Did You Know...
...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 6972963 | Electronic apparatus having structure for protecting flexible printed circuit and chip thereon An electronic apparatus having a structure for protecting a flexible printed circuit (FPC) and a chip thereon is described, including a metal backplate, a first circuit and a second circuit respectively on the front side and the back side of the backplate, a metal f... | 12/06/2005 |
| 6972699 | Foldable keyboard A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect... | 12/06/2005 |
| 6969806 | Cable and method A cable includes a first portion, a second portion, and a first fold between the first portion and the second portion. The cable further includes a first shim bonded between the first portion and the second portion. A method for making a cable includes adhesively bo... | 11/29/2005 |
| 6969906 | Multi-chip package and method for manufacturing the same Disclosed are a multi-chip package and a method for manufacturing the multi-chip package. The multi-chip package comprises: a circuit substrate consisting of first, second and third areas which surround three sides of the multi-chip package; and at least two semicon... | 11/29/2005 |
| 6967290 | Circuit board A circuit board permits common use of the same circuit board without separately manufacturing the circuit board per providing destinations when similar circuit boards are manufactured for a plurality of providing destinations in the same factory. The circuit board h... | 11/22/2005 |
| 6962833 | Magnetic shield for integrated circuit packaging Structures and methods for providing magnetic shielding for integrated circuits are disclosed. The shielding comprises a foil or sheet of magnetically permeable material applied to an outer surface of a molded (e.g., epoxy) integrated circuit package. The foil can b... | 11/08/2005 |
| 6961995 | Method of making an electronic package An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of diele... | 11/08/2005 |
| 6962829 | Method of making near chip size integrated circuit package A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a s... | 11/08/2005 |
| 6958531 | Multi-substrate package and method for assembling same A multi-substrate, microsystem package and a method for assembling same including a high-density flexible connector array are disclosed for use in compact and multi-substrate packages containing circuits, sensors, and actuators in a re-workable and modular approach.... | 10/25/2005 |
| 6956288 | Semiconductor device with folded film substrate and display device using the same A semiconductor device to be mounted on an external electronic device includes a film substrate on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and a semiconductor chip mounted on the film substrate. In th... | 10/18/2005 |
| 6956995 | Optical communication arrangement An arrangement for optical communication comprises an optical coupler, an opto-electronic board, and an optical fiber. The optical fiber comprises a first refraction surface, a second refraction surface, and an internal reflector. The first refraction surface has a ... | 10/18/2005 |
| 6956878 | Method and apparatus for reducing laser speckle using polarization averaging A method and apparatus for reducing speckle uses polarization averaging. A polarizing beam splitter divides a first polarized laser output into a second polarized laser output and a third polarized laser output. A plurality of mirrors creates an optical path differe... | 10/18/2005 |
| 6956284 | Integrated circuit stacking system and method The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules... | 10/18/2005 |
| 6953991 | Semiconductor device A semiconductor device comprising a laminate of plural insulating substrates 101 to 104 on which are mounted semiconductor chips (electronic parts) 12, wherein, when the lower-most insulating substrate is regarded to be a f... | 10/11/2005 |
| 6952352 | Integrated circuit chip package with formable intermediate 3D wiring structure A formable wiring structure, an interposer with the formable wiring structure, a multichip module including the interposer and in particular a microprocessor and L2, L3 cache memory mounted on the interposer. The formable wiring structure includes wiring layers sepa... | 10/04/2005 |
| 6950312 | Electronic units and method for packaging and assembly of said electronic units The present invention discloses method for packaging and assembly of electronic units comprising a multi-planar board system in which each single planar board provides electrical contacts and/or signal drive to its successive planar board via a flexible cable formin... | 09/27/2005 |
| 6946329 | Methods of making and using a floating interposer A flexible, compliant layer of a single low modulus material for connecting a chip die directly to a circuit card without encapsulation. The flexible compliant layer provides stress relief caused by CTE thermal mismatch in chip die and circuit card. An array of copp... | 09/20/2005 |
| 6947613 | Wavelength selective switch and equalizer A device comprising a light modulator including a plurality of elements wherein each element is selectively operable such that the plurality of elements are dynamically configurable to combine selected ones of a plurality of grating periods such that selected portio... | 09/20/2005 |
| 6944936 | Method for manufacturing an integrated lead suspension A method for manufacturing an integrated lead suspension or component having an integrated circuit (IC) with an array of terminals. The suspension or component is formed from a laminated sheet of material including a spring metal layer and a conductive material laye... | 09/20/2005 |
| 6943302 | Flexible printed circuit board A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible pr... | 09/13/2005 |
