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| Number | Title | Issue Date |
| 7121326 | Heat sink A heat sink comprises a plurality of stacked fins being combined. Each fin comprises a plate body with two pairs of locking structures formed symmetrically on two opposite edges of the plate body. Each locking structure comprises an interval part extending integrate... | 10/17/2006 |
| 7121327 | Heat sink assembly A heat sink assembly includes a plurality of fins (10), a pair of ducts (20), and a frame (30) receiving the fins and the ducts therein. Each fin defines a pair of through holes (11) therein. A tapered tab (14) and a plurality of l... | 10/17/2006 |
| 7123482 | Levers for support of heatsink component An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component. ... | 10/17/2006 |
| 7117930 | Heat pipe fin stack with extruded base A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the ... | 10/10/2006 |
| 7116021 | Bridge rectifier for charging system alternator A charging system includes an alternator body, rotor coil and stator windings. A bridge rectifier is positioned within the alternator body and connected to the stator windings for rectifying the electrical output from the stator windings. The rectifier includes a po... | 10/03/2006 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. I... | 10/03/2006 |
| 7113406 | Methods and apparatus for fastening a set of heatsinks to a circuit board A circuit board module has a circuit board which includes a circuit board structure and a set of components mounted to the circuit board structure. The circuit board module further includes a set of heatsinks (i.e., one or more heatsinks) and a heatsink retaining as... | 09/26/2006 |
| 7106589 | Heat sink, assembly, and method of making A heat sink, method of making a heat sink, and a heat sink assembly. The heat sink includes a base and a plurality of heat pipes that extend from the base. The base is dimensioned and shaped to promote good thermal contact with the heat source, and the heat pipes ar... | 09/12/2006 |
| 7104311 | Heat sink assembly A heat sink assembly formed of a number of radiation fins arranged in a stack, each radiation fin having two mounting flanges arranged in parallel at two opposite sides, each mounting flange having a dovetail mounting hole on the middle and a dovetail bottom mountin... | 09/12/2006 |
| 7106593 | Heat sink assembly for a potted housing The present invention includes a heat sink assembly within a potted housing and a method for transferring heat within a potted housing. The heat sink assembly includes a bracket, a heat-containing element, and a self-tapping screw operatively arranged to engage the ... | 09/12/2006 |
| 7100281 | Heat sink and method of making the same A method for manufacturing a heat sink including heating a metal base to melt solder in grooves formed in the base. The base has a first coefficient of thermal expansion. The solder has a second coefficient of thermal expansion lower than the first coefficient of th... | 09/05/2006 |
| 7093648 | Heat pipe cooling device and method for manufacturing the same A heat pipe cooling device includes a heat conductor base, heat pipes and a cooling body. The heat conductor base further includes a base with multiple trenches and an upper cover. The heat pipes include a heat reception end and a cooling end. When the heat receptio... | 08/22/2006 |
| 7095612 | Cooled electrical terminal assembly and device incorporating same A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid ... | 08/22/2006 |
| 7085135 | Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component su... | 08/01/2006 |
| 7072184 | Heat sink attachment A new heat sink apparatus and method that simplify the assembly of the heat sink and thermal stud. The new heat sink assembly uses a spring retainer that, in most cases, can use existing socket mounting screws. A spring clip (202) presses a thermal stud (2... | 07/04/2006 |
| 7067905 | Packaged microelectronic devices including first and second casings The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to either a fi... | 06/27/2006 |
| 7068512 | Heat dissipation device incorporating with protective cover A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom face fo the base, a plurality of fin stacked along the body above the ba... | 06/27/2006 |
| 7068515 | Multi-chip module with stacked redundant power Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for provi... | 06/27/2006 |
| 7064428 | Wafer-level package structure A wafer-level package structure, applicable to a flip-chip arrangement on a carrier, which comprises a plurality of contact points, is described. This wafer-level package structure is mainly formed with a chip and a conductive layer. The conductive layer is arranged... | 06/20/2006 |
| 7064955 | Redundant power for processor circuit board One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipat... | 06/20/2006 |
