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| Number | Title | Issue Date |
| 6744638 | Construction and method for interconnecting flexible printed circuit and wiring board, liquid crystal display device, and method for manufacturing the same A wiring board is arranged on the back side of a tape carrier package (TCP), the upper edge of a notch in the leftmost TCP and an outer edge of a branch of the leftmost terminal of the leftmost output terminal portion of the wiring board are arranged on the same pla... | 06/01/2004 |
| 6740824 | Ground connector assembly with substrate strain relief and method of making same A ground connector assembly (20) having a substrate (22) and a ground member (24). The substrate (22) is used to retain an electrical circuit and has a ground region (34), a ground hole (30), and at least one strain relief s... | 05/25/2004 |
| 6731509 | Method for mounting electronic circuit chip In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is gr... | 05/04/2004 |
| 6730855 | Electronic element An wiring board is provided so as to wrap a semiconductor chip, and on the outer surface of wiring board, a plurality of external terminals are provided three-dimensionally, i.e., on the upper, lateral and bottom sides. External terminals are connected to an electro... | 05/04/2004 |
| 6711022 | Nested plug-in modules A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested confi... | 03/23/2004 |
| 6706971 | Stackable microcircuit layer formed from a plastic encapsulated microcircuit A stackable microcircuit layer formed from a plastic encapsulated microcircuit (PEM) and method of making the same is disclosed. The method involves the steps of starting with a commercially available PEM (e.g. a plastic Thin Small Outline Package or TSOP) that cont... | 03/16/2004 |
| 6705671 | Electronically integrated vehicle support structure An integrated vehicle structure combines the mechanical and electrical systems of the vehicle. The integrated vehicle structure generally comprises a vehicle support structure, a flatwire extending along the vehicle support structure, and an electronic site incorpor... | 03/16/2004 |
| 6690581 | Connection structure of flexible board arranged in camera The connection structure of flexible boards permits efficient positioning and connecting of a plurality of flexible boards arranged one over the other in a camera by providing a pair of pin elements in a protruding condition in a base portion and forming ... | 02/10/2004 |
| 6683377 | Multi-stacked memory package A multiple chip package and method of making the package allow multiple same size or different size chips to be stacked over each other, thereby creating a thin profile multi-chip package. Chips are attached to one surface of a continuous flexible substra... | 01/27/2004 |
| 6678167 | High performance multi-chip IC package The specification describes a multi-chip IC package in which IC chips are flip-chip bonded to both sides of a flexible substrate. The upper (or lower) surface of the flexible substrate is bonded to a rigid support substrate with openings in the support su... | 01/13/2004 |
| 6669273 | Vehicle instrument panel structure to support electronics packaging An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes, in one embodiment, a cross-car beam structure for supporting the assembly. The structure extends across a substantial portion of the cockpit and defines a plu... | 12/30/2003 |
| 6665191 | Multi-folded printed wiring construction for an implantable medical device A printed circuit assembly for use in an implantable medical device comprises a plurality of panels having active and passive circuit components on one major surface thereof, the plurality of panels being interconnected with flexible flat cable segments a... | 12/16/2003 |
| 6664942 | Signal transmission film and a liquid crystal display panel having the same A liquid crystal display has a signal transmission film and a single integrated PCB for processing a gate driving signal and data driving signal. The signal transmission film includes a base substrate, a gate driver IC formed on said base substrate, an in... | 12/16/2003 |
| 6654250 | Low-stress compressive heatsink structure A structure and technique for forming an I/C chip module and circuit card construction is provided. An I/C chip module having a flexible substrate, with first and second opposite sides concave, results from the CTE mismatch between the I/C chip and substr... | 11/25/2003 |
| 6633487 | Method for manufacturing hybrid circuit board A required interlayer circuit board 1 is constituted so as to provide a punched portion in which only a collapsible cable portion 2 for connecting a plurality of component mounting portions to each other is exposed. An external layer board 6 is superimpos... | 10/14/2003 |
| 6617671 | High density stackable and flexible substrate-based semiconductor device modules A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be a... | 09/09/2003 |
| 6617525 | Molded stiffener for flexible circuit molding A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A molded stiffener is formed on a flexible tape at the same time ... | 09/09/2003 |
| 6617518 | Enhanced flex cable A flex cable has a number of conductive wirings for electrically coupling electrical leads of an electrical component to a wiring board. The flex cable has a conductive tab for electrically coupling one of the conductive wirings to one of the leads. The f... | 09/09/2003 |
| 6614658 | Flexible cable stiffener for an optical transceiver An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The surface of the stiffener includes one or more cavities conf... | 09/02/2003 |
| 6614380 | Reverse dome switch A key fob for signaling a receiver includes a housing having at least one depressable dome for initiating transmission of a signal. A circuit board disposed within the housing is printed onto the circuit board for generating the signal. The circuit board ... | 09/02/2003 |