| 6943292 | Printed circuit board stiffener A printed circuit board (PCB) assembly includes a stiffener member that eliminates the need for a separate PCB housing. The stiffener member is attached to the PCB at a first mount interface without the use of fasteners and is attached to a vehicle structure at a se... | 09/13/2005 |
| 6939737 | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to... | 09/06/2005 |
| 6940729 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 09/06/2005 |
| 6936495 | Method of making an optoelectronic semiconductor package device A method of making an optoelectronic semiconductor package device includes attaching a conductive trace to a semiconductor chip using a transparent adhesive, wherein the chip includes an upper surface and a lower surface, and the upper surface includes a light sensi... | 08/30/2005 |
| 6932518 | Circuit board having traces with distinct transmission impedances The present invention is an optoelectronic device including a circuit board with a plurality of signal traces, a first ground plane, and a second ground plane. The impedance of a signal trace is determined by which of the first ground plane and the second ground pla... | 08/23/2005 |
| 6934160 | Printed circuit board arrangement A printed circuit board arrangement with a flexible layer arrangement of at least one electrically conductive layer with a large number of conductor tracks lying next to one another and surrounded by electrically isolating layers has at least one printed circuit boa... | 08/23/2005 |
| 6934070 | Chirped optical MEM device A light modulator comprises a series of ribbons divided by a series of gaps. Sequences of consecutive ribbons and gaps are grouped together to form a plurality of pixels that are configured to process a respective plurality of wavelengths. The spacing from center-li... | 08/23/2005 |
| 6930888 | Mechanism to cross high-speed differential pairs According to one embodiment, a printed circuit board (PCB) is disclosed. The PCB includes a first functional unit block (FUB) and differential traces coupled to the first FUB. The first FUB transmits high-speed serial data. The differential traces carry the high-spe... | 08/16/2005 |
| 6926546 | Foldable electronic device formed by pivotally connecting two casings through hinge A plurality of wound portions are formed on a wiring cable to be arranged in a two-axis hinge that connects two casings. Winding directions of the wound portions which are adjacent are set opposite to each other. In a foldable electronic device in which two casings ... | 08/09/2005 |
| 6927497 | Multi-die semiconductor package A semiconducting package includes a first capsule, a second capsule and an adhesive within a recess in a surface of the first capsule that secures the first capsule to the second capsule. ... | 08/09/2005 |
| 6927891 | Tilt-able grating plane for improved crosstalk in 1×N blaze switches A light modulator includes elongated elements arranged parallel to each other. Each elongated element includes a light reflective planar surface with the light reflective planar surfaces configured in a first grating plane. A support structure is coupled to the elon... | 08/09/2005 |
| 6928207 | Apparatus for selectively blocking WDM channels An apparatus for selective blocking WDM channels comprises a light modulator, a diffraction grating, and a transform lens. The light modulator comprises an array of pixels. Each pixel of the light modulator is selectively operable to direct light into a first mode a... | 08/09/2005 |
| 6924439 | Signal conducting applique and method for use with printed circuit board The invention herein pertains to improved methods and apparatus for electrically coupling components within a digital data system without the use of ribbon cables and other wires. The disclosed coupling device comprises a body member and at least one finger member. ... | 08/02/2005 |
| 6922272 | Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices A MEMS device such as a grating light valve™ light modulator is athermalized such that the force required to deflect the movable portion of the MEMS device remains constant over a range of temperatures. In MEMS embodiments directed to a grating light valve™ ligh... | 07/26/2005 |
| 6921550 | Etch resist using printer technology The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate ... | 07/26/2005 |
| 6918179 | Method of deforming flexible cable sections extending between rigid printed circuit boards A method for preforming of two or more flexible cables in an arrangement consisting of a combination of rigid printed circuit boards and flexible cable sections extending therebetween. Moreover, also provided is an apparatus for the preforming of two or more flexibl... | 07/19/2005 |
| 6919507 | Electrical assembly and method for manufacturing the electrical assembly An electrical assembly including an electrical circuit situated in a housing, and a method for the manufacture of such an assembly, in which the electrical circuit is covered at least partially with a protective layer, wherein the protective layer has first and seco... | 07/19/2005 |
| 6919626 | High density integrated circuit module The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external po... | 07/19/2005 |
| 6915567 | Method of wiring for motorcycles An housing of a meter unit is inserted from above into a meter unit support hole which is provided in the rear handle cover. Engagement claws of the housing are engaged with claw receiving portions of the rear handle cover, thereby prevent the housing from coming ou... | 07/12/2005 |
| 6914324 | Memory expansion and chip scale stacking system and method The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with th... | 07/05/2005 |