| 7064957 | Methods and apparatus for securing a heat sink to a circuit board component A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the ... | 06/20/2006 |
| 7061775 | Power converter having improved EMI shielding EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits th... | 06/13/2006 |
| 7061119 | Tape attachment chip-on-board assemblies An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a corresponding semiconductor substrate surface by providing an adhesive ta... | 06/13/2006 |
| 7061773 | Electronic apparatus and shielding module thereof A shielding module is used for shielding an electrical device. In this case, the shielding module includes a heat-dissipating component, a casing and a connection component. The heat-dissipating component has a contacting portion to contact with the electrical devic... | 06/13/2006 |
| 7061361 | Circuit board assembly and flat coil A circuit board assembly has a flat coil element mounted on a circuit board so that an electric power loss is not generated even when the flat coil element is mounted to the circuit board together with a circuit part having a large heat sink. A module mounted on the... | 06/13/2006 |
| 7056144 | Offset compensation system A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector ... | 06/06/2006 |
| 7049688 | Semiconductor device having a pair of heat sinks and method for manufacturing the same A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold for molding the heater element and the first and second heat sinks. ... | 05/23/2006 |
| 7050287 | Sign ballast capacitor assembly A high voltage sign ballast capacitor assembly is disclosed. The assembly includes two components for the sign ballast operation, namely a main capacitor element for power factor correction and up to six starting capacitors for aiding in starting under cold weather ... | 05/23/2006 |
| 7050302 | Captive socket actuator Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket. ... | 05/23/2006 |
| 7047637 | Method of manufacture of ceramic composite wiring structures for semiconductor devices Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ce... | 05/23/2006 |
| 7044197 | Heat sink with combined fins A heat sink (1) includes a heat-conductive base (20), and a plurality of combined fins (10) uprightly attached onto the base. Each fin includes a main body (12), and a flange (14) extending perpendicularly from the main body. A pai... | 05/16/2006 |
| 7046520 | Electronic assemblies having supports for circuit boards An electronic assembly apparatus is provided which has a chassis for housing at least one circuit board. The circuit board has at least one major surface. The chassis has at least one wall juxtapositioned along at least a portion of the major surface of the circuit ... | 05/16/2006 |
| 7047192 | Simultaneous multi-user real-time speech recognition system This invention is a combination of software and hardware components and methodologies that enable speech recognition for multiple users simultaneously. It introduces the concept of a “conversational voice log” and how voice logs are combined to represent the spo... | 05/16/2006 |
| 7038913 | Heat dissipation assembly including heat sink and fan A heat dissipation assembly includes a heat sink (100), a fan (200) and a fan holder (300). The heat sink includes a plurality of fins (110) and defines a groove (122) in the fins at a base end thereof. The holder includes a bracke... | 05/02/2006 |
| 7035107 | High serviceability heatsink retainer method and apparatus A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the... | 04/25/2006 |
| 7035106 | Heat dissipation system for semiconductor device A heat dissipation system for a semiconductor device having a plurality of semiconductor chips, includes a heat dissipation member which cools the semiconductor chips, an exterior heat dissipation member which is provided opposite to the heat dissipation member, eng... | 04/25/2006 |
| 7032650 | Cooling fin set A cooling fin set, which is disposed on a heat source of a computer, includes a plurality of cooling fins. Each cooling fin includes some fastening portions formed thereon. The fastening portions are folded from the outer periphery of the cooling fin to form a folde... | 04/25/2006 |
| 7032695 | Vehicle drive module having improved terminal design A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in re... | 04/25/2006 |
| 7028753 | Apparatus to enhance cooling of electronic device An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantit... | 04/18/2006 |
| 7030484 | Lidless chip package effectively having co-planar frame and semiconductor die surfaces A “lidless” integrated circuit package includes a support member that is arranged to support at least part of a load placed on the integrated circuit package. The support member has or is connected to a flexible support device that is in supportive contact with ... | 04/18/2006 |
