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| Number | Title | Issue Date |
| 6420658 | Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder A module circuit board for a semiconductor device by a solder reflow process includes a plurality of pads on which the semiconductor device to be mounted, a plurality of terminals formed on a side edge of the board, a resist film covering an area between ... | 07/16/2002 |
| 6420207 | Semiconductor package and enhanced FBG manufacturing A high density, non-bussed semiconductor package and a full body gold (FBG) method for manufacturing semiconductor packages are provided to improve electrical and mechanical connections with semiconductors and other electronic components and devices. The ... | 07/16/2002 |
| 6418031 | Method and means for decoupling a printed circuit board An improved method and means for decoupling a printed circuit board are disclosed. A power plane is included having a peripheral edge. The power plane includes a first region and a second region which is separate from and contiguous to the first region. T... | 07/09/2002 |
| 6407927 | Method and structure to increase reliability of input/output connections in electrical devices A method and connecting structure includes a first surface and a connection pad on said first surface, wherein, said first surface includes an opening adjacent to said connection pad, and wherein, upon sufficient stress, said opening forms a flap allowing... | 06/18/2002 |
| 6400569 | Heat dissipation in lead frames A lead frame apparatus that includes: an arrangement for dissipating heat generated at the lead frame, wherein the heat dissipating arrangement is uninterruptedly connected to the lead frame. Also contemplated herein are a lead frame heat dissipating appa... | 06/04/2002 |
| 6395374 | Method of making microwave, multifunction modules using fluoropolymer composite substrates A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. T... | 05/28/2002 |
| 6396140 | Single reference plane plastic ball grid array package A semiconductor package is disclosed. According to one embodiment, the package comprises a substrate having a top surface with traces thereon and a bottom surface with solder balls thereon, the substrate comprising at least three material layers defining ... | 05/28/2002 |
| 6377464 | Multiple chip module with integrated RF capabilities A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated... | 04/23/2002 |
| 6373719 | Over-voltage protection for electronic circuits Over voltage protection is provided for electronic circuits by disposing one or more ground bars for diverting harmful currents away from the sensitive electronic circuit elements. The ground bars are each associated with a row of contact portions of the ... | 04/16/2002 |
| 6370030 | Device and method in electronics systems The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area (10) of the printed board (11). A separate component (1) for signal transmission compris... | 04/09/2002 |
| 6362973 | Multilayer printed circuit board with placebo vias for controlling interconnect skew A multi-layer printed circuit board that includes a first layer and a second layer that have first and second signal traces, respectively. The multi-layer printed circuit board includes a via that couples a signal transmitting component to the second sign... | 03/26/2002 |
| 6359235 | Electrical device mounting wiring board and method of producing the same An electronic device mounting wiring board having an electronic device mounted on the surface of a wiring substrate or inside thereof is provided. The wiring substrate includes an insulation substrate made by laminating a plurality of insulation layers th... | 03/19/2002 |
| 6359234 | Package substrate for mounting semiconductor chip with low impedance and semiconductor device having the same A package substrate in which a semiconductor chip is placed is disclosed. A through hole land (opposed conductor) connected to a signal wiring is opposite to a fixed electrical potential conductor through an insulator layer. The through hole land is dispo... | 03/19/2002 |
| 6344974 | Printed circuit board and method of producing same A printed circuit board has a product board region where electronic components are mounted. The printed circuit board further has a positioning region where an element contour representing a certain mechanism element, an insulated substrate or the like is... | 02/05/2002 |
| 6324067 | Printed wiring board and assembly of the same A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed in one part of a PWB and components are received in this re... | 11/27/2001 |
| 6323435 | Low-impedance high-density deposited-on-laminate structures having reduced stress Low-impedance high density deposited-on-laminate (DONL) structures having reduced stress features reducing metallization present on the laminate printed circuit board. In this manner, reduced is the force per unit area exerted on the dielectric material d... | 11/27/2001 |
| 6301122 | Radio frequency module with thermally and electrically coupled metal film on insulating substrate The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a ... | 10/09/2001 |
| 6300576 | Printed-circuit board having projection electrodes and method for producing the same A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a corresponding one of the via hole conductors and has high str... | 10/09/2001 |
| 6297598 | Single-side mounted light emitting diode module A light emitting diode module is mounted perpendicular to a motherboard, so that the lights emit in a direction parallel to the motherboard. The bottom contacts of the module are lined up on only one side of the module. The contacts are soldered to the mo... | 10/02/2001 |
| 6295209 | Semiconductor device including combed bond pad opening, assemblies and methods A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable... | 09/25/2001 |
