Bizarre Patents
Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 7030486 | High density integrated circuit package architecture This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circ... | 04/18/2006 |
| 7025122 | Heat sink element coupling structure (2) A heat sink element coupling structure comprised of a “+” or a “+”-shaped horizontal offset disposed on the upper and lower or left and right two sides or a certain position on the lateral edge at the center portion of an L-shaped or a horizontally oriented ... | 04/11/2006 |
| 7027300 | Compact electronics plenum A plenum (12, 60) having a plurality of heat fins (40, 72) and also a receptacle (20) for receiving a heat generating component (22) in a friction fit arrangement. The plenum has a plurality of passageways (14, 66) defined by the p... | 04/11/2006 |
| 7027304 | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and cond... | 04/11/2006 |
| 7026733 | Drive system for a motor vehicle having an electric machine A drive system for a transportation device having an electric machine. The electric machine has a converter unit and a cooling unit with the converter unit being embodied at least partially in the shape of a ring and surrounding the electric machine or components of... | 04/11/2006 |
| 7023089 | Low temperature packaging apparatus and method Some embodiments disclose a low temperature semiconductor packaging apparatus and method. An apparatus generally comprises a heat spreader, a silicon die, and a thermal interface material disposed between the heat spreader and the silicon die comprising a plurality ... | 04/04/2006 |
| 7019996 | Power converter employing a planar transformer A power converter may employ a planar transformer to minimize winding conduction loss, and the switching devices of the power converter may be aligned in lines parallel to an edge of the planar transformer to minimize the termination leakage inductance. The windings... | 03/28/2006 |
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package In one aspect, the present invention relates to a method of manufacturing an integrated circuit package, the method including installing a carrier onto a substrate, attaching a semiconductor die to the substrate, and aligning an assembly over the semiconductor die, ... | 03/21/2006 |
| 7016192 | Electrical power converter method and system employing multiple-output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 03/21/2006 |
| 7012804 | Electronic apparatus having removable circuit board to connect expansion card An electronic apparatus comprises a housing having an outer plate, and a circuit board housed removably in the housing. A fixing part is provided on the outer plate of the housing. The fixing part has a holder piece located inside of the housing farther than the out... | 03/14/2006 |
| 7009844 | Wire form heat sink retention module A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops ... | 03/07/2006 |
| 7002804 | Heat dissipating apparatus A heat dissipating apparatus for an electronic device having an integrated heat spreader is disclosed. The integrated heat spreader is disposed on the electronic device. The electronic device is inserted into a socket. The heat dissipating apparatus includes a base ... | 02/21/2006 |
| 6995981 | Heat sink assembly with combined parallel fins A heat sink assembly includes a heat-conductive base (20), and a plurality of combined fins (30) uprightly attached onto the base. Each fin includes a main body (31), a bottom flange (32) extending from the main body, and two lower abutti... | 02/07/2006 |
| 6992892 | Method and apparatus for efficient temperature control using a contact volume A substrate holder for supporting a substrate, including an exterior supporting surface, a cooling component, a heating component positioned adjacent to the supporting surface and between the supporting surface and the cooling component, and a contact volume positio... | 01/31/2006 |
| 6987672 | Blindmate heat sink assembly An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount the electronic device within the perimeter of the socket. The heat sink... | 01/17/2006 |
| 6985360 | Computer enclosure incorporating expansion card mounting structure A computer enclosure (1) includes a chassis (50), a rear window frame (70), an expansion card seat (10) and a retaining plate (80). The chassis includes a bottom plate (53), a rear plate (52) and a side plate (53 | 01/10/2006 |
| 6980066 | High-frequency module It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-fr... | 12/27/2005 |
| 6977815 | Power adapter with heat sink device A power adapter includes an insulating casing including an enclosing wall and defining a sealing chamber therein, a power transforming unit disposed in the sealing chamber, and a heat sink device including a heat dispersing member supported within the sealing chambe... | 12/20/2005 |
| 6972958 | Multiple integrated circuit package module A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A c... | 12/06/2005 |
| 6972479 | Package with stacked substrates A package having a plurality of stacked substrates is provided. The package has at least two substrates. One substrate is stacked over the other to construct a three-dimensional circuit structure. Elements are disposed on the respective substrates. At least a conduc... | 12/06/2005 |
