Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 6738258 | Power semiconductor module The power semiconductor module (1) comprises a housing (5), a covering panel (11) and at least two submodules (21, 22). The submodules (21, 22) each comprise at least one semiconductor chip, which has two main electrodes which are ... | 05/18/2004 |
| 6734552 | Enhanced thermal dissipation integrated circuit package In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the heat sink further including an extending finger when viewed from a top ... | 05/11/2004 |
| 6731504 | Heat sink fastener A heat sink fastener for securing a heat sink to a CPU is described as having a holding down spring plate. The holding down spring plate has a flat bearing portion at one end, a first hook plate extended from one end of the holding down spring plate remote from the ... | 05/04/2004 |
| 6731503 | Electrically isolated module An electronic control module provides dual insulation layers between an internal line voltage and a separate tool housing that serves as a heat sink, thereby allowing versatility in mounting the electronic control module within the tool housing interior, and thereby... | 05/04/2004 |
| 6725906 | Heat dissipation device The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the ... | 04/27/2004 |
| 6728107 | Mounting assembly for heat sink A mounting a heat sink (60) in a mounting frame (80) includes two clips (20) and an operating body (40). Each clip has a central portion (22) and two arms (24) depending from opposite ends of the central portion respectively... | 04/27/2004 |
| 6724632 | Heat sink assembly with adjustable clip A heat sink assembly includes a back plate (10), a clip (20) and a heat sink (50). The back plate is attached below a motherboard (60) on which a CPU (63) is mounted. The heat sink is attached on the CPU. Two posts (13) of t... | 04/20/2004 |
| 6717814 | Heat dissipation assembly A heat dissipation assembly includes a fan (10), a mounting bracket (20), a clip (30), a heat sink (40), and a mounting frame (50). The fan is mounted to the mounting bracket. The clip is bent from an elongated thread or rod of wir... | 04/06/2004 |
| 6714416 | Mechanisms and techniques for fastening a heat sink to a circuit board component A heat sink apparatus includes a heat sink having a plurality of circuit board component contact portions and a plurality of fin portions extending from the contact portions. The circuit board component contact portions of the heat sink conform to a surface of the c... | 03/30/2004 |
| 6711019 | Mounting fitting of heat sink and method of removing the same A mounting fitting of a heat sink of the present invention is unitarily formed of a first spring, a second spring, a central part disposed in the boundary between the first and second springs, a first arm connected to an end of the first spring on the opposite side ... | 03/23/2004 |
| 6707674 | Dual spring heat sink retention A heat sink retention apparatus includes a frame for supporting a heat sink. A plurality of flexible members extend from opposite ends of the frame. Each flexible member includes a retention tab and one of the retention tabs includes a retraction tab. A heat sink is... | 03/16/2004 |
| 6704202 | Power controller and compressor for refrigeration system The present invention solves a problem that a power controller be large in a refrigerating system, and provides a compact-size as well as an inexpensive power controller. Highly heat-dissipating first board 1 including an inverter circuit mounted thereon ... | 03/09/2004 |
| 6704201 | Power feed and heat dissipating device for power semiconductor devices In an electric circuit using a plurality of power semiconductor devices 1, the power semiconductor devices have heat radiation metallic parts 5 to which the electrodes in the power semiconductor devices are electrically connected within a package of the s... | 03/09/2004 |
| 6704203 | Power supply module The invention relates to a power supply module for high output currents, particularly a DC-DC converter, with a plate-shaped carrier element (10) configured to interact with a planar inductor and having a plurality of conductor layers, which has a suitabl... | 03/09/2004 |
| 6700782 | Apparatus and method to retain an electronic component in a precise position during assembly manufacturing A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed ends; a pair of legs, each depending from one of the opposed ... | 03/02/2004 |
| 6681840 | Heat sink with enhanced heat spreading and compliant interface for better heat transfer Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing t... | 01/27/2004 |
| 6683787 | Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherw... | 01/27/2004 |
| 6680848 | Device and method for mounting integrated circuits on a printed circuit card The subject of the present invention is a device (1) for mounting at least two electrical components (4A, 4B) on a printed circuit card (2), the card (2) comprising connection pads on both of its sides. According to the invention, the card (2) is traverse... | 01/20/2004 |
| 6672380 | Heat sink base pad A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate thereof to increase the self-heat convection of the bottom po... | 01/06/2004 |
