Did You Know...
...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 7269013 | Heat dissipation device having phase-changeable medium therein A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a pe... | 09/11/2007 |
| 7269010 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on tw... | 09/11/2007 |
| 7269016 | Heat dissipating device A heat dissipating device includes a heat sink and a clip attached on the heat sink. The heat sink includes a solid trunk and a plurality of fins extending radially outwardly from a circumference of the trunk. A rectangular extension portion is formed at a bottom en... | 09/11/2007 |
| 7269014 | Heat dissipation device A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spread... | 09/11/2007 |
| 7265984 | Heat dissipation device for electronic equipment A heat sink is attached to fixing plates of a shield case. When a circuit board is covered by the shield case, the heat sink comes into contact with a circuit component mounted on the circuit board through a heat conduction sheet. Further, clearance holes, which are... | 09/04/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7262444 | Power semiconductor packaging method and structure A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has o... | 08/28/2007 |
| 7259446 | Heat sink packaging assembly for electronic components A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base boa... | 08/21/2007 |
| 7256994 | Power supply apparatus An opening is formed in a case. Air is caused to flow through the interior of the case. A panel closes the opening. A printed circuit board is disposed behind the panel within the case. A plurality of components, including a control device which can be operated on t... | 08/14/2007 |
| 7256997 | Heat dissipating device having a fan duct A heat dissipating device (8) for cooling a number of electronic devices. The heat dissipating device includes a heat sink (7), a fan (6) mounted to a side of the heat sink and a fan duct (5). The heat sink includes a heat spreader (70... | 08/14/2007 |
| 7251134 | Extended fin array An extended fin array has a main heat-dissipation module and an extended heat-dissipation module. The main heat-dissipation module and the extended heat-dissipation module are stacked to increase the effective convective area to increase the heat-dissipation effect.... | 07/31/2007 |
| 7243413 | Fixing tool for quickly setting up a secure device A fixing tool for quickly setting up a secure device with an engaging member and a secure unit is used for mounting the secure device to an electronic component. The fixing tool includes a main member, a driving member with an extending part pivotally connected to t... | 07/17/2007 |
| 7243704 | Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end A mechanical assembly, for regulating the temperature of an electronic device, includes a gimbal and a heat-exchanger which is attached to the gimbal. The gimbal includes a base member, a carrier member, and a spring which has—1) a first end with a rigid coupling ... | 07/17/2007 |
| 7245492 | Heat-dissipating module and structure thereof A heat-dissipating structure. The heat-dissipating structure comprises a plurality of first and second conductive plates. Each first conductive plate has a first base surface, a first reference surface and a first main disturbing portion disposed on the first base s... | 07/17/2007 |
| 7245137 | Test head assembly having paired contact structures A test head assembly can include a probe card, which can include first contact areas. The test head assembly can also include a contactor, which can include second contact areas. An interposer can include first spring contact structures and second spring contact str... | 07/17/2007 |
| 7245488 | Fan fasten device and electrical apparatus with the same A fan fasten device is for fixing at least one fan. The fan fasten device includes a chassis and a fastener. At least one fixing portion is set on the chassis, and at least one end of the fastener is connected with the fixing portion. ... | 07/17/2007 |
| 7242583 | System for loading a heat sink mechanism independently of clamping load on electrical device A system for coupling a heat sink to an electrical device independently of a clamping member that is used to place a coupling force between the electrical device and a substrate to which the electrical device is to be electrically connected. The system includes a cl... | 07/10/2007 |
| 7239039 | Electronic switching module The present invention relates to an electronic switching module that can directly be mounted without any modifications, instead of the electromagnetic DC relays used in various vehicles. The electronic switching module (15) consists of a plastic casing (1 | 07/03/2007 |
| 7239515 | Thermal assembly for cooling an electronics module A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat g... | 07/03/2007 |
| 7236366 | High brightness LED apparatus with an integrated heat sink A high brightness LED apparatus with an integrated heat sink includes a heat sink base and at least one LED mounted in the heat sink base. The heat sink base includes multiple dissipating fins formed integrally on the substrate. Each of the at least one LED includes... | 06/26/2007 |
| 7232332 | Support and grounding structure Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and... | 06/19/2007 |
| 7228889 | Heat dissipation device A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting d... | 06/12/2007 |
| 7227752 | Heat dissipation device A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the bas... | 06/05/2007 |
| 7227750 | Heat dissipating pin structure for mitigation of LED temperature rise A heat-dissipating pin structure for mitigation of LED temperature rise, characterized in that: on metallic foil circuit or foil surfaced of PCB connecting to joining surface of LED chip, on which LED chips or light-emitting diodes of surface-mounting type or light-... | 06/05/2007 |
| 7224072 | Mounting structure for ball grid array type IC A mounting structure of a ball grid array type IC includes resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC, engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board, springs ... | 05/29/2007 |
| 7224058 | Integrated circuit package employing a heat-spreader member An integrated circuit package is proposed in which a laminar substrate 41 is provided with an aperture 43. A heat-spreader member 1 is mounted to cover this aperture 43, and contains a cavity 3 opening towards the aperture 43 | 05/29/2007 |
| 7218522 | Heat dissipating device A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins... | 05/15/2007 |
| 7218128 | Method and apparatus for locating and testing a chip A probe apparatus includes a nest element operable to precisely locate a chip having a plurality of exposed interconnects on a face of the chip to permit conductive connection to the chip through the interconnects. The nest element includes a pocket dimensioned to l... | 05/15/2007 |
| 7215551 | Memory module assembly including heat sink attached to integrated circuits by adhesive A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory dev... | 05/08/2007 |
| 7212407 | Electrical power converter method and system employing multiple output converters A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI ... | 05/01/2007 |
| 7209360 | Leak-tight system for boxes containing electrical and electronic components The system consists of fixing the printed circuit board (3) to the bottom (1) of the body of the box with the cooperation of a perimetral and spacing flap (6) which creates a chamber (7) under the board (3), in which the components... | 04/24/2007 |
| 7207105 | Method for producing an integral ceramic circuit board A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to... | 04/24/2007 |
| 7204615 | LED light with active cooling An LED light assembly includes a housing, an LED disposed in the housing, a heat dissipating structure and a fluid current generator. The LED is in thermal communication with the heat dissipating structure and includes a flow path surface. The fluid current generato... | 04/17/2007 |
| 7203072 | Heat dissipating structure and semiconductor package with the same A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a suppo... | 04/10/2007 |
| 7203065 | Heatsink assembly A heatsink assembly is disclosed that includes a holder slidably engaging a circuit board component to be cooled and a heatsink secured to the heatsink holder. A method of cooling a circuit board component is also disclosed that involves the steps of providing a bra... | 04/10/2007 |
| 7202559 | Method of assembling a ball grid array package with patterned stiffener layer Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. An IC die is mounted in a centrally located cavity of a substantially planar first surface of a stiffener. The first surface of a substrate is attached to a substantiall... | 04/10/2007 |
| 7190588 | Heat-dissipating fin assembly for heat sink A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the ma... | 03/13/2007 |
| 7188418 | Method of making split fin heat sink A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core. ... | 03/13/2007 |
| 7187568 | Power converter having improved terminal structure A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat fr... | 03/06/2007 |
| 7187548 | Power converter having improved fluid cooling A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting... | 03/06/2007 |
