Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 6798658 | High voltage electrical packaging box structure A high voltage electrical packaging box structure includes a box body, and a high voltage electrical part which is accommodated in the box body. In the high voltage electrical packaging box, an interposing member which is formed using an expandable resin, is dispose... | 09/28/2004 |
| 6797880 | Plastic frame for the mounting of an electronic heavy-current control unit A plastic frame (8) serves for the simple mounting of an electronic heavy-current control unit. It has cutouts (20, 21, 22, 23, 24) for the positionally accurate receiving of busbars (4, 5, 6, 7; 4a; 4b; 4c), m... | 09/28/2004 |
| 6791840 | Incandescent tube bulb replacement assembly An incandescent tube bulb replacement assembly that is used in place of a horizontal incandescent tube light in a standard interior horizontal tube light fixture. The assembly includes a small printed circuit board (PCB) with a plurality of LEDs mounted perpendicula... | 09/14/2004 |
| 6788534 | Intake module having integrated ECU An intake module has an electronic control unit (ECU) housing portion that houses an ECU. The ECU housing portion is provided in a manner that a lateral direction of the ECU housing portion is approximately coincident with a direction of an intake air passage that i... | 09/07/2004 |
| 6785139 | Electric connection box In an electric connection box containing a bus bar board in a case, heat radiation member-side bus bars are connected to a heat radiation member, and switching devices, such as FETs, are mounted on the bus bars. The heat radiation member-side bus bars may project be... | 08/31/2004 |
| 6781832 | Cooling unit for cooling heat generating component and electronic apparatus containing cooling unit A cooling unit comprises a heat sink arranged adjacent to a heat generating component, the heat sink having area dimensions greater than the heat generating component. A heat diffusing member is arranged between the heat generating component and the heat sink. A fir... | 08/24/2004 |
| 6781830 | Methods and systems of heat transfer for electronic enclosures An electronics enclosure is provided. The enclosure includes a modular card cage adapted to receive one or more electronic circuit cards and a heat sink adapted to protrude through an opening of an enclosure and couple to the modular card cage. The modular card cage... | 08/24/2004 |
| 6781833 | Heat dissipation connector with USB port A heat dissipation connector capable of dissipating heat from electric appliances in relative close proximity, such as a personal computer and possesses one or more USB ports for connecting to other electrical appliances. Specifically, the present invention is provi... | 08/24/2004 |
| 6778388 | Water-resistant electronic enclosure having a heat sink A device and method for enclosing electronics in a waterproof environment and transferring the heat generated by the electronics to an external environment is provided. The device includes a housing and a heat sink. The housing includes top and bottom pieces that ar... | 08/17/2004 |
| 6775145 | Construction for high density power module package (case II) A high density power module package where in the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to sav... | 08/10/2004 |
| 6771507 | Power module for multi-chip printed circuit boards A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module pri... | 08/03/2004 |
| 6768642 | VME circuit host card with triple mezzanine configuration A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and conne... | 07/27/2004 |
| 6762937 | Power module A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on ... | 07/13/2004 |
| 6738258 | Power semiconductor module The power semiconductor module (1) comprises a housing (5), a covering panel (11) and at least two submodules (21, 22). The submodules (21, 22) each comprise at least one semiconductor chip, which has two main electrodes which are ... | 05/18/2004 |
| 6731503 | Electrically isolated module An electronic control module provides dual insulation layers between an internal line voltage and a separate tool housing that serves as a heat sink, thereby allowing versatility in mounting the electronic control module within the tool housing interior, and thereby... | 05/04/2004 |
| 6721182 | Circuit card module including mezzanine card heat sink and related methods A circuit card module to be received in a card chassis includes a host card assembly and a mezzanine card assembly carried in spaced relation by the host card assembly. The host card assembly includes a host card heat sink having an end to connect to the card chassi... | 04/13/2004 |
| 6711019 | Mounting fitting of heat sink and method of removing the same A mounting fitting of a heat sink of the present invention is unitarily formed of a first spring, a second spring, a central part disposed in the boundary between the first and second springs, a first arm connected to an end of the first spring on the opposite side ... | 03/23/2004 |
| 6704201 | Power feed and heat dissipating device for power semiconductor devices In an electric circuit using a plurality of power semiconductor devices 1, the power semiconductor devices have heat radiation metallic parts 5 to which the electrodes in the power semiconductor devices are electrically connected within a package of the s... | 03/09/2004 |
