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| Number | Title | Issue Date |
| 6956741 | Semiconductor package with heat sink A semiconductor package with a heat sink is provided, having a substrate formed with at least one opening penetrating therethrough. A heat sink is mounted on a surface of the substrate same as for forming solder balls and seals one end of the opening by a thermally ... | 10/18/2005 |
| 6956742 | Compact liquid converter assembly An electronic converter assembly comprising first and second liquid cooled heat sink members, each sink member having at least one sink mounting surface, first and second pluralities of power switching devices, each switching device including connection terminals, t... | 10/18/2005 |
| 6954368 | Low stray interconnection inductance power converting molecule for converting a DC voltage into an AC voltage, and a method therefor The low stray interconnecton power converting module is for converting a DC voltage into an AC voltage. It comprises two DC voltage terminals for receiving the DC voltage, an AC voltage terminal for delivering the AC voltage, and a half-bridge including a pair of po... | 10/11/2005 |
| 6952347 | Power module A power module is suggested having a simple and cost-effective arrangement and ensuring a reliable operation. To this end, a circuit arrangement comprising at least one electronic component is arranged on a carrier body. A conductor pattern is formed on the top side... | 10/04/2005 |
| 6948555 | Heat dissipating system and method Embodiments of the present invention recite a heat dissipating system. In one embodiment, a heatsink comprising a plurality of cooling elements substantially encases a fan assembly disposed therein. When in operation, at least a portion of intake air for the fan ass... | 09/27/2005 |
| 6950306 | Connection frame for fan A connection frame for fastening a fan of a heat sink is provided. The connection frame has side walls for defining an upper area and for mounting the fan thereon and a lower area to be coupled with the heat sink. The connection frame has a plurality of support stru... | 09/27/2005 |
| 6947286 | Stack up assembly A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that t... | 09/20/2005 |
| 6947284 | Heat sink assembly with retaining device A heat sink assembly includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores (38) therein. The fram... | 09/20/2005 |
| 6946190 | Thermal management materials A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a di... | 09/20/2005 |
| 6940720 | Integrated circuit having a thermally shielded electric resistor trace An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on ... | 09/06/2005 |
| 6940715 | Modular power converter having fluid cooled support A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 09/06/2005 |
| 6934153 | Heat sink assembly with fixing mechanism A heat sink assembly includes a heat sink (80), a pair of fixing devices (40), a pair of clips (20), and a fan (90). Each clip includes a main body (24), and an operating arm (22) pivotally attached to the main body. The mai... | 08/23/2005 |
| 6929504 | Combined electrical connector and radiator for high current applications An electrical connector useful for both high-current and low-current applications including a first and a second conductive terminals, in which the terminals are interconnected by a plurality of substantially rigid and elongated conductive strips and apertures or ga... | 08/16/2005 |
| 6930884 | Land grid array assembly using a compressive liquid Disclosed is land grid array (LGA) assembly using a compressive load. An LGA assembly includes a first component located on the top of the LGA assembly; a center load screw coupled to the first component; and a second component, wherein the center load screw is rece... | 08/16/2005 |
| 6924983 | Heat sink fan A heat sink fan comprises a heat sink (2) including a base member (21) and a plurality of thin heat radiating fins (22) fixed thereto, and a fan case (1) for supporting an axial flow fan (18) that induces air flow for cooling the h... | 08/02/2005 |
| 6924984 | Heat sink clip with pivoting locking portions A heat sink clip comprises a connecting member (12), two pressing members (14) connecting to the connection member, each of the pressing members comprising a pressing portion (141) and two spring portions (142, 143) extending from opposit... | 08/02/2005 |
| 6924982 | Heat dissipation assembly including heat sink and fan A heat dissipation assembly (100) includes a retention frame (90), a heat sink (80), a fan holder (10), a pair of clips (60) and a fan (20). The heat sink is mounted on the retention frame and forms a pair of shoulders (8... | 08/02/2005 |
| 6922340 | Stack up assembly A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that t... | 07/26/2005 |
| 6920047 | Electrically isolated module An electronic control module provides dual insulation layers between an internal line voltage and a separate tool housing that serves as a heat sink, thereby allowing versatility in mounting the electronic control module within the tool housing interior, and thereby... | 07/19/2005 |