| 6280851 | Multilayer product for printed circuit boards Copper foil used in printed circuit boards is protected from contamination both prior to laying up the circuit board components and during processing by a multilayer protective film structure having a silicone adhesive disposed on one entire surface and a... | 08/28/2001 |
| 6278185 | Semi-additive process (SAP) architecture for organic leadless grid array packages A substrate which has a first conductive layer that is attached to a first dielectric layer. A second conductive layer is attached to the first dielectric layer. The second conductive layer may be a plated copper material that extends through a via openin... | 08/21/2001 |
| 6274821 | Shock-resistive printed circuit board and electronic device including the same A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf.multidot.cm/cm or more at 25... | 08/14/2001 |
| 6262376 | Chip carrier substrate A chip carrier substrate including a lower layer and at least one upper layer of copper conductors on a base, a plurality of aluminum studs formed by anodization to be of substantially identical height which interconnect the layers of conductors, a layer ... | 07/17/2001 |
| 6259268 | Voltage stress testable embedded dual capacitor structure and process for its testing A voltage stress testable embedded dual capacitor structure for use in an integrated circuit (IC). The voltage stress testable embedded dual capacitor structure includes a semiconductor substrate with an electrically insulating base layer thereon, a first... | 07/10/2001 |
| 6252778 | Complex electronic component The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comp... | 06/26/2001 |
| 6249439 | Millimeter wave multilayer assembly A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and h... | 06/19/2001 |
| 6225570 | Circuit board having electric component and its manufacturing method This invention provides a circuit board having an electric component which has an electric element smaller than a conventional element. A circuit pattern (5) which includes a pair of contact electrodes (3, 3) is formed on the surface of a board (1) made o... | 05/01/2001 |
| 6219253 | Molded electronic package, method of preparation using build up technology and method of shielding An improved way of preparing packaged electronic circuitry using molded plastics, Thick Film, and Build Up Technology, and achieving shielding of the circuitry and components of the package. In this invention at least one of the electronic devices in the ... | 04/17/2001 |
| 6197614 | Quick turn around fabrication process for packaging substrates and high density cards A new method is provided for packaging high-density IC semiconductor devices. A metal substrate is provided, a layer of dielectric is deposited over the first surface of the metal panel. One or more interconnect layers are then created on top of the diele... | 03/06/2001 |
| 6195264 | Laminate substrate having joining layer of photoimageable material A cavity-type chip module. The module is formed with an adhesive joining layer of photoimageable material interposed between a metal stiffener and a laminate top layer with a central aperture defined in the top layer. The photoimageable material is expose... | 02/27/2001 |
| 6191489 | Micromechanical layer stack arrangement particularly for flip chip or similar connections A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess... | 02/20/2001 |
| 6184577 | Electronic component parts device In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive fi... | 02/06/2001 |
| 6185107 | MEMS based tile assemblies and methods of fabrication Structures and methods that provide for the vertical alignment of and electrical interconnection of MEMS tiles using metallized elastic spheres and precision pyramid shaped pits etched on the surface of silicon substrates. The methods of producing large a... | 02/06/2001 |
| 6160714 | Molded electronic package and method of preparation An improved way of preparing packaged electronic circuitry using molded plastics, ceramic Thick Film technology, and Polymer Thick Film technology. In this invention at least one of the electronic devices in the package is supported in a plastic molded su... | 12/12/2000 |
| 6147876 | Multi-chip module having printed wiring board comprising circuit pattern for IC chip Bare IC chips (201 through 203) are mounted on respective areas (101 through 103) of a printed wiring board (100). The outer electrode pads (105) on the peripheries of the board (100) are soldered to another printed wiring board (1) such as a mother board... | 11/14/2000 |
| 6147860 | External storage device An external storage device includes an external storage device main includes a thin type external storage device module formed into a package sealed on one side from a storage element containing at least one non-volatile semiconductor memory device, and a... | 11/14/2000 |
| 6137690 | Electronic assembly An electronic assembly (10) comprises one or more electronic components (18) having solder terminations (20), and a printed circuit substrate (12) having printed circuit traces (14, 16), wherein at least one of the solder terminations of the one or more e... | 10/24/2000 |
| 6127728 | Single reference plane plastic ball grid array package A semiconductor package is disclosed. According to one embodiment, the package comprises a substrate having a top surface with traces thereon and a bottom surface with solder balls thereon, the substrate comprising at least three material layers defining ... | 10/03/2000 |
| 6127038 | Printed circuit board coating and method A conformal coating and method for applying same to a printed electrical circuit board, components and leads for providing corrosion resistance. In a preferred embodiment, the conformal coating comprises a first coating layer of parylene which is vacuum d... | 10/03/2000 |
