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David Sarnoff, American radio pioneer ; 1921
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| Number | Title | Issue Date |
| 8134842 | Systems and methods for converting a computer rear transition input/output (I/O) to front panel I/O A method for converting a computer rear transition input/output (I/O) to front panel I/O is described. The method includes providing a main board having a first main connector having a first set of pins, and affixing a second main connector having a second set of pi... | 03/13/2012 |
| 8130510 | Printed circuit board assembly of electronic appliance Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electr... | 03/06/2012 |
| 8094462 | High frequency tuner module and tuner module Disclosed is a high frequency tuner module, including: a circuit component; signal lines; a GND line; and a multilayer board formed by laminating a plurality of layers, wherein the circuit component is placed on a top layer surface of the multilayer board; the signa... | 01/10/2012 |
| 8045335 | Semiconductor device A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first met... | 10/25/2011 |
| 8004855 | Reconfigurable data processing system A reconfigurable processing system is provided that comprises a plurality of programmable processing modules arranged on a circuit board. Each of the programmable processing modules is capable of being populated by a programmable integrated circuit of a variety of p... | 08/23/2011 |
| 7929315 | Multilayered printed circuit board A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a gro... | 04/19/2011 |
| 7852635 | Multi-connection via The present invention provides a PWB for attaching electrical components thereto. One aspect of the PWB includes multiple PWB insulating layers having conductive traces therebetween. The PWB has an interconnect opening located in the multiple PWB insulating layers t... | 12/14/2010 |
| 7835159 | Method of making assembly module and board module and electronic apparatus A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the sec... | 11/16/2010 |
| 7742313 | Stacked microfeature devices Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bo... | 06/22/2010 |
| 7733664 | Electronic component mounting structure An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connect... | 06/08/2010 |
| 7715206 | System board with edge connector A system comprises a chassis and a system board contained within the chassis. The system board has an edge connector adapted to receive an add-in card in a configuration in which the system board and add-in card are substantially co-planar. ... | 05/11/2010 |
| 7710740 | Assembly structure of flexible board and rigid board An assembly structure of flexible board and rigid board includes a rigid board, a sub-board and a flexible board. The rigid board defines a locking gap having two side surfaces projecting toward each other to form two resisting portions. The sub-board has a standing... | 05/04/2010 |
| 7679930 | Multilayered printed circuit board A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a gro... | 03/16/2010 |
| 7660131 | Integral SATA interface An interface couples a host device and a peripheral device. The interface includes at least one tab integrally formed and extending from a main body of a printed circuit board. The at least one tab has a plurality of contact pads. The interface also includes at leas... | 02/09/2010 |
| 7613010 | Stereoscopic electronic circuit device, and relay board and relay frame used therein A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out ... | 11/03/2009 |
| 7505284 | System for assembling electronic components of an electronic system An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the... | 03/17/2009 |
| 7492604 | Electronic module interconnection apparatus An electronic apparatus, includes a plurality of electronic modules, each having a maximum thickness of no more than 90 microns, each comprising a substrate having a two sided edge connection pattern. The electronic modules are arranged adjacent to each other. Each ... | 02/17/2009 |
| 7466560 | Multilayered printed circuit board A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a gro... | 12/16/2008 |
| 7435097 | Radial circuit board, system, and methods The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates ... | 10/14/2008 |
| 7435914 | Tape substrate, tape package and flat panel display using same A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape... | 10/14/2008 |
| 7414312 | Memory-module board layout for use with memory chips of different data widths A memory module substrate printed-circuit board (PCB) has multi-type footprints and an edge connector for mating with a memory module socket on a motherboard. Two or more kinds of dynamic-random-access memory (DRAM) chips with different data I/O widths can be solder... | 08/19/2008 |
| 7408787 | Phase change thermal interface materials including polyester resin An embodiment of a phase change TIM of this invention comprises a polyester matrix with melting temperature near or below operating temperature (typically less than about 130° C.), thermally conductive filler with bulk thermal conductivity greater than about 50 W/m... | 08/05/2008 |
| 7400512 | Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The ... | 07/15/2008 |
| 7400515 | Circuit board electrode connection structure An electrode connection structure between outer lead(s) of TCP(s), being first circuit board(s), and actuator member electrode(s) for connection to external circuitry, being second circuit board(s); actuator member(s) electrode(s) for connection to external circuitr... | 07/15/2008 |
| 7400511 | Electronic component mounting structure An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connect... | 07/15/2008 |
| 7394148 | Module having stacked chip scale semiconductor packages Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the substrate side of the top chip scale package, the second package being elect... | 07/01/2008 |
| 7394665 | LSI package provided with interface module and method of mounting the same In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals o... | 07/01/2008 |
| 7372141 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach... | 05/13/2008 |
| 7371078 | Insert attachable to an insert magazine of a tray for holding an area array type electronic component to be tested To attain an object of providing an insert for holding wide-ranging kinds of area array type electronic components and realizing certain connection between external terminals of an area array type electronic component and connection terminals of a socket, and an ele... | 05/13/2008 |
| 7368814 | Surface mount adapter apparatus and methods regarding same An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package)... | 05/06/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7362588 | Flying capacitor type battery voltage detector In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS s... | 04/22/2008 |
| 7362585 | Frame for a device mounted above a printed circuit board in an electronic device The invention provides a frame for mounting a device above a printed circuit board (PCB) in an electronic device. The frame comprises: a frame section formed to be located on the PCB about a surface device on a section of the PCB; and a cover for placement on top of... | 04/22/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7354274 | Connector assembly for interconnecting printed circuit boards An connector assembly comprises a first connector comprising a first plurality of compliant electrical contacts arranged in first a linear array, a first insertion side, and a first opposed end. The illustrative connector assembly also comprises a second connector c... | 04/08/2008 |
| 7355862 | Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer... | 04/08/2008 |
| 7350326 | Double-sided display A double-sided display is provided. The double-sided display includes two display panels comprising electroluminescene panels, organic light emitting panels, and polymer light emitting panels. The two display panels are stacked partially overlapped. A flexible print... | 04/01/2008 |
| 7352576 | Multi-processor system and tubelike computer module thereof A multi-processor system has a tubelike computer module including plural mother boards configured onto plural side walls of a rack body to form a unitary, continuous and non-segment airflow channel. The airflow channel of the tubelike computer module has larger spac... | 04/01/2008 |
| 7351072 | Memory module, memory extension memory module, memory module system, and method for manufacturing a memory module A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes ... | 04/01/2008 |
| 7347713 | Alignment system A socket alignment system comprising a receiving member disposed adjacent to a socket that is operable to receive an electronic component. A slot is disposed on the receiving member and has a longitudinal axis therethrough. An alignment member extends from an electr... | 03/25/2008 |