| 6920052 | Dynamic isolating mount for processor packages The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention ... | 07/19/2005 |
| 6918438 | Finned heat sink A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is const... | 07/19/2005 |
| 6907947 | Power control unit for electric vehicle A power control unit for electric vehicle which can easily detach the high voltage cables even if the motor room is deformed, for example, by head-on collision and/or rear-end collision of the vehicle, which is difficult to be deformed, which can make small, and whi... | 06/21/2005 |
| 6909607 | Thermally matched fluid cooled power converter A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between t... | 06/21/2005 |
| 6906923 | Heat sink clip and method A heat sink clip that includes a base and a cam rotatably coupled to the base. The base includes a pair of side walls and a pin extending between the side walls such that the cam is rotatably mounted on the pin. When the clip is properly positioned relative to the h... | 06/14/2005 |
| 6900987 | Stack up assembly A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that t... | 05/31/2005 |
| 6900990 | Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component An electronic apparatus includes a housing which accommodates a heat generating component. A heat receiving portion thermally connected to the heat generating component is connected to a heat radiating portion via a circulating path through which a liquid coolant is... | 05/31/2005 |
| 6898084 | Thermal diffusion apparatus An apparatus for operably conveying heat away from a heat source includes a thermally conductive substrate having a thickness defining a planar boundary thereof, and an insert portion disposed in the substrate and being positioned so as not to extend beyond the plan... | 05/24/2005 |
| 6894898 | Fixing apparatus for heat sink A fixing apparatus (30) for pressing a heat sink (70) against an electronic device (20) positioned in a retention module (62), includes two pressing members (32) and a fastener (52). An elongate slot (34) is defined i... | 05/17/2005 |
| 6890799 | Device for sealing and cooling multi-chip modules According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the enti... | 05/10/2005 |
| 6884101 | Interposer one-step load and self-lock socket A self-locking interposer restraint mechanism is disclosed. Rather than using screws to compress springs, clips are pushed down over the posts to compress the springs. Once the clips are pushed down to a level at which the springs are sufficiently compressed, the cl... | 04/26/2005 |
| 6883593 | Heat sink for convection cooling in horizontal applications A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in... | 04/26/2005 |
| 6880621 | Radiator The present invention provides a radiator that consists of a plurality of f ins, one side of each fin has at least one wing parallel relative to the side, the wing is disposed spaced from the fin. The wing has protruding parts disposed approximately perpendicularly ... | 04/19/2005 |
| 6882534 | Fastening device for heat slug A fastening device for heat slug includes a frame, two projections and a heat slug. The frame defines an accommodating space therein. The projections are formed on the frame. The heat slug has a plurality of shoulders and is located in the accommodating space. The f... | 04/19/2005 |
| 6879487 | Fan-securing device for use with a heat transfer device A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transf... | 04/12/2005 |
| 6876551 | Heat sink assembly including clip with pressing and operating members A heat sink assembly includes a heat sink (30), a processing unit (70), a socket (40) and a clip (1). The processing unit is mounted on the socket. Two catches (42) are provided at opposite sides of the socket. The clip includes a ... | 04/05/2005 |
| 6876550 | Active heat sink for high power microprocessors A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink. ... | 04/05/2005 |
| 6873530 | Stack up assembly A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that t... | 03/29/2005 |
| 6868899 | Variable height thermal interface A variable-height thermal-interface device is provided for transferring heat from a heat source to a sink. The device comprises a first uniaxial rotary cylindrical joint comprising a first cylindrically concave surface in slidable contact with a first cylindrically ... | 03/22/2005 |
| 6865082 | Heat dissipating assembly In a heat dissipating assembly, a base frame is disposed underneath a circuit board and includes a bottom part with opposite first and second sides that are formed with first and second engaging units, respectively. The first and second engaging units extend upwardl... | 03/08/2005 |
| 6864567 | Base of LED A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an integral negative pole body at an inner side thereof, multiple upright negat... | 03/08/2005 |