| 6611065 | Connection material The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating fill... | 08/26/2003 |
| 6604948 | Double-double (2×2) tester paddle board AKA 2×2 paddle board A connector board which interfaces a disk drive head assembly to a test apparatus. The connector board is capable of being separated into segments which facilitate head assembly testing without changing connector boards, wherein test connections may be es... | 08/12/2003 |
| 6603710 | Method for making a display module including a liquid crystal and a single-face printed circuit, and module obtained via said method The display module (30) includes at least one liquid crystal cell (2) electrically and mechanically connected to a flexible display control printed circuit (1)having, arranged to a single face, electronic components for controlling the cell and metal path... | 08/05/2003 |
| 6603201 | Electronic substrate A package substrate having sides, which is formed of multiple non electrically conductive layers laminated together. Each of the multiple non electrically conductive layers is formed of a first lamina and a second lamina bonded together in a resin matrix.... | 08/05/2003 |
| 6601292 | Method for the connection and repair of flex and other circuits A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arrange... | 08/05/2003 |
| 6600427 | Combination instrument for displaying measured values and/or other information, in particular for use in a motor vehicle A combination instrument (1) for displaying measured values and/or other information, having a flexible printed circuit (2) on which electrical and/or electronic components (9, 10, 13) are arranged, and with parts of the flexible printed circuit (2) being... | 07/29/2003 |
| 6594152 | Board-to-board electrical coupling with conductive band A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit boa... | 07/15/2003 |
| 6583990 | Flexible circuit board and connect structure thereof A flexible first circuit member (10) includes conductors (11) wired thereto. The conductors (11) include a first conductor group (12). The first circuit member defines an opening (14) having a first edge part (14d). The first conductor group (12) terminat... | 06/24/2003 |
| 6581279 | Method of collectively packaging electronic components Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated with a plurality of conducting tracks formed on a second subs... | 06/24/2003 |
| 6580165 | Flip chip with solder pre-plated leadframe including locating holes A flip-chip with a solder pre-plated leadframe that includes locating holes. The leadframe does not include a die attach pad. Two of the leads include a locating or alignment hole for receiving a solder bump of the bumped die. The remaining leads include ... | 06/17/2003 |
| 6576992 | Chip scale stacking system and method The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, a pair of CSPs is stac... | 06/10/2003 |
| 6570773 | Control apparatus for an automobile An integrated motor vehicle control unit has a metallic base plate and a housing lid which is coupled thereto in an oil-tight fashion. A flexible printed circuit board makes contact with an electronic circuit of the control unit, extends on the base plate... | 05/27/2003 |
| 6560117 | Packaged microelectronic die assemblies and methods of manufacture Packaged microelectronic devices, interface substrates for packaging microelectronic devices, and methods of packaging single-die or stacked-die devices. One embodiment can include a die, an interface member having a die section attached to the die and an... | 05/06/2003 |
| 6552870 | Disk drive improved in mounting structure of a printed circuit board with respect to a motor frame In a disk drive using a motor frame, the motor frame is provided with a projection preliminarily formed to protrude on its principal surface. The projection has a slit formed at its base. A printed circuit board is inserted into the slit to be engaged wit... | 04/22/2003 |
| 6552910 | Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture A stacked-die assembly and a method of manufacturing a stacked-die assembly having a plurality of microelectronic devices. In one embodiment, a stacked-die assembly can include a first die, a second die juxtaposed to the first die, and an interface substr... | 04/22/2003 |
| 6549419 | Electronic substrate and method for manufacturing electronic equipment using the same To keep a flexible printed substrate planar when the substrate is set in a mounter for mounting parts and to miniaturize the substrate, the present invention proposes an electric substrate, for example, a flexible printed substrate on which electronic par... | 04/15/2003 |
| 6538207 | Strain relief structures for lead connections A flex circuit system has a support member on which a first subsystem of the flex circuit system is mounted. A second subsystem of the flex circuit system is remote from the first subsystem. A lead is bonded to bonding points on the first and second subsy... | 03/25/2003 |
| 6534722 | Flat panel type display apparatus A flexible wiring tape mounting driving ICs for driving a display body at the back surface of a metal chassis which supports the display body at a back surface thereof is provided in a flat panel type display apparatus. On the flexible wiring tape, ground... | 03/18/2003 |
| 6531660 | Printed substrate board A printed substrate board constructed, from a substantially unitary body includes at least one edge part along a side mountable into an external mounting device. The printed board includes individual board bodies having a shape that is out of parallel wit... | 03/11/2003 |
| 6529377 | Integrated cooling system Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that ... | 03/04/2003 |
