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| Number | Title | Issue Date |
| 6933604 | Semiconductor device, semiconductor module and hard disk The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back s... | 08/23/2005 |
| 6930884 | Land grid array assembly using a compressive liquid Disclosed is land grid array (LGA) assembly using a compressive load. An LGA assembly includes a first component located on the top of the LGA assembly; a center load screw coupled to the first component; and a second component, wherein the center load screw is rece... | 08/16/2005 |
| 6925829 | Cooling system and electronic apparatus having the same A cooling system, applied to an electronic apparatus having a plurality of exoergic circuit elements, which cools the exoergic circuit elements using air supplied from the outside, includes a fin heat sink provided on the exoergic circuit elements, and an evaporator... | 08/09/2005 |
| 6920052 | Dynamic isolating mount for processor packages The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention ... | 07/19/2005 |
| 6912785 | Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus A notebook computer has a base housing with a heat-generating microprocessor therein, and a lid housing pivotally connected to the base housing. Operating heat from the microprocessor is transferred to the lid housing, for dissipation therefrom, via a specially desi... | 07/05/2005 |
| 6914780 | Methods and apparatus for cooling a circuit board component using a heat pipe assembly A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the... | 07/05/2005 |
| 6914783 | Digital micromirror device mounting system A projection device is provided, wherein the projection device includes a digital micromirror device, a circuit board that further includes a first face and a second face, an integrated heat sink/stiffener; and a plurality of engagement mechanisms, wherein the plura... | 07/05/2005 |
| 6907947 | Power control unit for electric vehicle A power control unit for electric vehicle which can easily detach the high voltage cables even if the motor room is deformed, for example, by head-on collision and/or rear-end collision of the vehicle, which is difficult to be deformed, which can make small, and whi... | 06/21/2005 |
| 6906437 | Current rectifier assembly for rotating electrical machines, in particular motor vehicle alternators The invention concerns a current-rectifying arrangement for rotary electrical machines of the type comprising a support (50, 51, 51′) for a plurality of positive diodes (66), a support for a plurality of negative diodes, forming part of the rear bear... | 06/14/2005 |
| 6905060 | Method and sealant for weld joints A sealant for a weld joint and an associated weld joint and method are provided. The sealant includes aluminum and germanium and is characterized by a melting temperature that is lower than the melting temperature of the structural member that is joined. The sealant... | 06/14/2005 |
| 6903931 | Cold plate assembly An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body... | 06/07/2005 |
| 6903934 | Circuit board construction for use in small form factor fiber optic communication system transponders A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features separate transmitter and receiver ports and an electrical connector for connecting with computer or communic... | 06/07/2005 |
| 6903936 | Power regulator A power regulator has a heat sink, a case and a PCB. The case is mounted on a top of the heat sink, and multiple holes are defined in the case. The PCB is mounted vertically on top of the heat sink and has a fuse bracket, a wire connector, an input terminal, an outp... | 06/07/2005 |
| 6901993 | Heat sink assembly having combined fins A heat sink assembly (20) includes a number of parallel first fins (40) and a number of parallel second fins (60) each having a main body (44, 64). A number of latch slots (46) is defined in the main body of each first fin. A numbe... | 06/07/2005 |
| 6898083 | Heat sink integrated retention system A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat base to the circuit board component. The frame includes an actuator that has a f... | 05/24/2005 |
| 6898084 | Thermal diffusion apparatus An apparatus for operably conveying heat away from a heat source includes a thermally conductive substrate having a thickness defining a planar boundary thereof, and an insert portion disposed in the substrate and being positioned so as not to extend beyond the plan... | 05/24/2005 |
| 6883593 | Heat sink for convection cooling in horizontal applications A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in... | 04/26/2005 |
| 6882535 | Integrated heat spreader with downset edge, and method of making same A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface for fastening the downset edge integrated heat spreader to a mounting s... | 04/19/2005 |
| 6873043 | Electronic assembly having electrically-isolated heat-conductive structure An electronic assembly equipped with a heat-conductive structure, and to a method of conducting heat from a circuit device within such an assembly. The heat-conductive structure comprises an interconnect layer, a contact layer, and an electrically insulating layer b... | 03/29/2005 |
