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...that after Walter Hunt patented the safety pin in 1849, he sold the rights to it for $400?
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| Number | Title | Issue Date |
| 6377464 | Multiple chip module with integrated RF capabilities A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated... | 04/23/2002 |
| 6370029 | Method and system for creating and using an electrostatic discharge (ESD) protected logotype contact module with a smart card A system for providing specialized contacts for electronic information on a smart card or other device in the pattern of a source identifier, such that a machine may contact and read the information upon placement of the card in the machine. The contact p... | 04/09/2002 |
| 6362525 | Circuit structure including a passive element formed within a grid array substrate and method for making the same A circuit structure combines an integrated circuit with a passive circuit element formed within a grid-array substrate. Formation of the circuit structure includes forming a passive circuit element within one or more conductive layers of a grid-array subs... | 03/26/2002 |
| 6359235 | Electrical device mounting wiring board and method of producing the same An electronic device mounting wiring board having an electronic device mounted on the surface of a wiring substrate or inside thereof is provided. The wiring substrate includes an insulation substrate made by laminating a plurality of insulation layers th... | 03/19/2002 |
| 6351391 | Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices A printed circuit board structure is provided where there is a circuitized dielectric substrate having a plurality of signal traces thereon. The circuitized substrate has first and second opposite faces. An ASIC chip assembly is mounted on the first face ... | 02/26/2002 |
| 6351030 | Electronic package utilizing protective coating The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also o... | 02/26/2002 |
| 6351390 | Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly A process is given for permitting the application to a substrate (2) of a microsystem or transducer (1) having a first partial surface (13), whose interaction with the environment is to be possible, and a second partial surface (14), which is to be protec... | 02/26/2002 |
| 6344688 | Very thin multi-chip package and method of mass producing the same A substrate assembly and method of forming the substrate assembly having a very thin form factor and a large amount of manufacturing flexibility. A flexible tape has a number of device blocks. Devices, passive or active, are joined to the device blocks fo... | 02/05/2002 |
| 6344974 | Printed circuit board and method of producing same A printed circuit board has a product board region where electronic components are mounted. The printed circuit board further has a positioning region where an element contour representing a certain mechanism element, an insulated substrate or the like is... | 02/05/2002 |
| 6344973 | Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB... | 02/05/2002 |
| 6344684 | Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint A multi-layered pin grid array interposer used in a test socket for testing and converting a package having a non-pin grid array footprint to a pin grid array footprint. The multi-layered pin grid array interposer test socket includes a multi-layered pin ... | 02/05/2002 |
| 6343001 | Multilayer capacitance structure and circuit board containing the same A method of forming a capacitive core structure and of forming a circuitized printed wiring board from the core structure and the resulting structures are provided. The capacitive core structure is formed by providing a central conducting plane of a sheet... | 01/29/2002 |
| 6343019 | Apparatus and method of stacking die on a substrate An apparatus and method wherein an outer die is mounted on an inner die to form a stack which is mounted on a first surface of a substrate, such as a circuit board, the stack may be mounted filly or partially recessed in a recess which is formed in a firs... | 01/29/2002 |
| 6341070 | Wafer-scale packing processes for manufacturing integrated circuit (IC) packages This invention discloses a wafer level packaging method and configuration. This improved wafer level package includes a processed wafer mounted on a first printed circuit board (PCB) carrier. The processed wafer mounted on the PCB carrier board includes a... | 01/22/2002 |
| 6333856 | Arrangement for mounting chips in multilayer printed circuit boards The present invention relates to an arrangement concerned with multilayer printed circuit boards that enables cavities in said board to be utilized more effectively. A substrate (14) that includes a chip (16) which is connected to the microstrips (17) of ... | 12/25/2001 |
| 6324754 | Method for fabricating microelectronic assemblies Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solde... | 12/04/2001 |
| 6324068 | Electronic component device, and main board for circuit boards The contours of openings of a solder resist defining exposed portions of electrode pads and the contours of openings of the solder resist defining the contours of register or patterns are simultaneously formed by photolithography using the same mask patte... | 11/27/2001 |
| 6324067 | Printed wiring board and assembly of the same A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed in one part of a PWB and components are received in this re... | 11/27/2001 |
| 6320758 | Integrated circuit mounting board with bypass capacitors An integrated circuit (IC) mounting board is provided for use to mount an IC module and as least one bypass capacitor thereon. The IC mounting board allows the layout of the wiring between the IC module and the circuit lines on the IC mounting board to be... | 11/20/2001 |
| 6320751 | Sheet-framed IC carrier and method for producing the same A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the r... | 11/20/2001 |
