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A method of swing on a swing is disclosed, in which a user positioned on a standard swing suspended by two chains from a substantially horizontal tree branch induces side to side motion by pulling alternately on one chain and then the other.
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| Number | Title | Issue Date |
| 7672135 | Heat sink A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange. ... | 03/02/2010 |
| 7660123 | Heat dissipating fin assembly for clamping dynamic random access memory to dissipate heat An exemplary heat dissipating fin assembly for clamping the DRAM to dissipate heat includes a number of heat dissipating fins arranged in a stacked fashion and a shaft. Each of the heat dissipating fins defines a pivoting hole and a slot therein. The slots of the he... | 02/09/2010 |
| 7656668 | Secure device for a heat sink and CPU A secure device for a heat sink and CPU includes a main support arm and an operation handler. The main support arm has a first hook section at one end thereof and provides a contact face and a movable second hook section at another end thereof. The operation handle ... | 02/02/2010 |
| 7646607 | Quasi-radial heatsink with rectangular form factor and uniform fin length In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermal... | 01/12/2010 |
| 7643299 | Clip for heat sink A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of ... | 01/05/2010 |
| 7639502 | Fastening element for heat dissipating apparatus A heat dissipating apparatus (100) includes a heat sink (20) and a plurality of fastening elements (10). The heat sink includes a base (22) and a plurality of fins (24). The fastening element includes a head (12), a resilien... | 12/29/2009 |
| 7613004 | Heat sink with heat dissipating fins and method of manufacturing heat sink A heat sink comprising: a heat dissipating portion comprising a plurality of metal fins each having a heat receiving portion and a heat dissipating portion having elasticity; a fin fixing member to transfix said plurality of metal fins; a metal plate having a plural... | 11/03/2009 |
| 7609522 | Heat sink assembly A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slo... | 10/27/2009 |
| 7606033 | Mounting a heat sink in thermal contact with an electronic component A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the l... | 10/20/2009 |
| 7593230 | Apparatus for absorbing and dissipating excess heat generated by a system The invention relates to a heatsink. More particularly, the invention relates to a heatsink having tapered geometry that improves passive cooling efficiency. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis oppo... | 09/22/2009 |
| 7589971 | Reconfigurable heat sink assembly An electrical assembly including a housing having an inner surface. At least one mounting feature protrudes from the inner surface. At least one heat sink is inserted onto the at least one mounting feature. At least one electrical component is in thermal contact wit... | 09/15/2009 |
| 7567439 | Heat dissipation device having a rotatable fastener A heat dissipation device includes a heat sink, a retention module and a rotatable fastener for securing the heat sink to the retention module. The retention module includes two supporting ribs and a positioning block above one of the supporting ribs. The rotatable ... | 07/28/2009 |
| 7558067 | Retaining tool for a heat sink A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The ope... | 07/07/2009 |
| 7554808 | Heat sink with thermoelectric module An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive uni... | 06/30/2009 |
| 7545647 | Compliant thermal interface structure utilizing spring elements A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further incl... | 06/09/2009 |
| 7545648 | Cooling structure using rigid movable elements An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structu... | 06/09/2009 |
| 7539019 | Apparatus for transferring heat from a heat spreader An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat diss... | 05/26/2009 |
| 7522422 | Heat sink A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in co... | 04/21/2009 |
| 7518874 | Heat sink assembly A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center th... | 04/14/2009 |
| 7518873 | Heat spreader, semiconductor package module and memory module having the heat spreader A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ri... | 04/14/2009 |
| 7515423 | Heat dissipation device A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements... | 04/07/2009 |
| 7505274 | Heat sink fastening device and assembling process thereof A heat sink fastening device is used for facilitating fixing a heat sink on a circuit board. The heat sink fastening device includes a first connecting portion, a second connecting portion and at least a connecting member. The first connecting portion is included in... | 03/17/2009 |
| 7495919 | Heat sink assembly having a locking device assembly A heat sink assembly comprises a heat sink (20) and a locking device assembly (30) for mounting the heat sink to an electronic component (44) of a printed circuit board (40). A channel (25) is defined in the heat sink. The locking ... | 02/24/2009 |
| 7489513 | Heat dissipation device A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetw... | 02/10/2009 |
| 7486516 | Mounting a heat sink in thermal contact with an electronic component A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the l... | 02/03/2009 |
| 7443683 | Cooling apparatus for electronic devices In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core s... | 10/28/2008 |
| 7442903 | Heat sink for electronic device A heat sink for the electronic device is disclosed. The heat sink comprises a hub, a plurality of first supporting elements and a frame. A fan is axially connected to the hub. The first supporting elements are positioned along the periphery of the hub and protrude o... | 10/28/2008 |
| 7443684 | Heat sink apparatus The present invention relates to a heat sink apparatus, which discloses that by using a meshed member as a heat sink member, the heat-sinking efficiency will be enhanced owing to increased surface areas. Furthermore, a first linear member is made to contact with a s... | 10/28/2008 |
| 7440284 | Holding device for a heat sink A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of ... | 10/21/2008 |
| 7436664 | Electronic appliance In an electronic appliance, a base is thermally fused by a heat generating component. On the base, a heat dissipating fin group including heat dissipating fins each extending in a Y direction is arranged in spaced relation in an X direction. An exhaust fan and a par... | 10/14/2008 |
| 7436671 | Retention module for a heat sink A retention module (10) for securing a heat sink (20) to a printed circuit board (30) includes a pair of carriage arms (12) separated by a space and a connecting wall (14) interconnecting opposite rear free ends of the carriage arm... | 10/14/2008 |
| 7433192 | Packaging for electronic modules An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The inv... | 10/07/2008 |
| 7428154 | Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat si... | 09/23/2008 |
| 7423880 | Secure device capable of engaging with a heat sink firmly A secure device for a heat sink includes a frame and a plurality of cylindrical posts. The frame provides a plurality of elongated projections at the inner side thereof. Each of the cylindrical posts is attached to the outer side of the frame. A plurality of split p... | 09/09/2008 |
| 7423873 | Heat dissipation device having fan holder for attachment of a fan A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16... | 09/09/2008 |
| 7420810 | Base heat spreader with fins A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components. ... | 09/02/2008 |
| 7420809 | Heat spreader in integrated circuit package An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises ... | 09/02/2008 |
| 7417859 | Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same A heat radiating assembly employable by a plasma display apparatus for radiating heat generated by a signal transmission unit, which transmits electric signals from a circuit unit that drives a plasma display panel and includes an electronic device covered by a prot... | 08/26/2008 |
| 7417860 | Heat dissipation device A heat sink assembly (10) includes a heat sink (12) and a wire clip (14). The heat sink includes a base (120) and a plurality of fins (124) mounted on the base. A channel (126) is defined between two neighboring ones of the ... | 08/26/2008 |
| 7417864 | Gear driven socket activation mechanism A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component. ... | 08/26/2008 |
