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| Number | Title | Issue Date |
| 8179693 | Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched be... | 05/15/2012 |
| 8154882 | Computer system and motherboard and monitor thereof A first terminal of a first switch, a first idling pin, a third idling pin, and a power pin are connected together. A second terminal of the first switch, a first ground pin, a second ground pin, and a third ground pin are electrically connected together. A first te... | 04/10/2012 |
| 8139374 | Electronic device having electrically connecting structure An electronic device is provided which makes it possible to reduce noise generated from a signal line around a connecting portion connecting a first body and a second body. The connecting portion has a first metallic portion. A first circuit board provided in the fi... | 03/20/2012 |
| 8130514 | Mounting structure, electro-optical device, and electronic apparatus A mounting structure includes: a first substrate; a second substrate; a first terminal being formed on the first substrate and having a plurality of terminal portions arranged with a gap therebetween; a different terminal being formed on the first substrate and bein... | 03/06/2012 |
| 8116100 | Semiconductor device Traffic between logic LSIs and memory is increasing year by year and there is demand for increase of capacity of communication between them and reduction of power consumption in the communication. Communication distances between LSIs can be reduced by stacking the L... | 02/14/2012 |
| 8116099 | Circuit board device, electronic device provided with the same, and GND connecting method Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND conne... | 02/14/2012 |
| 8116098 | Base element, base system and method for manufacturing another base system A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a firs... | 02/14/2012 |
| 8116097 | Apparatus for electrically coupling a semiconductor package to a printed circuit board An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The pl... | 02/14/2012 |
| 8102671 | Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modules A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory... | 01/24/2012 |
| 8064221 | Electronic devices for surface mount Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary ... | 11/22/2011 |
| 8064222 | Semiconductor integrated circuit device A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a ... | 11/22/2011 |
| 8054647 | Electronic device mounting structure for busbar An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The fla... | 11/08/2011 |
| 8054646 | Circuit board connecting structure The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuratio... | 11/08/2011 |
| 8050053 | Electronic circuit arrangement for control purposes The electronic circuit arrangement for controlling a process device comprises a process interface circuitry and a processing circuitry, wherein the process interface circuitry is designed for receiving process signals from the process device and converting the proce... | 11/01/2011 |
| 8018738 | Voltage regulator attach for high current chip applications A voltage regulator. The voltage regulator includes an interposer having, on a first side, a plurality of electrical connections suitable for coupling to a printed circuit board (PCB). The interposer also includes at least one power plane and at least one ground pla... | 09/13/2011 |
| 8018736 | Card design with fully buffered memory modules and the use of a chip between two consecutive modules The invention concerns the use of an AMB component (25) in a memory installation with fully buffered Dimm memory modules connected in series, characterised in that the AMB component (25) is placed on a connecting line (30) from the memory module... | 09/13/2011 |
| 8018737 | Connecting structure of circuit board, connecting part of circuit board and electronic device The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 | 09/13/2011 |
| 7990737 | Memory systems with memory chips down and up In some embodiments, a system includes a memory controller chip, memory chips on a first substrate, and a module connector. A first group of conductors is included to provide read data signals from at least some of the memory chips to the memory controller chip, and... | 08/02/2011 |
| 7983056 | Semiconductor device In a semiconductor device provided with terminals for external connection, input terminals, power supply terminals and ground terminals are disposed close together on part of one edge portion of two opposing edge portions. Output terminals are disposed in the vicini... | 07/19/2011 |
| 7944710 | Termination apparatus and method for planar components on printed circuit boards The disclosure involves the efficient termination of a winding PCB of a planar inductive component to a main PCB, using relatively little space and providing a low-resistance connection. The disclosed methods are especially suitable for planar structures where sever... | 05/17/2011 |
| 7936570 | Liquid crystal display device The present invention provides a liquid crystal display device which can establish the reliable connection between a printed circuit board and a semiconductor device in spite of the simple constitution thereof. The liquid crystal display device includes a liquid cry... | 05/03/2011 |