| 6704202 | Power controller and compressor for refrigeration system The present invention solves a problem that a power controller be large in a refrigerating system, and provides a compact-size as well as an inexpensive power controller. Highly heat-dissipating first board 1 including an inverter circuit mounted thereon ... | 03/09/2004 |
| 6704203 | Power supply module The invention relates to a power supply module for high output currents, particularly a DC-DC converter, with a plate-shaped carrier element (10) configured to interact with a planar inductor and having a plurality of conductor layers, which has a suitabl... | 03/09/2004 |
| 6704206 | Assembly device and method for assembling an electronic component An assembly device for an electronic component in sandwich type of construction. The electronic component includes at least one semiconductor element which is contacted in a planar fashion on its lower side and its upper side each by one circuit substrate... | 03/09/2004 |
| 6700797 | Nested plug-in modules A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a n... | 03/02/2004 |
| 6700784 | Handheld type electronic device A handheld type electronic device of this invention includes two housings respectively provided with electronic system components, a rotary device, and an electrical connector electrically connecting the electronic system components in the two housings. T... | 03/02/2004 |
| 6697257 | Power semiconductor module Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semicondu... | 02/24/2004 |
| 6693797 | Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can tra... | 02/17/2004 |
| 6687127 | EMC core supporting structure An EMC core supporting structure for supporting at least one EMC core inside a casing accommodates a printed circuit board which mounts at least one heat generating element. The structure further includes a shielding plate arranged on one side of the prin... | 02/03/2004 |
| 6683787 | Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherw... | 01/27/2004 |
| 6680849 | Extruded heatsink and EMC enclosure An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair o... | 01/20/2004 |
| 6674642 | Liquid-to-air cooling system for portable electronic and computer devices A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange ass... | 01/06/2004 |
| 6671174 | 5-pin surface mount contacts and block assembly A surge protector block assembly includes a plurality of individual 5-pin housing units which are formed integrally together. Each of the plurality of individual housing units has a plurality of surface mountable socket contacts for receiving correspondin... | 12/30/2003 |
| 6671173 | Substrate-stacking structure In a substrate-stacking structure, a substrate, having heat-generating parts mounted thereon, and a control substrate, having control parts mounted thereon, are held spaced a predetermined distance from each other. The substrate and the control substrate ... | 12/30/2003 |
| 6671175 | Assembly of computer peripherals An assembly of computer peripherals, which has the functions of (temperature control and fan rotation speed regulation, includes a host casing, a temperature sensing circuit, a fan driver circuit, a liquid crystal display (LCD) driver circuit, an alarm ci... | 12/30/2003 |
| 6667883 | Forced-air cooling of a transceiver unit The present invention provides for cooling a plurality of racked electronic devices having a first electronic device having at least one cooling vent at a first end and a plurality of cooling holes at a top, each of the cooling vents having a cooling fan,... | 12/23/2003 |
| 6661659 | Water cooled inverter According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water chan... | 12/09/2003 |
| 6654249 | Circuit arrangement A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary co... | 11/25/2003 |
| 6636429 | EMI reduction in power modules through the use of integrated capacitors on the substrate level A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference ("EMI"). In one embodiment, capacitance is electrically connected to at least one of the positive conducting... | 10/21/2003 |
| 6625029 | Sensor unit A sensor unit S for water heating systems, particularly for water boilers, is designed with a single housing H as a combined relative pressure and temperature sensor and has a ceramic support element C carrying an electronic circuit E including separate c... | 09/23/2003 |
| 6621701 | Water cooled inverter According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water chan... | 09/16/2003 |
| 6621706 | Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module A conduction cooled electronic card module is designed for insertion into a chassis of an electronic device so as to transfer thereto a heat generated by electronic components of the module. The module comprises a circuit card of a convection cooled type,... | 09/16/2003 |
| 6621702 | Method and apparatus for absorbing thermal energy An apparatus for absorbing thermal energy has an electronic component, a support structure for the electronic component having a first set of surfaces defining an interior volume containing a plurality of secondary surfaces, and a thermal energy absorbing... | 09/16/2003 |
