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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 7433201 | Oriented connections for leadless and leaded packages The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies ... | 10/07/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
| 7295445 | Holder for surface mount device during reflow Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with th... | 11/13/2007 |
| 7291783 | Mounting components to a hardware casing Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at le... | 11/06/2007 |
| 7264488 | Pickup cap for electrical connector An electrical assembly comprises an electrical connector, and an improved pickup cap that is provided with a surface area configuration that has the potential to impart a more even temperature distribution across the ball grid array during reflow. Some embodiments o... | 09/04/2007 |
| 7255601 | Cap for an electrical connector An electrical assembly that may include a weighted cap. The weighted cap may provide counterbalancing to a non-proportional ball-grid array connector integrated circuit package for connection with a substrate. The weighted cap provides compensation for variations in... | 08/14/2007 |
| 7214605 | Deposition of diffusion barrier The invention provides a stacked wafer structure with decreased failures. In one embodiment, there is a barrier layer deposited on exposed surfaces of conductors that extend across a distance between first and second device structures. The barrier layer may prevent ... | 05/08/2007 |
| 7197819 | Method of assembling an electric power A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also including a bracket adapted to accommodate and constrain a rigid conductive ... | 04/03/2007 |
| 7193317 | Semiconductor module and power conversion device One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semico... | 03/20/2007 |
| 7193852 | Control unit and method for producing the same The present invention relates to a control unit (1), for automotive applications in particular, with: a frame (8) that includes a recess (9) across which electrical conductive tracks (10) extend to supply electrical power; a base plate ( | 03/20/2007 |
| 7190061 | stack package made of chip scale packages A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent pair of chip scale packages is attached to the other in a manner that the ball land pads of the upper stacked chip s... | 03/13/2007 |
| 7168989 | Module for the assembly of two sets of connections A module for the assembly of two sets of connections, which have on their respective coupling faces a set of contacts whose contacts are distributed according to different layouts and densities, the module comprising a first set of contacts connected to a first prin... | 01/30/2007 |
| 7148578 | Semiconductor multi-chip package A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is ele... | 12/12/2006 |
| 7145254 | Transfer-molded power device and method for manufacturing transfer-molded power device A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are embedded. The thickness t1 of the chip and the thickness t2 of ... | 12/05/2006 |
| 7121841 | Electrical socket with compressible domed contacts A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact... | 10/17/2006 |
| 7122905 | Microelectronic devices and methods for mounting microelectronic packages to circuit boards Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can include a die, an interposer substrate, a solder-ball, and a dielectric... | 10/17/2006 |
| 7057295 | IC module assembly An IC module assembly includes an IC module including a plurality of pads disposed on a bottom thereof, a plurality of resilient members respectively soldering to the pads, and a PCB having a plurality of conductive patterns arranged on a top thereof and correspondi... | 06/06/2006 |
| 7045902 | Circuitized substrate for fixing solder beads on pads A circuitized substrate has contact pads for mounting a Surface Mount Device (SMD). First and second contact pads are located on a surface of the substrate corresponding to a first terminal and a second terminal of the SMD. The first and the second contact pads have... | 05/16/2006 |
| 7005584 | Compact navigation device assembly One embodiment of the invention provides a compact navigation device assembly that is rugged, compact and does not require independent connector components to interconnect multiple circuit boards. According to one implementation of the compact navigation device asse... | 02/28/2006 |
| 6959489 | Methods of making microelectronic packages A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends permanently attached to the substrate and second ends remote from the ter... | 11/01/2005 |
| 6917523 | Thermal solution for a mezzanine card A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom sur... | 07/12/2005 |
| 6913468 | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support subs... | 07/05/2005 |
| 6853542 | Video-apparatus-tuner mounting board A video-apparatus-tuner mounting board includes a television tuner mounted on the board; a predetermined circuit to be connected to pins connected to an internal circuit of the television tuner; through holes arranged in a line, into which pins are inserted; and con... | 02/08/2005 |
| 6791184 | Support assembly for an integrated circuit package having solder columns A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, t... | 09/14/2004 |
| 6750081 | Header for electronic components board in surface mount and through-hole assembly A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame around an area substantially the same as the area of the components b... | 06/15/2004 |
| 6693801 | Electronic device An electronic device includes a wiring board, and at least one pair of signal lines that is provided on the wiring board in parallel and has an equal length. A chip is mounted on the wiring board and includes at least one differential driver which outputs... | 02/17/2004 |
| 6690088 | Integrated circuit package stacking structure A stack of integrated circuits in thin small outline packages (TSOP's) is constructed with an air space in between adjacent packages. The TSOP's have a plurality of connection terminals extending therefrom. A lead frame is disposed adjacent to the package... | 02/10/2004 |
| 6664622 | Header for electronic components board in surface mount and through-hole assemble A low-cost header for connecting an electronic components board to a circuit board is disclosed, consisting of side walls made of an unwarpable plastic material and joined together to form a frame around an area substantially the same as the area of the c... | 12/16/2003 |
| 6661674 | System comprising at least two printed circuit boards In a system having two printed circuit boards, each printed circuit board is provided with at least one electrical contact element for electrically interconnecting the printed circuit boards. One of the electrical contact elements includes at least one el... | 12/09/2003 |
| 6651321 | Microelectronic joining processes A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the conne... | 11/25/2003 |
| 6646863 | Semi-private internet kiosk An embodiment of the present invention includes a kiosk having a computer system therein that allows a seated person to access a computer network, such as the Internet. A hinged keyboard retracts into the kiosk to preserve space when not in use. The hinge... | 11/11/2003 |
| 6608384 | Semiconductor device and method of forming the same A semiconductor device includes a bonding-structure for electrically and mechanically bonding a solder ball to the electrode pad. The bonding-structure includes flexible arms that are connected to a common supporting layer that allows a relative displacem... | 08/19/2003 |
| 6603663 | Electronic unit The invention relates to an electronic unit having a mounting board (4) and electronic components (1-3) mounted on it, with the mounting board (4) having metal webs (41) which are embedded in an electrically insulating material (40), the metal webs (41) h... | 08/05/2003 |
| 6594152 | Board-to-board electrical coupling with conductive band A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit boa... | 07/15/2003 |
| 6574113 | Electronic package with stacked connections and method for making same An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates ... | 06/03/2003 |
| 6552277 | Techniques for forming a connection between a pin and a circuit board The invention is directed to techniques for forming a connection between a pin and a circuit board using a pin having protruding portions and grooved surfaces that extend between the protruding portions. The protruding portions (i) prevent the pin from in... | 04/22/2003 |
| 6496381 | Contact arrangement and counter-contact module A contact arrangement for an electrically contactable module that is arranged on a card-shaped carrier, having a first contact bank with a plurality of contact areas, of which at least one is disposed outside of a predefined region. A second contact bank ... | 12/17/2002 |
| 6493240 | Interposer for connecting two substrates and resulting assembly The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by m... | 12/10/2002 |
| 6493238 | Method and apparatus to compliantly interconnect area grid arrays and printed wiring boards A method and system of utilizing inexpensively manufactured, electrically conductive and mechanically compliant disks to interconnect an area grid array ("AGA") chip to a printed wiring board. The conductive disk shaped leads are stamped from a thin sheet... | 12/10/2002 |
| 6465747 | Microelectronic assemblies having solder-wettable pads and conductive elements A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the solder wettable strips being bounded by non solder-wettab... | 10/15/2002 |