| 7924575 | Electronic apparatus A cable connects a circuit board mounted with an electronic circuit to a BT module that controls wireless communications compliant with Bluetooth (Registered Trademark). The cable is a connection cable that elastically deforms and applies pushing force in a directio... | 04/12/2011 |
| 7920389 | Board hardware device and radio frequency blind-mate connection device An RF blind-mate connection device disclosed herein includes a duplexer, a power amplification circuit board, a transceiver, an RF signal connector, and a power connector. The duplexer and the transceiver are located at one end of the RF blind-mate connection device... | 04/05/2011 |
| 7881072 | System and method for processor power delivery and thermal management A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a b... | 02/01/2011 |
| 7839657 | Position adjustable printed circuit board A circuit board assembly includes a mother board and a daughter board. The daughter board is defined by a plurality of frangible connections to the mother board and is disposed on a common plane with the mother board. After all the electronic devices are installed t... | 11/23/2010 |
| 7804695 | System for interconnecting two substrates each comprising at least one transmission line The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of... | 09/28/2010 |
| 7800918 | Hierarchical module There is provided a memory module that facilitates meeting the needs of high-speed performance and large capacity. It comprises first module substrates (101 through 108), each with multiple DRAM devices (11), and a second m... | 09/21/2010 |
| 7800919 | Programmable routing module A programmable routing module is disclosed for interconnecting field wiring with a control system. The routing module includes a field connection to connect field signals from a controlled process to the routing module, an I/O connection to connect I/O signals from ... | 09/21/2010 |
| 7791900 | Galvanic isolator A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion b... | 09/07/2010 |
| 7778042 | Memory system having point-to-point (PTP) and point-to-two-point (PTTP) links between devices A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the... | 08/17/2010 |
| 7778041 | Interconnection system between CPU and voltage regulator A power interconnection system is provided including a printed circuit board (10), a voltage regulator package (30), and an electrical connection socket (20) adapted for receiving a chip package (40) therein. The electrical socket and the... | 08/17/2010 |
| 7768796 | Die module system A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector con... | 08/03/2010 |
| 7760513 | Modified core for circuit module system and method Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. The populated flexible circuitry is disposed proximal to a rigid substrate to place the integrated circuitry on one or both sides of the substrate with one... | 07/20/2010 |
| 7755912 | Printed circuit board unit and electronic apparatus A printed circuit board unit includes a first board and a second board. First electrically-conductive terminals are fixed and exposed on the front surface of the first board in a matrix. Second electrically-conductive terminals are arranged in a matrix and supported... | 07/13/2010 |
| 7755881 | Modular server architecture with Ethernet routed across a backplane utilizing an integrated Ethernet switch module A modular server system includes a midplane having a system management bus and a plurality of blade interfaces on the midplane. The blade interfaces are in electrical communication with each other. A server blade is removeably connectable to one of the plurality of ... | 07/13/2010 |
| 7710741 | Reconfigurable graphics processing system One embodiment of a reconfigurable graphics processing system includes a first MXM edge connector and a second MXM edge connector affixed to an interposer board and a first MXM board and a second MXM board coupled to the interposer board via the first and second MXM... | 05/04/2010 |
| 7667982 | LSI package with interface module and interface module An LSI package includes an interface module having first and second surfaces and including a wiring board having a first through hole, a driver selectively provided on the second surface, a transmission line connected to the driver, and a first terminal formed on th... | 02/23/2010 |
| 7633767 | Memory modules including SIMM and DIMM-type connection structures and related memory systems A memory module includes a body with a plurality of memory chips mounted thereon and an elongated connector protruding from the body. The elongated connector includes a plurality of single in-line memory module (SIMM)-type contacts at first portions along an edge th... | 12/15/2009 |
| 7626831 | Circuit board retention system A retaining member for a circuit board array is provided. The retaining member includes an elongated support post having a first end and an opposite second end. A protrusion extends from the first end. The protrusion is configured to be received in a slot having sid... | 12/01/2009 |
| 7623358 | I/O cards and card arrangements for I/O device An improved I/O device, such as an audio/video router, includes at least a motherboard, such as a matrix board, including a plurality of locating slots and a plurality of connectors located on the motherboard such that when the motherboard is mounted in the I/O devi... | 11/24/2009 |
