrate through a frame member on the surface of the substrate having the wiring electrodes. The airtight containe... | 09/07/2004 |
| 6710265 | Multi-strand substrate for ball-grid array assemblies and method A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M... | 03/23/2004 |
| 6542952 | PCI computer system having a transition module and method of operation A PCI computer system includes component boards (130) adjacent to and coupled to a PCI bus (120), a controller board (310) coupled to the PCI bus, a transition module (140) coupled to the PCI bus, a switching matrix (150, 151) coupled to the transition mo... | 04/01/2003 |
| 6535397 | Interconnect structure for interconnecting electronic modules An interconnect structure interconnects electronic modules and includes a backplane assembly formed from a substantially rigid backplane plate that carries RF connectors and a digital motherboard having digital connectors for mating with digital connector... | 03/18/2003 |
| 6496377 | Vehicle electric power distribution system A vehicle electric power distribution apparatus is provided which includes a plurality of vertically stacked conductive circuit layers, each layer including an array of contact pads, a layer of electrically insulating plastic material between each of the ... | 12/17/2002 |
| 6485309 | Virtual midplane to enhance card interconnections using a matrix of interconnecting assemblies The present invention is a method and apparatus for interconnection system. A first connector located on a first card provides first contacts for first signal traces on the first card. The first connector has a first housing enclosing the first contacts a... | 11/26/2002 |
| 6445578 | Data storage enclosure An enclosure for a data storage system comprises at least first and second cast magnesium parts joined by rivets, each of which is made of a suitable material that provides compressive strength superior to that of the cast magnesium. Each rivet is of a he... | 09/03/2002 |
| 6423909 | Circuit board construction for differential bus distribution A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external cables. Via fields, which mimic the size and configuration of th... | 07/23/2002 |
| 6388200 | Electronic interconnection medium having offset electrical mesh plane An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first and second interconnection layers are oriented orthogonally... | 05/14/2002 |
| 6303871 | Degassing hole design for olga trace impedance An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern occurs in two substantially perpendicular directions. Traces be... | 10/16/2001 |
| 6297460 | Multichip module and method of forming same An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first and second interconnection layers are oriented orthogonally... | 10/02/2001 |
| 6255600 | Electronic interconnection medium having offset electrical mesh plane An electrical interconnection medium is provided having first and second overlying interconnection layers. Each interconnection layer includes parallel conductors, and the conductors of the first and second interconnection layers are oriented orthogonally... | 07/03/2001 |
| 6049043 | Printed circuit board A printed circuit board has a plastic carrier plate and a one-piece pressed screen forming interconnects of the electrical circuit that are firmly mechanically connected to one another via preferably hot-stamped or ultrasound-deformed plastic webs. The in... | 04/11/2000 |
| 6037677 | Dual-pitch perimeter flip-chip footprint for high integration asics A connection array for a chip provides a substantial increase in numbers of signal connection locations and a power distribution arrangement of improved robustness and noise immunity while accommodating multiple power supply voltages by providing pairs of... | 03/14/2000 |
| 5956232 | Chip support arrangement and chip support for the manufacture of a chip casing Chip-support arrangement (23) with a chip support (23) for the manufacture of a chip casing, said chip support being provided on a support foil (20) with conducting paths (21) which are connected on the front side of the support foil facing a chip (39) to... | 09/21/1999 |
| 5887158 | Switching midplane and interconnecting system for interconnecting large numbers of signals A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane printed-circuit board having a plurality of first connectors oriented i... | 03/23/1999 |
| 5748450 | BGA package using a dummy ball and a repairing method thereof In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90° around the dummy balls. When a defect occurs in a solder joint, the package c... | 05/05/1998 |
| 5644115 | Relay matrix switching assembly A matrix of three pole, high speed, low current relays for connecting test equipment to a device under test is provided with improved interconnect buses. The relays are mounted in rows and columns with their three pairs of leads extending vertically. An i... | 07/01/1997 |
| 5640308 | Field programmable circuit module The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is then formed over the one or both surfaces of the substrate... | 06/17/1997 |
| 5633479 | Multilayer wiring structure for attaining high-speed signal propagation Signal wiring layers are formed between a power supply layer and a ground layer, which have conductor patterns each constituted by a plurality of parallel strip-shaped conductors. The above layers are isolated from each other by insulating layers. The sig... | 05/27/1997 |
| 5585602 | Structure for providing conductive paths A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming, at a single level, one or more lateral conductive links betw... | 12/17/1996 |
| 5572409 | Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board Two types of programmable elements, fuses and antifuses, are disclosed for forming an electrically programmable socket adapter in one embodiment. The socket adapter can be used for interconnecting an electronic component having terminals in a first config... | 11/05/1996 |
| 5512782 | Semiconductor device for DC/AC converter A semiconductor device for converting DC input power to AC output power includes a package having a rectangular shape with four side edges and containing a plurality of semiconductor chips therein. Two pairs of positive and negative terminals of DC input ... | 04/30/1996 |
| 5481073 | Modular broadband bidirectional programmable switch system with stacked modular switch arrangement The basic element of a modular, bidirectional broadband programmable switch system is a switch module having a thin rectangular housing with a single first connector preferably in the center of an elongated rear face and n second connectors equally spaced... | 01/02/1996 |
| 5438166 | Customizable circuitry A customizable circuit using a programmable interconnect and compatible TAB chip bonding design. The programmable interconnect comprises layers of wire segments forming programmable junctions rather than continuous wires. This segmentation is performed wi... | 08/01/1995 |
| 5410107 | Multichip module An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second interconnection layers being oriented orthogonal to each other,... | 04/25/1995 |
| 5390081 | Fault-tolerant power distribution system for rack-mounted hardware Fault-tolerant power distribution system for back-mounted hardware in which a backplane arrangement delivers alternative sources of system power in a prioritized pattern to each of a plurality of fault-tolerant electronic cards via a plurality of system s... | 02/14/1995 |
| 5352123 | Switching midplane and interconnection system for interconnecting large numbers of signals A physical interconnection architecture for making connections between a plurality of first printed-circuit boards and a plurality of second printed-circuit boards includes a midplane printed-circuit board having a plurality of first connectors oriented i... | 10/04/1994 |
