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| Number | Title | Issue Date |
| 7327577 | Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes the... | 02/05/2008 |
| 7325772 | Aircraft heat sink and electronics enclosure An aircraft component including a first section adapted to be attached at an exterior surface of an aircraft to close an access opening through the exterior surface; and a second section extending outward from the first section and forming heat transfer surfaces to ... | 02/05/2008 |
| 7327569 | Processor module with thermal dissipation device Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and... | 02/05/2008 |
| 7323796 | Motor-driven tool In a motor-driven tool, a carbon brush part 8 is arranged between a suction port 6 and a commutator 11 of the motor and includes a cylindrical side wall 8a. The cylindrical side wall 8a located on an outer periphery o... | 01/29/2008 |
| 7323358 | Method and system for sizing a load plate A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed... | 01/29/2008 |
| 7324342 | Electronics assembly and electronics package carrier therefor An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly al... | 01/29/2008 |
| 7319593 | Industrial light fixture with spring-bracket over capacitor An industrial light fixture of the type including a housing with a base member and a top member and containing power-related components includes a spring-bracket secured to bracket-securement point(s), extending along the capacitor to hold the capacitor in place and... | 01/15/2008 |
| 7317248 | Memory module having memory chips protected from excessive heat The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the me... | 01/08/2008 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
| 7312530 | Semiconductor device with multilayered metal pattern A semiconductor device comprises a first insulating film formed on a semiconductor substrate, a first metal pattern formed on the first insulating film, a second insulating film formed on the first metal pattern, a second metal pattern formed on the second insulatin... | 12/25/2007 |
| 7312990 | Electrical enclosure including accessible fan tray assembly An enclosure for housing electronic circuit boards, which enclosure includes a fan tray assembly which may be easily removed from and inserted into the enclosure. ... | 12/25/2007 |
| 7309838 | Multi-layered circuit board assembly with improved thermal dissipation A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to d... | 12/18/2007 |
| 7310240 | Method for increasing stability of system memory through enhanced quality of supply power An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the pr... | 12/18/2007 |
| 7310232 | Multi-surface heat sink film An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipatio... | 12/18/2007 |
| 7304856 | Assembly for holding circuit cards An assembly for holding circuit cards may comprise a plurality of slots, each slot being configured to receive a circuit card. At least one slot may be modifiable so as to permit the at least one slot to hold circuit cards having differing depths. ... | 12/04/2007 |
| 7300203 | Non-contacting sensor multichip module with integral heat-sinks A sensor assembly having a housing including a first portion and a second portion. One of the portions of the housing includes a plurality of walls. The walls at least partially define a chamber. The assembly also includes a hinge connected to the first portion and ... | 11/27/2007 |
| 7299546 | Method for manufacturing an electronic module An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also ... | 11/27/2007 |
| 7298623 | Organic substrate with integral thermal dissipation channels, and method for producing same A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-... | 11/20/2007 |
| 7295434 | Electronically controlled electric fan cooled by pressurized ambient air An electronically controlled electric fan (10) cooled by pressurized ambient air, includes: a motor (11) furnished with a cover (12), a mechanical assembly rotating a wheel (15) and a casing (13),... | 11/13/2007 |
| 7295441 | Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed o... | 11/13/2007 |
| 7291517 | Method for removing resin mask layer and method for manufacturing solder bumped substrate Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the su... | 11/06/2007 |
| 7289331 | Interposable heat sink for adjacent memory modules A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first... | 10/30/2007 |
| 7286361 | Heatsink Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semic... | 10/23/2007 |
| 7286355 | Cooling system for electronic devices A plurality of pouch bodies (14, 16, 18) are supported side-by-side from an assembly that includes a manifold block (26). The manifold block (26) includes an inlet manifold (28) and an outlet manifold (30). A liquid coolant (e.g. w... | 10/23/2007 |
| 7286346 | Peripheral device and electronic device A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component to the host device; a heat transfer device having a first end thermal... | 10/23/2007 |
| 7280364 | Apparatus and method for multiprocessor circuit board One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipat... | 10/09/2007 |
| 7275562 | Extensible spiral for flex circuit A planar extensible structure in a flat planar flex circuit can be extended out of the plane of the circuit by a distance of more than the width of the structure to carry fluids, electrical signals or optical signals into and out of the circuit. The planar extensibl... | 10/02/2007 |
| 7277295 | Industrial ethernet switch According to one embodiment of the invention, an apparatus includes a housing having a front side and a bottom side adjacent the front side. The apparatus also includes a plurality of light generating devices each operable to generate light in response to operation ... | 10/02/2007 |
| 7274572 | Supporting plate A supporting plate includes a metal plate and is utilized to support a heat sink module in an electronic device. The heat sink module has a thermal pad, and the electronic device has a first heat generating element and a second heat generating element. In addition, ... | 09/25/2007 |
| 7274570 | Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely or partially betwee... | 09/25/2007 |
| 7274569 | Power conversion device A power conversion device is downsized by integrally constructing a power conversion module and a control circuit board. The power conversion device includes a power conversion module 11, a control circuit board 21, and a heat sink 12. A case is... | 09/25/2007 |
| 7272008 | Portable power inverter with pass through device A portable power inverter having a pass through device to facilitate connection and operation of both A.C. and D.C. power consuming devices to a single outlet of a single D.C. power source. Inverter circuitry is electrically coupled to the external D.C. power source... | 09/18/2007 |
| 7272010 | Thermally conductive integrated circuit mounting structures Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal condu... | 09/18/2007 |
| 7269019 | Mounting substrate and driving device using same A driving device for a motor has a mounting substrate mounted to a base substrate. Highly heat-generating components such as a switching element for PWM control are mounted to the mounting substrate and only less heat-generating circuit components are mounted to the... | 09/11/2007 |
| 7269017 | Thermal management of surface-mount circuit devices on laminate ceramic substrate A circuit board assembly with a substrate having a laminate construction of ceramic layers, such as an LTCC ceramic substrate. The substrate is configured for the purpose of improving the thermal management of power circuit devices mounted to the substrate. Thermall... | 09/11/2007 |
| 7269014 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spread... | 09/11/2007 |
| 7268690 | Industrial ethernet switch According to one embodiment of the invention a rugged Ethernet switch includes a housing and a passive cooling system associated with the housing and being devoid of fans as operable to cool the Ethernet switch. Ethernet switch also includes software operable to per... | 09/11/2007 |
| 7265981 | Power supply with heat sink A power supply with heat sink is mounted inside a computer, and includes a support, a circuit board arranged on a surface of the support, and a heat sink provided on another surface of the support. The support defines a slot substantially therein. A plurality of ele... | 09/04/2007 |
| 7265516 | Linear electric motor controller and system for providing linear control The invention relates to a method of, and system for, linear speed control for an electric motor, in which a digital to analog converter means is used for converting an 8-bit digital signal to an analog voltage for setting voltage across a motor, a digital state mac... | 09/04/2007 |
| 7260624 | Systems and methods for establishing interaction between a local computer and a remote computer Methods and devices provide for remote management of a local computer by transferring screen frames produced by the local computer for viewing at a remote computer. The screen frame data may be obtained by digitizing an analog video output of the local computer and ... | 08/21/2007 |