| 6672892 | Package retention module coupled directly to a socket A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. The at least one retention arm extends perpendicular to the socket. At least one retention clamp is coupled to the at least one retention ar... | 01/06/2004 |
| 6667884 | Heat dissipating assembly A heat dissipating assembly includes a CPU (35) mounted on a motherboard (30), a fan (20), two clips (60), a heat sink (10), two fasteners (50), a back plate (40) and two posts (70). The heat sink includes a base (12) and a plurality of fins (14). Two ear... | 12/23/2003 |
| 6659168 | Heatsink with multiple fin types A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of the base. The first and second regions of the base may be... | 12/09/2003 |
| 6657865 | Heat dissipating structure A heat dissipating structure is formed via the assembly of metallic fins. An upper side, an inner side, and a lower side of each fin respectively form a first, second, and third folded edge. At least each first folded edge includes a groove through one ri... | 12/02/2003 |
| 6654249 | Circuit arrangement A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary co... | 11/25/2003 |
| 6650541 | Fan-securing device for use with a heat transfer device A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the ... | 11/18/2003 |
| 6643133 | Buckling device of a heat dissipating module A buckling device of a heat dissipating module comprises a retaining seat, a connecting element and a pressing element. The retaining seat has a plurality of legs extended from two opposite sides, each leg having a buckling hole. The connecting element ha... | 11/04/2003 |
| 6639796 | Fastenerless clip for quick installation and removal of system components in a computer system A fastenerless clip attaches a system component to the inside of a chassis of a computer system. The clip is detachably mountable and includes a clip body with a resilient portion to provide a compressive force that securely holds the system component in ... | 10/28/2003 |
| 6639800 | Heat sink subassembly A heat sink subassembly may include a retainer comprising several attachment points, a heat sink coupled to the retainer, and a force-generating device. The heat sink includes several fins, one of which is shorter than the other fins. The force-generating... | 10/28/2003 |
| 6639802 | Heat sink with interlocked fins A heat sink includes a base plate (30), and a plurality of fins (10) mounted on the base plate. Each fin includes a main body (12), and two upper locking members (14). Two retaining holes (22) are defined in the main body. Each locking member includes a h... | 10/28/2003 |
| 6631078 | Electronic package with thermally conductive standoff A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper sur... | 10/07/2003 |
| 6628522 | Thermal performance enhancement of heat sinks using active surface features for boundary layer manipulations Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer ... | 09/30/2003 |
| 6625026 | Heat-activated self-aligning heat sink A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel ... | 09/23/2003 |
| 6621703 | Automotive bridge rectifier assembly with thermal protection A rectifier assembly employs a set of diodes to rectify alternating current from an alternator to direct current for use by the electrical system of an automobile. The rectifier includes a plurality of thermal safety disconnects coupled along circuit path... | 09/16/2003 |
| 6614658 | Flexible cable stiffener for an optical transceiver An optical transceiver utilizes a stiffener including a surface adapted for attachment of a portion of a flexible circuit having electrical components that protrude from the flexible circuit. The surface of the stiffener includes one or more cavities conf... | 09/02/2003 |
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package A new design is provided for the heat spreader of a semiconductor package. Grooves are provided in a surface of the heat spreader, subdividing the heat spreader for purposes of stress distribution into four or more sections. This division of the heat spre... | 08/19/2003 |
| 6597570 | Device for dissipating heat from an electronic component situated in a housing To dissipate heat from a lossy electronic component which is fixed to the inner side of a wall of a housing, several of the outer and/or inner sides of the housing are placed into contact with a cooling element. In this way, a large part or all of the hou... | 07/22/2003 |
| 6597574 | Radiator plate and process for manufacturing the same A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller ... | 07/22/2003 |
| 6587344 | Mounting system for high-voltage semiconductor device A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and... | 07/01/2003 |
| 6580608 | Method and apparatus for thermally controlling multiple electronic components A method and apparatus to thermally control multiple electronic components, such as field-effect transistors for voltage regulation in processors and chipsets in computers, allow more effective convective cooling by grouping the electronic components in a... | 06/17/2003 |
| 6571862 | Heat dissipating fin A heat dissipation fin includes multiple unit each having a top, a first side and a second side and multiple bridges each connecting every two adjacent units together and connected to each one of the units at a fold. The bridge has a front side and a rear... | 06/03/2003 |