| 6310781 | Connection pin layout for connecting integrated magnetics modules to a printed circuit board A connection pin layout for connecting one or more integrated magnetics modules (IMMs) to a printed circuit board (PCB) for reduced electromagnetic interference (EMI) includes grouping and locating the connection pins based on the signals passed through t... | 10/30/2001 |
| 6307755 | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die A leadframe for making an electric connection to a semiconductor die contains a plurality of notches which correspond to the edges of the die. Shorts are thereby prevented between the leadframe and electrical elements near the edge of the die, even when t... | 10/23/2001 |
| 6301119 | Integrated circuit card with two connection modes An integrated circuit card with two connection modes. The integrated circuit card includes a card body in which there is embedded a link circuit for linking a contactless coupling element (1) to a module having an integrated circuit (6) connected to condu... | 10/09/2001 |
| 6297551 | Integrated circuit packages with improved EMI characteristics The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization. The normally exposed top and side surfaces of the MCM package are also... | 10/02/2001 |
| 6295209 | Semiconductor device including combed bond pad opening, assemblies and methods A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable... | 09/25/2001 |
| 6292366 | Printed circuit board with embedded integrated circuit A printed circuit board that includes first and second outer layers and a rigid core block that is positioned between those layers. An integrated circuit is positioned within the rigid core block and a heat pipe is formed within the rigid core block. The ... | 09/18/2001 |
| 6292372 | Solder thieving pad for wave soldered through-hole components An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit board for different wave settings. The component leads are... | 09/18/2001 |
| 6292374 | Assembly having a back plate with inserts An assembly that has an insert that fits onto a back plate. The back plate receives a circuit board that covers at least a portion of the insert. A components attaches to the circuit board and to the insert. The insert is made out of a material having a t... | 09/18/2001 |
| 6283435 | Structure of a CPU securing seat An improved structure of a CPU securing seat comprising a seat body, a covering body and a controlling device, characterized in that the seat body is provided with a plurality of triangular holes, and each of the triangular holes is provided with an inver... | 09/04/2001 |
| 6266251 | Cavity-down ball grid array module A Plastic Ball Grid Array electronic package of the Cavity Down type particularly for use in high-frequency applications. In these packages the substrate has a cavity for receiving an active device (chip), which is usually attached to the substrate by mea... | 07/24/2001 |
| 6256875 | Method for manufacturing semiconductor device The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on... | 07/10/2001 |
| 6249439 | Millimeter wave multilayer assembly A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and h... | 06/19/2001 |
| 6248951 | Dielectric decal for a substrate of an integrated circuit package An integrated circuit package which may include a decal that is attached to a substrate which supports an integrated circuit. The decal may have a coefficient of thermal expansion that is different than a coefficient of thermal expansion of the substrate.... | 06/19/2001 |
| 6246301 | High-frequency circuit apparatus A high-frequency circuit apparatus includes two high-frequency circuits (2, 3) mounted on a printed circuit board (1), two rows of first plated through holes (6) which connect upper and lower ground plates (4, 5) on the upper and lower surfaces of the pri... | 06/12/2001 |
| 6222737 | Universal package and method of forming the same A chip module comprising a chip array which includes an interconnect substrate having opposed, generally planar surfaces and a first interconnect pad array disposed on at least one of the surfaces thereof. Attached to the interconnect substrate is at leas... | 04/24/2001 |
| 6219912 | Method for manufacture electronic component device The shapes of openings of a solder resist defining exposed portions of electrode pads and the shapes of openings of the solder resist defining the shapes of positioning signs are simultaneously formed by photolithography using the same mask pattern. As a ... | 04/24/2001 |
| 6208526 | Mounting multiple substrate frame and leadless surface mountable assembly using same A multiple substrate mounting frame (104) includes first (132) and second (130) surfaces and a plurality of windows or cavities (106-112). A set of substrates having electrical circuitry (114-120) are attached and electrically connected to the first surfa... | 03/27/2001 |
| 6201185 | Substrate for mounting electronic part having conductive projections and process for manufacturing the same A plurality of side-surface patterns 11 and 12 are disposed on the wall surfaces of a mount opening portion 2 for mounting electronic parts thereat. The mount opening portion includes projection portions 21 that project toward an interior thereof from the... | 03/13/2001 |
| 6188595 | Memory architecture and addressing for optimized density in integrated circuit package or on circuit board An electrically erasable and programmable read only memory (EEPROM) or other memory integrated circuit (IC) includes memory cells arranged in N blocks. The number of blocks, N, is selected to maximize utilization of the space available in a standard IC pa... | 02/13/2001 |
| 6185105 | Discharge structure of printed circuit board In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit patterns; and a resist layer covering a copper foil portion forme... | 02/06/2001 |