| 6970356 | Heat sink system A heat sink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly consists of a thermal conducting substrate base with a top and bottom side. Radiating fins are attached to the bottom side of the base. The fins are... | 11/29/2005 |
| 6967844 | Ceramic heat sink with micro-pores structure A ceramic heat sink having a micro-pores structure includes a thermal conductive layer mounted on a surface of a heat source to absorb heat from the heat source, a heat dissipation layer combined with the thermal conductive layer and having a micro-pores structure w... | 11/22/2005 |
| 6967845 | Integrated heat dissipating device with curved fins An integrated heat dissipating device has a heat sink, a first set of fins, a second set of fins and at least one heat pipe. The heat sink has a thermal conductive block embedded therein and a through hole exposing the thermal conductive block from a top surface of ... | 11/22/2005 |
| 6968304 | Calculation of radiation emitted by a computer system The disclosure relates to a method for calculating electromagnetic radiation emitted by a computer system. The method models the characteristic radiation from a central processing unit as a modulated Gaussian pulse. The method solves Maxwell's equation using finite ... | 11/22/2005 |
| 6965515 | Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks A base station for a wireless communications system having a tower-mounted amplifier system with a low-noise amplifier transistor and a thermoelectric cooler that reduces the operating temperature of the low-noise amplifier transistor. The amplifier system has addit... | 11/15/2005 |
| 6965514 | Fluid cooled vehicle drive module An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a... | 11/15/2005 |
| 6958915 | Heat dissipating device for electronic component A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spac... | 10/25/2005 |
| 6958914 | Interlocking heat sink An interlocking heat sink is shaped such that it geometrically mates with an adjacent heat sink such that a linear gap for air flow is not formed between adjacent heat sinks. In multiple processor systems, an interlocking heat sink is associated with each processor.... | 10/25/2005 |
| 6956743 | Electronic component, in particular regulator for generators in motor vehicles An electronic component formed as a regulator for generators in motor vehicles has an IC block arranged on a cooling body, connectors provided with conductors, bond wire connectors connecting the IC block with the conductors, the conductors being provided at first e... | 10/18/2005 |
| 6956446 | Nonreciprocal device having heat transmission arrangement An isolator with resistive termination and carbon steel housing wherein required magnetic performance is combined with improved efficiency of transmission of heat from termination to the heat sink. The improvement is achieved due to the copper/aluminum plug that mec... | 10/18/2005 |
| 6956742 | Compact liquid converter assembly An electronic converter assembly comprising first and second liquid cooled heat sink members, each sink member having at least one sink mounting surface, first and second pluralities of power switching devices, each switching device including connection terminals, t... | 10/18/2005 |
| 6952347 | Power module A power module is suggested having a simple and cost-effective arrangement and ensuring a reliable operation. To this end, a circuit arrangement comprising at least one electronic component is arranged on a carrier body. A conductor pattern is formed on the top side... | 10/04/2005 |
| 6950307 | Fastening structure for a heat sink The present invention herein relates to fastening structure for a heat sink to provide a fastening structure easy and convenient both for assembling and disassembling operation, characterized by fastening structure being a material of elasticity comprising a control... | 09/27/2005 |
| 6944025 | EMI shielding apparatus An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed depending skirt, and a conductive, compressible polymer is applied t... | 09/13/2005 |
| 6940721 | Thermal interface structure for placement between a microelectronic component package and heat sink A multi-layer thermal interface structure for placement between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W. The structure comprises a plurality of super... | 09/06/2005 |
| 6940723 | Heat spreader for optical transceiver components An optical transceiver module having improved heat dissipation characteristics is disclosed. The transceiver includes a transmitter optical subassembly (“TOSA”), comprising a hermetically sealed housing penetrated by a component platform that includes interior a... | 09/06/2005 |
| 6939742 | Thermal gap control A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the... | 09/06/2005 |
| 6940720 | Integrated circuit having a thermally shielded electric resistor trace An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on ... | 09/06/2005 |
| 6938681 | Heat pipe type heat dissipation device A heat dissipation device includes a base (10), a post (20), a plurality of fins (50), a pair of heat pipes (30) and a pair of plates (40). The base is for contacting an electronic component. Each fin defines an aperture (52... | 09/06/2005 |
| 6940722 | Heat-dissipating member, manufacturing method and installation method A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic c... | 09/06/2005 |
