Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 8339797 | Package substrate A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is... | 12/25/2012 |
| 8339798 | Printed circuit boards with embedded components Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be m... | 12/25/2012 |
| 8264849 | Mold compounds in improved embedded-die coreless substrates, and processes of forming same An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one... | 09/11/2012 |
| 8203847 | Folding USB drive Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper... | 06/19/2012 |
| 8164917 | Base plate for use in a multi-chip module A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top ... | 04/24/2012 |
| 8159830 | Surface mounting chip carrier module A device includes a carrier and an integrated circuit chip having a first side supported by the carrier and a second side having contacts. The carrier has multiple carrier contacts supported by the carrier and separated from the integrated circuit chip. Multiple lea... | 04/17/2012 |
| 8125788 | Circuit module and radio communications equipment, and method for manufacturing circuit module An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board 2, and are covered with an insulating resi... | 02/28/2012 |
| 8102665 | Integrated circuit with intra-chip clock interface and methods for use therewith An integrated circuit includes a substrate. A first integrated circuit die includes a first circuit and a first intra-chip clock interface that transmits a first clock signal via the substrate. A second integrated circuit die includes a second circuit that operates ... | 01/24/2012 |
| 8050046 | Electrostatic discharge protection structure An electrostatic discharge (ESD) protection structure with a ground ring and a plurality of pads are provided, wherein the ground ring has a ring inner area used for disposing an integrated circuit (IC) and the pads are disposed around the outer periphery of the gro... | 11/01/2011 |
| 8023279 | FLMP buck converter with a molded capacitor and a method of the same An encapsulated buck converter module includes a low side transistor and a control integrated circuit bonded to a first section on a first side of a leadframe, a first clip between a source of the low side transistor and a second section, a source contact of a high ... | 09/20/2011 |
| 7796399 | Thin multi-chip flex module A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The subst... | 09/14/2010 |
| 7755909 | Slim design main board A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circ... | 07/13/2010 |
| 7746659 | Electro-optical device and electronic apparatus The invention provides a heat dissipater such as a heat dissipation member that dissipates heat of an integrated circuit that is formed on a flexible substrate such as a flexible printed circuit board. The heat dissipater according to an aspect of the invention incl... | 06/29/2010 |
| 7715205 | Self-excited inverter circuit A self-excited inverter circuit, includes: a booster transformer with a secondary coil, a feedback coil, and a primary coil respectively wound thereon, the primary coil including a center tap to which operating power can be supplied; a first N-channel FET having a d... | 05/11/2010 |
| 7652893 | Single or dual electronic package with footprint and pin sharing A 6-pin electronic package includes a first side including a pair of first outer pins and a first middle pin, and a second side including a pair of second outer pins and a second middle pin. The first outer pins and the second middle pin are operatively coupled to a... | 01/26/2010 |
| 7623354 | Folding USB drive Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper... | 11/24/2009 |
| 7545651 | Memory module with a predetermined arrangement of pins A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support substrate, the pins comprising signal pins connected to the memory device... | 06/09/2009 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7440289 | Memory module A memory module includes a memory chip MC1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC3 disposed at a position not opposite to the memory buffer via the module substrate, and a memory chip MC11 dis... | 10/21/2008 |
| 7440290 | Control systems The present invention provides systems, devices and methods for controlling a desired output of an output device. These systems, devices and methods include connecting an electrical resistance element having a selected one of a plurality of resistance values with an... | 10/21/2008 |
| 7436679 | Radio-frequency module for communication A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto ... | 10/14/2008 |
| 7433202 | Electronic device and method of manufacturing thereof The electronic device comprises a body (40) of electrically insulating material that is provided with a through-hole or cavity. In the cavity or through-hole an electric component (20) is present. This component is attached to the body through an attac... | 10/07/2008 |
| 7432816 | Printed circuit board with RFID antenna A printed circuit board (PCB) includes an antenna for an RFID chip. An RFID chip for a tag is operable to be placed on the PCB such that the RFID chip is connected to the antenna and is operable to use the antenna to transmit data. ... | 10/07/2008 |
| 7429786 | Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the first package with the fi... | 09/30/2008 |
| 7430127 | Electronic circuit board An electronic circuit board having an optical wiring layer sandwiched between two electrical wiring layers. The optical wiring layer is structured to be a two-dimensional optical waveguide. An E/O device and an O/E device are provided in the optical wiring layer or ... | 09/30/2008 |
| 7417870 | Multi-layer board with decoupling function A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals conne... | 08/26/2008 |
| 7394665 | LSI package provided with interface module and method of mounting the same In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals o... | 07/01/2008 |
| 7390973 | Memory module and signal line arrangement method thereof The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both ... | 06/24/2008 |
| 7388756 | Method and system for angled RF connection using a flexible substrate A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a b... | 06/17/2008 |
| 7382628 | Circuit-component-containing module A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove... | 06/03/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7373528 | Increased power for power over Ethernet applications According to one embodiment of the invention, a method for supplying power over Ethernet includes determining whether a first port of power sourcing equipment is supplying current to a power over Ethernet device in a predetermined current range. The method also incl... | 05/13/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7365442 | Encapsulation of thin-film electronic devices One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an ... | 04/29/2008 |
| 7366297 | Method and system for converting alternating current to ethernet in-line power According to one embodiment, a method for converting alternating current voltage signals to Ethernet in-line power includes converting an alternating current voltage signal to an approximate direct current voltage signal, adding at least one odd harmonic of the appr... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361844 | Power converter package and thermal management Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface and a bottom surface of the circuit board. The lower portion encloses a... | 04/22/2008 |
| 7355428 | Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing A temperature control system, which includes a miniature liquid-cooled heat sink, is used to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing or burn-in phase. In one embodiment, the system includes... | 04/08/2008 |
| 7352588 | Semiconductor device and a method for manufacturing the same A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wir... | 04/01/2008 |