| 6870737 | Cooling system for power conversion device According to the present invention, a power conversion device comprises a plurality of sets of power conversion circuits that convert AC to DC or DC to AC by the switching action of a plurality of semiconductor elements, the semiconductor elements that constitute th... | 03/22/2005 |
| 6867985 | Computer system with noiseless cooling A computer system uses a large heat sink to provide noiseless cooling, thereby avoiding the need for a conventional cooling fan that can be very noisy. The heat sink forms a part of a chassis that contains the motherboard and hard drive of the computer. The motherbo... | 03/15/2005 |
| 6864567 | Base of LED A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an integral negative pole body at an inner side thereof, multiple upright negat... | 03/08/2005 |
| 6865084 | Thermally enhanced semiconductor package with EMI shielding A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate, and a thermally conductive member is stacked on the chip and electric... | 03/08/2005 |
| 6865083 | Clip for heat sink A clip (30) for securing a heat sink (40) to an electronic device (52) includes a pin (32) and a pressing member (34), each of which are integrally formed by stamping sheet metal. The pin includes a cylindrical body having a vertic... | 03/08/2005 |
| 6862183 | Composite fins for heat sinks A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material a... | 03/01/2005 |
| 6849941 | Heat sink and heat spreader assembly A heat sink and heat spreader assembly including a solid member of a conductive material and a layer of a low melting alloy having phase change properties bonded to at least one surface of the solid member such that a welded joint is formed there between possessing ... | 02/01/2005 |
| 6841250 | Thermal management system The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal mana... | 01/11/2005 |
| 6840307 | High performance heat exchange assembly Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins. ... | 01/11/2005 |
| 6835453 | Clean release, phase change thermal interface A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar... | 12/28/2004 |
| 6829146 | Blindmate heat sink assembly An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A hea... | 12/07/2004 |
| 6829145 | Separable hybrid cold plate and heat sink device and method An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials... | 12/07/2004 |
| 6829143 | Heatsink retention apparatus Some disclosed embodiments include a retention apparatus having a unidirectional locking member, the unidirectional locking member defining a bore therethrough, a post disposed through the bore of the unidirectional locking member, wherein the post is adapted to be ... | 12/07/2004 |
| 6826052 | Retaining assembly for heat sink A heat sink retaining assembly includes a retaining module (1) and a pair of clips (3). Two retaining portions (12) are respectively formed on each of two opposite sidewalls (17′) of the retaining module. Bifurcated block portions (1... | 11/30/2004 |
| 6826050 | Heat sink and electronic device with heat sink A heat sink includes a heat receiving part for receiving heat from the outside, a first radiating part, connected to said heat receiving part, which forms a first air channel, and radiates the heat from said heat receiving part using air that passes through the firs... | 11/30/2004 |
| 6822866 | Microdrive An AC drive which can be applied to any power using device and in particular is a medium voltage AC drive. In a preferred embodiment, a multilevel AC drive topology is implemented, with the drive including a plurality of inverters and converter electrically coupled ... | 11/23/2004 |
| 6821625 | Thermal spreader using thermal conduits A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity val... | 11/23/2004 |
| 6819572 | Electromagnetic noise suppression device Briefly, in accordance with one embodiment of the invention, an electromagnetic interference (EMI) reduction device may include a circuit and at least one heatsink. The circuit may include analog devices coupled to reduce EMI signals received by the heatsink. The de... | 11/16/2004 |
| 6819566 | Grounding and thermal dissipation for integrated circuit packages In a microelectronic chip package for which grounding and thermal dissipation is desired, a cover is provided having an opening which is aligned with a contact on the substrate connected to ground potential. The cover is connected to the electronic device and the gr... | 11/16/2004 |
| 6815813 | Self-contained heat sink and a method for fabricating same A system and method are provided for thermal dissipation from a heat producing electronic device. The system includes a substrate for fabricating integrated circuits, the substrate having a first face and a second face. The second face is disposed substantially para... | 11/09/2004 |
| 6813155 | Heat sink clip with interchangeable operating body A heat sink clip includes a main body (20), and an operating body (40) rotatably attached to the main body. The main body includes a central portion (21), and two clipping portions (23) depending from opposite ends thereof. Two mounting p... | 11/02/2004 |
