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| Number | Title | Issue Date |
| 7414857 | Multilayer ceramic capacitor with internal current cancellation and bottom terminals Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where terminatio... | 08/19/2008 |
| 7405448 | Semiconductor device having a resistance for equalizing the current distribution A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the semiconductor element. A second insulating substrate is mounted inside th... | 07/29/2008 |
| 7382627 | Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the n... | 06/03/2008 |
| 7348661 | Array capacitor apparatuses to filter input/output signal An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package and an underlying substrate such as a printed circuit board. ... | 03/25/2008 |
| 7301251 | Actuator equipped with an electronic card with an arrangement for limiting electromagnetic radiations The invention concerns an actuator. In a common housing are a motor contained in a metallic casing and an electronic card adapted to control the motor. The casing is electrically connected to a ground. This connection is made by a deformable element, whose deformati... | 11/27/2007 |
| 7286368 | System to control effective series resistance of decoupling capacitor According to some embodiments, a system includes an integrated circuit package to support an integrated circuit die. The integrated circuit package may include a plurality of conductive contacts and a decoupling capacitor. The decoupling capacitor may include a posi... | 10/23/2007 |
| 7279771 | Wiring board mounting a capacitor In a capacitor-mounted wiring board, a plurality of wiring layers each patterned in a required shape are stacked with insulating layers interposed therebetween and are connected to each other via conductors formed to pierce the insulating layers in the direction of ... | 10/09/2007 |
| 7268408 | Wiring board, method for manufacturing wiring board and electronic component using wiring board A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided wi... | 09/11/2007 |
| 7240429 | Manufacturing method for a printed circuit board A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic subs... | 07/10/2007 |
| 7215023 | Power module A power module includes at least one carrier body for mounting at least one power component thereon, and at least one energy storage component. For this purpose, a hybrid circuit is arranged as a thick film circuit on at least one of the carrier bodies, and the hybr... | 05/08/2007 |
| 7186145 | Acute extender card The acute extender card makes the possibility for testing different electronic components (for example, video cards, sound cards and etc.) without limitation for plug in external cables to the test component at the same time the acute extender minimize the propagati... | 03/06/2007 |
| 7158004 | Integrated circuit inductors The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloy... | 01/02/2007 |
| 7130195 | Electronic apparatus An electronic apparatus includes a heat-generating device mounted on a surface of a printed circuit board and is surrounded with wall members of a housing. The wall members are connected to a ground electrode on the other surface of the printed circuit board, the gr... | 10/31/2006 |
| 7120031 | Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate incl... | 10/10/2006 |
| 7029962 | Methods for forming a high performance capacitor Embodiments of methods of forming capacitors are generally described herein. Other embodiments may be described and claimed. ... | 04/18/2006 |
| 6948230 | Integrated circuit inductors The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloy... | 09/27/2005 |
| 6936498 | Package structure with increased capacitance and method A package with increased capacitance comprises a core and a plurality of buildup layers. The core has an inner dielectric portion and the core outer conductive layer. The buildup layers are disposed over the core and have offset ablated regions reducing the thicknes... | 08/30/2005 |
| 6910260 | Integrated circuit inductors The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloy... | 06/28/2005 |
| 6861899 | Signal transmission circuit and electronic equipment The respective ends of input wiring on a printed wiring board of a signal transmission circuit are connected to an input terminal section and a transistor. One terminal of a first capacitor and a first resistor are respectively connected to the input wiring. A leadi... | 03/01/2005 |
| 6818836 | Printed circuit board and its manufacturing method A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic subs... | 11/16/2004 |
| 6813157 | Mother board and computer system capable of flexibly using synchronous dynamic random access memory and double data rate dynamic random access memory A mother board and a computer system capable of flexibly using the SDRAM and the DDRAM. The mother board has several memory module slots, a voltage comparator, a clock generator and a chip set. Each of the memory module slots comprises a reference voltage pin, and t... | 11/02/2004 |
| 6798666 | Introducing loss in a power bus to reduce EMI and electrical noise A printed circuit board includes a power layer for use in providing electrical power to circuit components and a ground layer for use in carrying electrical current away from the circuit components. A loss element connects electrically between the power layer and gr... | 09/28/2004 |
| 6717794 | Composite multilayered ceramic board and manufacturing method thereof A composite multilayered ceramic board includes a multilayered ceramic board made of dielectric ceramics, a multilayered ceramic board made of magnetic ceramics and an adhesive layer made of thermosetting resin such as polyimide and the like. In this composite multi... | 04/06/2004 |
| 6674338 | Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure Apparatus and methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure by electrically coupling multiple bypass capacitors and corresponding electrical resistance elemen... | 01/06/2004 |
| 6657136 | Termination board for mounting on circuit board Terminating resistances are provided to at least some pins of an ASIC or other multi-pin component mounted on a surface of a circuit board, by positioning a second circuit board on the surface of the main circuit board substantially opposite, and preferab... | 12/02/2003 |
| 6650546 | Chip component assembly A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads... | 11/18/2003 |
| 6573567 | IC card An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connec... | 06/03/2003 |
| 6563058 | Multilayered circuit board and method for producing the same A multilayered circuit board is constructed such that holes penetrating through second and third dielectric layers, interposed between a pair of electrodes for constructing a capacitor, are filled with a material having a high dielectric constant respecti... | 05/13/2003 |
| 6430059 | Integrated circuit package substrate integrating with decoupling capacitor An integrated circuit package substrate. At least one insulating layer is formed between every two neighboring patterned wiring layers for isolation. At least a via is formed to penetrate through the insulating layers to electrically connect the patterned... | 08/06/2002 |
| 6426879 | Load adjustment board and data processing apparatus The invention provides a circuit-mounted board which can improve the reliability in the operations of a system having expansion slots. The load adjustment board is a circuit-mounted board to be used by being inserted into the expansion slot of the system,... | 07/30/2002 |
| 6418030 | Multi-chip module A multi-chip module includes bare IC chips mounted on respective areas of a printed wiring board. Outer electrode pads on the peripheries of the board are soldered to another printed wiring board such as a motherboard. Lead pads and the outer electrode pa... | 07/09/2002 |
| 6344973 | Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB... | 02/05/2002 |
| 6330164 | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In... | 12/11/2001 |
| 6320757 | Electronic package An electronic package comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of conductive traces arranged at the periphery of the ground ring and the... | 11/20/2001 |
| 6239367 | Multi-chip chip scale package A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip on each side of the film carrier face to face. A bump is fo... | 05/29/2001 |
| 6198634 | Electronic package with stacked connections An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates ... | 03/06/2001 |
| 6097610 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and e... | 08/01/2000 |
| 6072690 | High k dielectric capacitor with low k sheathed signal vias A multi-layer ceramic capacitor and method of manufacturing the capacitor, the capacitor having signal vias surrounded by an area containing a material having a low dielectric constant, the via and surrounding area of low dielectric constant material inse... | 06/06/2000 |
| 6061241 | Line interface module A line circuit module is disclosed which comprises effectively all of the required circuitry for a line card apart from mechanical components such as relays and edge card connectors. The module includes a small ceramic substrate 2.0 inches by 0.825 inches... | 05/09/2000 |
| 6004657 | Laminated electronic part A high degree of freedom of design and high density mounting are achieved with a laminated electronic part having a structure such that the occurrence of floating capacitance can be restrained. The laminated electronic part is formed of a first layer and ... | 12/21/1999 |
