Bizarre Patents
Vehicular Impact Signaling Device
An apparatus for the deployment of a visible plume to alert other motorists that a proximate motor vehicle has been involved in a collision.
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| Number | Title | Issue Date |
| 4144555 | Single mount electrical control device assembly A combination of a potentiometer and an integrated circuit module are mounted on a printed circuit board which interconnects these members and provides for external connections. Mechanical mounting of the printed circuit board, the potentiometer, and the ... | 03/13/1979 |
| 4120022 | Plastic modular casing for an electronic watch The present invention is a module frame for use in a modular electronic assembly which includes a light emitting read out source and which also includes a substrate on which an integrated circuit chip is mounted and which is electrically coupled to a pair... | 10/10/1978 |
| 4100589 | Microcircuit device including hybrid circuit carrier A microcircuit device including a housing and at least one substrate. A carrier is provided having a surface for receiving the substrate. Fastening means, for example, screws are utilized to removably retain the carrier in a housing. Mounting means for th... | 07/11/1978 |
| 4054938 | Combined semiconductor device and printed circuit board assembly A method for combining a semiconductor device with a printed circuit board or substrate which eliminates the need for conventional semiconductor packaging and connectors for same on the board and thereby makes possible a relatively small and thin assembly... | 10/18/1977 |
| 3984620 | Integrated circuit chip test and assembly package A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers o... | 10/05/1976 |
| 3984739 | Structure for packaging integrated circuits An integrated circuit package structure wherein electrodes of an integrated circiut chip are directly bonded to metal lead members within the package. A portion of the substrate is enclosed inside the package to support the package. Holes are provided on ... | 10/05/1976 |
