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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 7187552 | Self-installing heat sink A circuit board assembly may include a heat sink that couples with a surface a circuit module installed on the circuit board. The heat sink may automatically couple to the surface of the circuit module when the circuit module is installed on the circuit board. The h... | 03/06/2007 |
| 7180743 | Fastener for heat sink A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board ( | 02/20/2007 |
| 7180746 | Retaining device for heat sink A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing ... | 02/20/2007 |
| 7177156 | Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device in accordance with one aspect of the invention includes an electron... | 02/13/2007 |
| 7177154 | Computer Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating comp... | 02/13/2007 |
| 7174955 | Heat sink A heat sink (10) includes a plurality of fins (12) joined with each other. In one embodiment, each fin includes a main body (13) with an elongated flange (14) and two shortened flanges (16) extending from each of two opposite sides... | 02/13/2007 |
| 7177153 | Vehicle drive module having improved cooling configuration An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as bet... | 02/13/2007 |
| 7172711 | Interface materials and methods of production and use thereof An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as... | 02/06/2007 |
| 7170748 | Heat sink assembly for integrated circuits having a slidable contact capability with a mounting member portion of an electronic equipment chassis The heat sink assembly includes a heat sink member with a body portion and an upper mounting portion. The heat sink member is connected to an integrated circuit on a printed circuit board assembly. A resilient mounting assembly is positioned on the mounting portion ... | 01/30/2007 |
| 7165602 | Heat sink structure The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce t... | 01/23/2007 |
| 7165601 | Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device Each of fins is provided with an engage projection having a first width and a engage hole portion having a second width wider than the first width, and the fins are able to be slid while engaging with each other. Accordingly, in case of installing a heat sink to a c... | 01/23/2007 |
| 7163049 | Cooling fin assembly A cooling fin assembly (10) includes a plurality of cooling fins (10a) joined together. Each of the cooling fins includes a main body (11a) forming four engaging members (14a) at four corners thereof respectively. Eac... | 01/16/2007 |
| 7164587 | Integral heatsink grounding arrangement An electromagnetic (EM) shielding assembly shields an electronic component mounted on a circuit board. The assembly includes a shielding portion that is electrically conductive and can be mounted adjacent an electronic component that it is desired shield. The shield... | 01/16/2007 |
| 7164584 | Modular heatsink, electromagnetic device incorporating a modular heatsink and method of cooling an electromagnetic device using a modular heatsink An electromagnetic device (10) includes a core (12) having first and second arms (16, 18) connected by at least one body (14), a first winding (40) having multiple turns (41a, 41b) on the first arm (1... | 01/16/2007 |
| 7161806 | Heat sink and method for its production The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present inventio... | 01/09/2007 |
| 7161808 | Retaining heat sinks on printed circuit boards A heat sink assembly may be plugged into a receiving element in a printed circuit board. A retention element includes upper and lower portions. The lower portion may be plug locked onto a printed circuit board. The upper portion then telescopes into and releaseably ... | 01/09/2007 |
| 7161091 | Interference-shielded mobile station and corresponding method and arrangement in the interference shielding of a mobile station The invention relates to an interference-shielded mobile station (10), which includes a circuit board (11), a shield (12), and electrically conductive securing members (13), separate from the shield (12), for attaching the shield (... | 01/09/2007 |
| 7158381 | Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink... | 01/02/2007 |
| 7156158 | Heat pipe type cooler To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a... | 01/02/2007 |
| 7151670 | Digital micromirror device mounting system A projection device is provided, wherein the projection device includes a digital micromirror device, a circuit board that further includes a first face and a second face, an integrated heat sink/stiffener; and a plurality of engagement mechanisms, wherein the plura... | 12/19/2006 |
| 7144762 | Semiconductor device with pins and method of assembling the semiconductor device A semiconductor device includes a substrate having a semiconductor element mounted thereon, and a heat sink. A plurality of pins are inserted in holes in the heat sink and holes in the substrate to secure the heat sink to the substrate. The pin has an enlarged porti... | 12/05/2006 |
| 7145223 | Semiconductor device The semiconductor device of this invention includes a first die pad down-set away from boundary portions between inner lead portions and outer lead portions; a first semiconductor chip mounted on the first die pad; a chip-shaped electronic component with a small thi... | 12/05/2006 |
| 7143819 | Heat sink with angled heat pipe A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to th... | 12/05/2006 |
| 7142428 | Locking heatsink apparatus A heatsink is provided for cooling power components on a printed circuit board. The heatsink includes a slot so that it is placed over the power device to be cooled. An activating member may be inserted from the opposite side of the printed circuit board and fastene... | 11/28/2006 |
| 7141994 | Air socket for testing integrated circuits An electrical component testing device comprising a housing having at least one recess covered by a flexible membrane so as to form a chamber. A fluid passage extends through a portion of the housing and connects to the chamber thus permitting passage of a fluid mat... | 11/28/2006 |
| 7142422 | Heat dissipation device A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a... | 11/28/2006 |
| 7142424 | Heat exchanger including flow straightening fins A heat exchanger includes a tube, and a plurality of fins coupled to the tube having a curved fan-stator shape that facilitates straightening of airflow from a fan. ... | 11/28/2006 |
| 7142429 | Heat sink and retaining clip assembly Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a he... | 11/28/2006 |
| 7142434 | Vehicle drive module having improved EMI shielding EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in remov... | 11/28/2006 |
| 7139174 | Techniques for attaching a heat sink assembly to a circuit board component A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between... | 11/21/2006 |
| 7139171 | Heat dissipation device A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part incl... | 11/21/2006 |
| 7134311 | Device and method for fabricating lead frame by press forming A device for fabricating a lead frame, by press forming, provided with a die having a flat face, on which a lead frame to be fabricated by press forming is to be placed, and a concavity, which is dented relative to the flat face, the die possessing a fabricating fac... | 11/14/2006 |
| 7133286 | Method and apparatus for sealing a liquid cooled electronic device A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate,... | 11/07/2006 |
| 7133288 | Processor heat sink retention module and assembly A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and... | 11/07/2006 |
| 7133705 | Portable power amplifier A portable power amplifier includes portable encapsulating cases, a printed board incorporated in those encapsulating cases, and a power amplifying device mounted on this printed board. An antenna switch and an antenna are provided near the power amplifying device, ... | 11/07/2006 |
| 7133284 | Power supply without cooling fan The invention provides a power supply for a computer mainframe, which is cooled by a heat conduction method, and more particularly to a power supply without a cooling fan. The present invention features a highly effective heat pipe connecting a plurality of aluminum... | 11/07/2006 |
| 7128135 | Cooling device using multiple fans and heat sinks The present invention is directed to a method of constructing a semiconductor chip cooling device consists of multiple fans and heat sinks to provide redundant cooling capability. Heat coming from a semiconductor chip is first distributed to several heat sinks using... | 10/31/2006 |
| 7126825 | Combined chip/heat-dissipating metal plate and method for manufacturing the same A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Pre... | 10/24/2006 |
| 7125754 | Semiconductor device and its manufacturing method The present invention has an object of providing a thyristor-type semiconductor device and a manufacturing method for the same which can prevent, even when conventional manufacturing equipment is used, the electrode terminals 13, 14 from being provided in a s... | 10/24/2006 |
| 7123483 | Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan A heat sink fan includes a heat sink (2) that is placed on a heat generating electrical component and a fan motor unit (4) having an axial flow fan (18) for supplying cooling air to the heat sink (2). A engaging portions (14a | 10/17/2006 |
